Drilling method for mother board of circuit board

A drilling method and technology of board and motherboard, applied in the direction of printed circuit, printed circuit manufacturing, chemical instruments and methods, etc., can solve the problems of poor heat dissipation in drilling holes with broken drill needles, back drilling blocking holes, poor effect of removing drilling contamination, etc. , to avoid the problem of drill needle breakage, improve cleanliness, and achieve good effects in removing drill dirt

Inactive Publication Date: 2021-07-20
丰顺县和生电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, the common drilling method is prone to the problem of back drilling and blocking holes due to the difficulty of copper wire and rubber slag removal, which increases the problems of broken drill needles and poor heat dissipation in drilling, and the effect of removing drill dirt is poor.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] A kind of drilling method of circuit board motherboard, the drilling method of described circuit board motherboard comprises the following steps:

[0027] S1: After choosing a copper-free motherboard, first carry out cutting and cutting of the motherboard, and use a backing plate to reduce board edge burrs and copper scraps; confirm that the thickness of the cutting is 0.1mm; after step S1 cutting, the motherboard needs to be cut Baking plate, at this time, the temperature of the baking plate is controlled at 170°C, and the time of the baking plate is controlled at 4 hours;

[0028] S2: Carry out LDI exposure to the motherboard that has been cut in step S1, the exposure ruler is 7 grids, the exposure energy is 45mJ, and the two kinds of sheets are produced separately; the line width of the motherboard is tested for the first time, and the product after confirming qualified production;

[0029] S3: Start to drill the outer layer of the motherboard; adopt the non-clamping...

Embodiment 2

[0037] A kind of drilling method of circuit board motherboard, the drilling method of described circuit board motherboard comprises the following steps:

[0038] S1: After choosing a copper-free motherboard, first carry out cutting and cutting of the motherboard, and use a backing plate to reduce board edge burrs and copper scraps; confirm that the thickness of the cutting is 0.13mm; after step S1 cutting, the motherboard needs to be cut Baking plate, at this time, the temperature of the baking plate is controlled at 165°C, and the time of the baking plate is controlled at 3.5 hours;

[0039]S2: Carry out LDI exposure to the motherboard that has been cut in step S1, the exposure ruler is 7 grids, the exposure energy is 45mJ, and the two kinds of sheets are produced separately; the line width of the motherboard is tested for the first time, and the product after confirming qualified production;

[0040] S3: Start to drill the outer layer of the motherboard; adopt the non-clampi...

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PUM

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Abstract

The invention discloses a drilling method for a mother board of a circuit board. According to the method, after drilling is completed every time, drilling dirt can be more effectively discharged out of the hole, the hole blocking phenomenon caused by excessive accumulation of the drilling dirt is avoided, the heat dissipation efficiency of the inner-layer thick copper drill hole can be improved, the bad problems that the roughness in the hole is too large due to too large heat and the like are solved, and meanwhile the problem that a drill point is broken is solved; the tool retracting speed is correspondingly reduced to 320 mm/s, so that the smoothness of the wall of the drilled hole is improved; a segmented drilling method which is the same as a back drilling method is adopted, so that the heat dissipation efficiency of drilling is effectively improved; in the plasma chemical reaction, particles playing a chemical role are mainly positive ion and free radical particles, the effect on different materials is uniform, and the drilling dirt removing effect is good. Through testing, the working environment in the drilling process is clean and tidy, stains are reduced, and the tidiness in the mother board drilling process is improved.

Description

technical field [0001] The invention belongs to the technical field of circuit board production, in particular to a drilling method for a circuit board motherboard. Background technique [0002] Motherboard, also known as system board, or motherboard, is one of the most basic and important components of a computer. It plays a pivotal role in the entire computer system. The manufacturing quality of the motherboard determines the stability of the hardware system. The motherboard is generally a rectangular circuit board on which the main circuit systems that make up the computer are installed. Generally, there are BIOS chips, I / O control chips, keyboard and panel control switch interfaces, and instructions. Components such as light connectors, expansion slots, motherboards and DC power supply connectors for plug-in cards, etc., the motherboard needs to be drilled during production. [0003] However, the common drilling method is prone to the problem of back drilling and block...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00B08B7/00
CPCH05K3/0047H05K3/0055B08B7/00H05K2203/095
Inventor 刘裕和
Owner 丰顺县和生电子有限公司
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