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Photosensitive resin composition

A technology of photosensitive resin and composition, applied in the field of photosensitive resin composition, can solve the problem of insufficient thermal shock resistance of insulating protective film, and achieve excellent thermal shock resistance, excellent solder heat resistance, and crack prevention. Effect

Pending Publication Date: 2021-07-27
TAMURA KK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in Patent Document 1, there is a problem that the thermal shock resistance for preventing deterioration of the insulating protective film due to thermal history and thermal load is insufficient.

Method used

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  • Photosensitive resin composition

Examples

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Comparison scheme
Effect test

Embodiment 1～8、 comparative example 1～2

[0083]The components shown in the following Table 1 are blended in the compounding ratio shown in the following Table 1, and they are mixed and dispersed at room temperature with a triple roller, thereby preparing the compounds in Examples 1 to 8 and Comparative Examples 1 to 2. The photosensitive resin composition used. And the prepared photosensitive resin composition was apply|coated as follows, and the test sample was produced. Unless otherwise specified, the figures of the compounding quantity in following Table 1 represent a mass part. In addition, blank columns in the following Table 1 indicate non-combination.

[0084] In addition, the detail of each component in following Table 1 is as follows.

[0085] ・RIPOXY SP-4621: A polyacid-modified ring with a structure obtained by reacting acrylic acid with at least a part of the epoxy groups of a cresol novolak-type epoxy resin to obtain epoxy acrylate, and reacting a polybasic acid with the generated hydroxyl group Oxyac...

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Abstract

The invention provides a photosensitive resin composition capable of forming a photocured product having excellent thermal shock resistance without impairing basic characteristics such as solder heat resistance, alkali developability, and coating appearance. The photosensitive resin composition contains (A) a carboxyl group-containing photosensitive resin, (B) an elastomer, (C) a photopolymerization initiator, (D) a reactive diluent, and (E) an epoxy compound. The (B) elastomer contains (b) a telechelic polymer.

Description

technical field [0001] The present invention relates to a photosensitive resin composition, in particular to a photosensitive resin composition useful as an insulating coating for circuit boards such as printed wiring boards, and a photosensitive resin composition having a coating obtained by photocuring the photosensitive resin composition. printed circuit board. Background technique [0002] In order to form a pattern of a conductive circuit on a substrate and mount electronic components on the soldering pads of the circuit pattern by soldering, a circuit board such as a printed wiring board is used, and a solder resist film as an insulating protective film is used to cover the soldering pads other than the soldering pads. part of the circuit covered. This prevents solder from adhering to unnecessary parts when soldering electronic components to circuit boards such as printed wiring boards, and prevents conductive circuits from being corroded by oxidation and humidity due...

Claims

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Application Information

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IPC IPC(8): G03F7/027G03F7/004G03F7/09
CPCG03F7/027G03F7/004G03F7/09
Inventor 津留纮树藤井俊树
Owner TAMURA KK