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Thermoplastic copper-clad plate and preparation method thereof

A copper clad laminate and thermoplastic technology, applied in the field of high-frequency circuit board substrates, can solve the problem that copper clad laminates are difficult to meet the Z-axis expansion coefficient requirements, and achieve excellent mechanical properties and thermal stability, excellent dielectric stability, good uniformity. The effect of qualitative properties

Pending Publication Date: 2021-08-03
苏州硕贝德创新技术研究有限公司
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Problems solved by technology

[0005] This application provides a thermoplastic copper-clad laminate and its preparation method to solve the problem that the copper-clad laminate obtained by impregnating continuous glass fiber cloth with existing dielectric materials is difficult to meet the requirements of the Z-axis expansion coefficient

Method used

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  • Thermoplastic copper-clad plate and preparation method thereof
  • Thermoplastic copper-clad plate and preparation method thereof
  • Thermoplastic copper-clad plate and preparation method thereof

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Embodiment Construction

[0030] The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, not all of them. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of this application.

[0031] In the existing impregnation process, if hydrocarbon resin is selected as the dielectric material, the high-frequency substrate of the copper clad laminate obtained can improve the Z-axis expansion coefficient very well, and provide extremely low DK (dielectric constant) and DF (dielectric loss), but At present, manufacturers with the above technical capabilities and mass production and commercialization are mainly American Rogers and Isola, and the c...

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Abstract

The invention provides a thermoplastic copper-clad plate and a preparation method thereof. The method comprises the following steps of: taking pure water, ethanol and a silane coupling agent as dispersion media, adding an inorganic filler, short glass fibers and talcum powder, stirring at a high speed, filtering, and drying to prepare a modified inorganic filler; mixing, extruding and granulating the modified inorganic filler and polyphenylene sulfide plastic particles to obtain modified polyphenylene sulfide plastic particles; carrying out injection molding and extrusion on the modified polyphenylene sulfide plastic particles to obtain a modified polyphenylene sulfide plastic sheet; and using the modified polyphenylene sulfide plastic sheet as a middle dielectric layer, covering the two faces of the middle dielectric layer with adhesive copper foils through a hot rolling technology, and the carrying out pressing to obtain the thermoplastic copper-clad plate. Compared with the prior art, the modified polyphenylene sulfide plastic sheet is enhanced by the short glass fibers and the inorganic filler, and the inorganic filler has very good homogenizing characteristic, so that the copper-clad plate has relatively low thermal expansion coefficients in three directions.

Description

technical field [0001] The application relates to a high-frequency circuit board substrate, in particular to a thermoplastic copper-clad laminate and a preparation method thereof. Background technique [0002] With the development and maturity of the fifth generation (5G) wireless mobile communication technology, 5G technology will be deeply integrated with industrial intelligence, telemedicine, L4 / L5 autonomous driving, and Internet of Vehicles to realize the true "Internet of Everything". In 5G technology, more miniaturized base station equipment and antennas, lower insertion loss (such as dielectric loss and conductor loss), and high reliability are required. Usually, high-frequency and high-speed circuit boards are used to prepare 5G networking equipment such as base station equipment and antennas. Therefore, the copper-clad laminates used as the base material of high-frequency and high-speed circuit boards are required to meet the following conditions: (1) have a stable...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B17/02B32B15/14B32B15/20B32B15/04B32B15/08B32B15/082B32B15/18B32B27/28B32B27/30B32B37/10C08K13/06C08K9/06C08K7/26C08K3/22C08K3/34C08K7/14C08L81/02
CPCB32B5/02B32B15/04B32B15/08B32B15/082B32B15/14B32B15/18B32B15/20B32B27/285B32B27/302B32B37/10C08K13/06C08K9/06C08K7/26C08K3/22C08K3/34C08K7/14B32B2262/103C08K2003/2227C08K2201/005C08K2201/016C08L81/02
Inventor 褚庆臣冯涛张雪华谭冠南俞斌
Owner 苏州硕贝德创新技术研究有限公司
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