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Surface acoustic wave device and manufacturing method thereof

A technology of surface acoustic wave devices and manufacturing methods, which is applied to electrical components, impedance networks, etc., can solve the problems of narrow packaging process options and high manufacturing costs, and achieve the effects of low frequency temperature coefficient, reduced packaging costs, and improved heat dissipation performance

Pending Publication Date: 2021-07-27
HANGZHOU SAPPLAND MICROELECTRONICS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, in the related art, since the inductor is integrated into the surface acoustic wave device during the packaging process, its production cost is high, and the selection of packaging technology is narrow.

Method used

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  • Surface acoustic wave device and manufacturing method thereof
  • Surface acoustic wave device and manufacturing method thereof
  • Surface acoustic wave device and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0041] Embodiment 1: as figure 1 , 2 As shown, SAW devices include:

[0042] Piezoelectric substrate 1;

[0043] an interdigital transducer 2, arranged on the piezoelectric substrate 1;

[0044] a dielectric layer 3, which is disposed on the piezoelectric substrate 1 and at least partially covers the interdigital transducer 2;

[0045] An inductor 4, which is arranged on or in the dielectric layer 3;

[0046] The inductor 4 is located above the IDT 2 and avoids the working area of ​​the IDT 2 .

[0047] Wherein, the piezoelectric substrate may be lithium tantalate (LT), lithium niobate (LN), quartz, lanthanum gallium silicate (LGS) and other materials. figure 1 For the inductor to be set in the dielectric layer, figure 2The inductor is arranged on the dielectric layer. The working area of ​​the IDT refers to the vibration-energy conversion area of ​​the IDT (that is, the area on the surface of the piezoelectric substrate that is in contact with the interdigital electro...

Embodiment 2

[0053] Embodiment 2: as Figure 4 , 5 As shown, SAW devices include:

[0054] Piezoelectric substrate 1;

[0055] an interdigital transducer 2, arranged on the piezoelectric substrate 1;

[0056] a dielectric layer 3, which is disposed on the piezoelectric substrate 1 and does not cover the IDT 2;

[0057] An inductor 4, which is arranged on or in the dielectric layer 3;

[0058] The inductor 4 is located above the IDT 2 and avoids the working area of ​​the IDT 2 .

[0059] Wherein, the piezoelectric substrate may be lithium tantalate (LT), lithium niobate (LN), quartz, lanthanum gallium silicate (LGS) and other materials. figure 1 For the inductor to be set in the dielectric layer, figure 2 The inductor is arranged on the dielectric layer. Figure 4 for the inductance provided in the dielectric layer, Figure 5 The inductor is arranged on the dielectric layer. The fact that the inductor is located above the IDT means that the inductor is located higher than the IDT....

Embodiment 3

[0066] Embodiment 3: as figure 1 , 2 , 6, the surface acoustic wave device manufacturing method includes the following steps:

[0067] Prepare a piezoelectric substrate 1, and fabricate an interdigital transducer 2 on the piezoelectric substrate 1;

[0068] Fabricating a dielectric layer 3 on the piezoelectric substrate 1, the dielectric layer 3 at least partially covers the IDT 2;

[0069] Make inductor 4 (as figure 2 shown), or make an inductance 4 in the dielectric layer 3 avoiding the working area of ​​the interdigital transducer 2 (such as figure 1 shown).

[0070] Wherein, the making of the interdigital transducer can specifically prepare a metal coating on a piezoelectric substrate, and pattern the metal coating to form an interdigital electrode; wherein, the patterning can be a general semiconductor etching process, and the The width of the interdigitated electrodes can be preset as required, and there is no limitation here. The working area of ​​the IDT refers ...

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Abstract

The invention discloses a surface acoustic wave device. The device comprises a piezoelectric substrate, an interdigital transducer arranged on the piezoelectric substrate, a dielectric layer arranged on the piezoelectric substrate and not covering or at least partially covering the interdigital transducer, and an inductor arranged on or in the dielectric layer, positioned above the interdigital transducer and avoiding the working area of the interdigital transducer. The invention further discloses a manufacturing method of the surface acoustic wave device. According to the method, the inductor is directly manufactured in the previous procedure, LTCC (Low Temperature Co-Fired Ceramic) packaging is not needed, the packaging cost of the surface acoustic wave device is reduced, and more choices are provided for the next procedure.

Description

technical field [0001] The invention belongs to the technical field of surface acoustic wave, and in particular relates to a surface acoustic wave device and a manufacturing method thereof. Background technique [0002] The process of manufacturing surface acoustic wave (SAW) devices in the related art is divided into front-end and back-end. Among them, the previous process is mainly the preparation of the device, including the deposition of the piezoelectric layer, the preparation of the interdigital transducer (IDT) on the upper surface of the piezoelectric layer, and the preparation of the interdigital transducer during the preparation of TC-SAW. temperature compensation layer. The latter refers to the packaging of the above-mentioned devices, and the packaging can be LTCC packaging (or HTCC packaging, etc.). Among them, LTCC mainly refers to low temperature co-fired ceramics (Low Temperature Co-fired Ceramic, LTCC), which is an integrated component technology developed...

Claims

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Application Information

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IPC IPC(8): H03H9/02H03H3/02
CPCH03H9/02661H03H3/02H03H2003/026
Inventor 郑根林牛玉娇张树民
Owner HANGZHOU SAPPLAND MICROELECTRONICS TECH CO LTD
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