High-frequency low-loss LTCC substrate material capable of being electroplated or chemically plated, and preparation method thereof
A low-loss, electroless plating technology, which is applied in the field of low-temperature co-fired ceramics for electronic ceramic materials, can solve problems such as difficult control of LTCC substrate sintering flatness, poor matching between LTCC materials and conductors, and elevated glass softening temperature to improve chemical corrosion resistance properties, lowering the dielectric constant, and enhancing the effect of chemical corrosion resistance
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[0026] The invention discloses a high-frequency low-loss LTCC substrate material capable of electroplating or electroless plating and a preparation method thereof. The invention will be further described in detail below through specific examples and comparative examples.
[0027] Glass powder preparation
[0028] Preparation of glass-ceramics: glass composition 15-20wt% CaO, 30-40wt% B 2 o 3 , 35-45wt% La 2 o 3 , 0-5wt%Al 2 o 3 , 0-6wt% M 2 O. m 2 O is Na 2 O, K 2 O. Li 2 One or a mixture of both of O. CaO to CaCO 3 Form Join, B 2 o 3 with H 2 BO 3 Added in the form, P as Ca 2 P 2 o 7 form join, Na 2 O, K 2 O. Li 2 O is also added as carbonate.
[0029] Weigh each raw material in proportion and put it into the mixer to mix the raw materials;
[0030] Further, the stirring dry speed of the mixer is 20-30 rpm, the outer cylinder speed is 20-30 rpm, and the mixing time is 20-30 minutes;
[0031] Put the mixed raw materials into a platinum crucible, put it...
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