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Liquid crystal polymer substrate and preparation method thereof

A liquid crystal polymer and substrate technology, applied in circuit substrate materials, printed circuit manufacturing, printed circuit components, etc., can solve problems such as signal loss, achieve difficult signal loss, high bonding strength and tensile strength, and is conducive to high The effect of high-speed transmission

Inactive Publication Date: 2021-08-13
江西省康利泰信息科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to propose a liquid crystal polymer substrate and a preparation method thereof, so as to solve the problem that the existing liquid crystal polymer substrate easily causes signal loss during high-frequency and high-speed transmission

Method used

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  • Liquid crystal polymer substrate and preparation method thereof
  • Liquid crystal polymer substrate and preparation method thereof
  • Liquid crystal polymer substrate and preparation method thereof

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preparation example Construction

[0043] The present invention also provides a method for preparing the above-mentioned liquid crystal polymer substrate, comprising the following steps:

[0044]Coating one of the LCP layers on the surface of one copper foil layer, coating the other LCP layer on the surface of another copper foil layer, removing the solvent at 60-180°C, ℃ yellowing reaction for 9~11h to obtain the first LCP core layer and the second LCP core layer;

[0045] Coating the low dielectric adhesive layer on the surface of the first LCP core layer, drying, pressing the second LCP core on the surface of the low dielectric adhesive layer away from the first LCP core layer layer;

[0046] Winding and aging, the liquid crystal polymer substrate is obtained.

Embodiment 1

[0048] Please refer to figure 1 As shown, the embodiment of the present invention provides a liquid crystal polymer substrate 100, comprising two layers of copper foil layers and an intermediate core layer disposed between the two layers of copper foil layers, the two layers of copper foil layers are respectively the first copper foil layer a foil layer 10 and a second copper foil layer 20;

[0049] The intermediate core layer includes a layer of low-dielectric adhesive layer, also referred to as the first low-dielectric adhesive layer 50, and two layers of LCP layers, the two layers of LCP layers are respectively the first LCP layer 30 and the second LCP layer 40, The first low dielectric adhesive layer 50 is arranged between the first LCP layer 30 and the second LCP layer 40, the surface of the first LCP layer 30 away from the first low dielectric adhesive layer 50 and The first copper foil layer 10 is bonded and connected, and the surface of the second LCP layer 40 away fr...

Embodiment 2

[0057] An embodiment of the present invention provides a liquid crystal polymer substrate, comprising two copper foil layers and an intermediate core layer disposed between the two copper foil layers, the two copper foil layers are respectively the first copper foil layer and the second copper foil layer. Two copper foil layers;

[0058] The middle core layer includes a layer of low dielectric glue layer and two layers of LCP layers, the two layers of LCP layers are respectively the first LCP layer and the second LCP layer, and the low dielectric glue layers are all arranged on the first LCP layer. layer and the second LCP layer, the surface of the first LCP layer facing away from the low dielectric adhesive layer is bonded and connected to the first copper foil layer, and the second LCP layer is away from the low dielectric adhesive layer The surface of the layer is attached and connected to the second copper foil layer;

[0059] The thickness of each layer of copper foil la...

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Abstract

The invention provides a liquid crystal polymer substrate and a preparation method thereof. The liquid crystal polymer substrate comprises two copper foil layers and a middle core layer arranged between the two copper foil layers; the middle core layer comprises at least one low-dielectric adhesive layer and at least two LCP layers, each low-dielectric adhesive layer is connected between the at least two LCP layers in an attached mode, the low-dielectric adhesive layer located on the outer side is connected with the LCP layers in an attached mode, and the surfaces, away from the low-dielectric adhesive layers, of the LCP layers are connected with the copper foil layers in an attached mode; and the thickness of each LCP layer is 3-50 [mu]m, the thickness of each low dielectric adhesive layer is 5-125 [mu]m, and the thickness of each copper foil layer is 1-35 [mu]m. The low dielectric adhesive layer is arranged between the at least two LCP layers to form the middle core layer, and then the copper foil layer is arranged on the LCP layers, so that the prepared liquid crystal polymer substrate is not easy to cause signal loss during high-frequency and high-speed transmission, is beneficial to high-frequency and high-speed transmission, and has relatively high bonding strength and tensile strength.

Description

technical field [0001] The invention relates to the technical field of flexible circuit boards and their preparation, in particular to a liquid crystal polymer substrate and a preparation method thereof. Background technique [0002] In the high-frequency field, wireless infrastructure needs to provide low enough insertion loss to effectively improve energy utilization. With the accelerated development of 5G communication, millimeter wave, and aerospace military industry, the demand for high-frequency and high-speed FPC (flexible circuit board) / PCB (printed circuit board) business is coming. With the rise of emerging industries such as big data and the Internet of Things and mobile interconnection terminals The rapid processing and transmission of information has become the focus of the communication industry. [0003] Generally speaking, FPC / PCB is the main bottleneck in the entire transmission process. If there is a lack of good design and related materials with good elec...

Claims

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Application Information

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IPC IPC(8): H05K1/03H05K3/00
CPCH05K1/03H05K3/00
Inventor 周敏
Owner 江西省康利泰信息科技有限公司
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