32 results about "Liquid crystal polymer substrate" patented technology

The invention discloses a method for making a multi-layer organic liquid crystal polymer (LCP) substrate structure. The method comprises the following steps: providing a first LCP core substrate and a second LCP core substrate; connecting an active device to the first LCP core substrate in an inverted manner; arranging a passive device on the second LCP core substrate by means of surface mounting, sequentially overlapping and stacking the second LCP core substrate mounted with the passive device, an LCP dielectric layer and the first LCP core substrate connected with the active device in an inverted manner, and thermoforming to obtain the multi-layer LCP substrate structure embedded with both the active device and the passive device. The multi-layer LCP substrate structure can be used for making a microwave / millimeter wave system level module and has the characteristic of achieving a system with high density, small size, high performance, high frequency, low value and low consumption.

A process for providing a metal-seeded liquid crystal polymer comprising the steps of providing a liquid crystal polymer substrate to be treated by applying an aqueous solution comprising an alkali metal hydroxide and a solubilizer as an etchant composition for the liquid crystal polymer substrate. Further treatment of the etched liquid crystal polymer substrate involves depositing an adherent metal layer on the etched liquid crystal polymer substrate. An adherent metal layer may be deposited using either electroless metal plating or vacuum deposition of metal such as by sputtering. When using electroless metal plating, a tin(II) solution applied to the liquid crystal polymer provides a treated liquid crystal polymer substrate to which the application of a palladium(II) solution provides the metal-seeded liquid crystal polymer. The etchant composition comprises a solution in water of from 35 wt. % to 55 wt. % of an alkali metal salt, and from 10 wt. % to 35 wt. % of a solubilizer dissolved in the solution to provide the etchant composition suitable for etching the liquid crystal polymer at a temperature from 50° C. to 120° C. A flexible circuit comprising a liquid crystal polymer film having through-holes and related shaped voids may be formed using etchant compositions as previously described. Etchant solutions may be used to prepare the surfaces of materials for formation of composite structures useful in applications including flexures for hard disk drives.

A compact endfire tapered slot antenna, which may be advantageously printed on a low permittivity Liquid Crystal Polymer substrate. The antenna features a microstrip-to-slot transition, in which the matching stubs of the slotline antenna feed and the microstrip input line are collinear. This is achieved using a 90° bend in the slotline. The antenna is consequently of smaller size, and has improved bandwidth over prior art geometries. The antenna may be carried on a fork-shaped metallic carrier, which gives it good rigidity, and may incorporate a metallic reflector, which increases its directive gain. The antenna is simpler to manufacture and a less costly alternative to conventional 60-GHz tapered slot antennas printed on multilayer LTCC substrates. It can be used both as an individual radiator as well as an element of an antenna array and is readily integrated with an RF module for use in future WPAN applications.

The invention discloses to a solid silicon rubber compound used in liquid crystal polymer, which comprises the organic polysiloxane (A) with aliphatic unsaturated bond, (B) organic hydrogen polysiloxane, at least one (C) acryl, methacryloyl, or the (methyl) acrylate compound that soluble with (A), and (D) platinum group metallic catalyst. With inventive silicon rubber compound, the solid that canadhere the LCP basic plate can be prepared, especially the inventive silicon rubber compound can provides the solid with better transparence, to effectively adhere he liquid crystal polymer basic plate used in the package of light displays, while it can be effectively used in the application of basic plate of optical correlator.

An electrolytic copper foil is characterized by having a roughened surface (M surface) on which roughening particles are formed, wherein the roughening particles have an average size of 0.1 to 1.0 mum. Provided is the electrolytic copper foil capable of, without deteriorating various characteristics of the electrolytic copper foil, improving a roughening treatment layer on the copper foil and enhancing the adhesion strength between the copper foil and a resin substrate, especially, capable of obtaining a stronger peeling strength in comparison with a general-purpose epoxy resin substrate (FR-4 and the like) when used in combination with a semiconductor package substrate having a generally low adhesion with a copper foil and a liquid crystal polymer substrate, and also provided is a method for manufacturing the electrolytic copper foil. The present invention addresses the problem of providing the electrolytic copper foil useful as an electrolytic copper foil to be used for a printed wiring board or a battery (LiB and the like) negative electrode material.

A method and apparatus is disclosed for affixing a cover layer formed of liquid crystal polymer to a flex circuit consisting of circuit elements mounted to a liquid crystal polymer substrate in order to encapsulate the circuit elements between the cover layer and substrate to protect them from exposure to moisture and contaminants and to provide thermal protection of temperature sensitive circuit elements within the flex circuit during the encapsulation process.

A process for providing a metal-seeded liquid crystal polymer comprising the steps of providing a liquid crystal polymer substrate to be treated by applying an aqueous solution comprising an alkali metal hydroxide and a solubilizer as an etchant composition for the liquid crystal polymer substrate. Further treatment of the etched liquid crystal polymer substrate involves depositing an adherent metal layer on the etched liquid crystal polymer substrate. An adherent metal layer may be deposited using either electroless metal plating or vacuum deposition of metal such as by sputtering.When using electroless metal plating, a tin(II) solution applied to the liquid crystal polymer provides a treated liquid crystal polymer substrate to which the application of a palladium(II) solution provides the metal-seeded liquid crystal polymer. The etchant composition comprises a solution in water of from 35 wt. % to 55 wt. % of an alkali metal salt, and from 10 wt. % to 35 wt. % of a solubilizer dissolved in the solution to provide the etchant composition suitable for etching the liquid crystal polymer at a temperature from 50° C. to 120° C. A flexible circuit comprising a liquid crystal polymer film having through-holes and related shaped voids may be formed using etchant compositions as previously described.

The invention relates to a flexible multi-frequency antenna based on a liquid crystal polymer substrate. The antenna comprises the substrate, an antenna body and a grounding plate; the substrate is made of a flexible material; the antenna body is a circular radiation patch located on the front surface of the substrate; two U-shaped grooves are formed in the antenna body; a feeder line is arrangedon one side of the antenna body; and the grounding plate is positioned on the back surface of the substrate. Compared with the prior art, the antenna adopts an LCP material, and has the advantages oflow dielectric loss, low hygroscopicity, high temperature resistance, chemical corrosion resistance, small thermal expansion coefficient, small thickness and the like; and the antenna is the circularradiation patch, the improved circular grounding plate is adopted, and the two U-shaped grooves are added in the round patch, so that a three-frequency working characteristic can be realized.

A fluid displacement device (100) having a homopolar motor (110). The homopolar motor includes a rotatable disk (115) with at least one fluid displacement structure (120) disposed thereon. The fluid displacement structure can be a blade. The rotatable disk can be disposed within a cavity (145) defined in a substrate (105), such as a ceramic substrate, a liquid crystal polymer substrate, or a semiconductor substrate. A closed loop control circuit (235) can be included to control the rotational speed of the rotatable disk. For example, the control circuit can control a voltage source or a current source that applies voltage across the rotatable disk. The control circuit also can control a strength of a magnet (210) that applies a magnetic field (205) substantially aligned with an axis or rotation (155) of the rotatable disk.

A fluid pump (100) having a homopolar motor (110). The homopolar motor includes a rotatable disk (115) defining at least one impeller (120). The impeller can include an orifice within the rotatable disk. The rotatable disk can be at least partially disposed within a cavity (145) defined in the substrate (105), such as a ceramic substrate, a liquid crystal polymer substrate, or a semiconductor substrate. A closed loop control circuit (335) can be included to control the rotational speed of the rotatable disk. For example, the control circuit can control a voltage source or a current source that applies voltage across the rotatable disk. The control circuit also can control a strength of a magnet (310) that applies a magnetic field (305) substantially aligned with an axis or rotation (155) of the rotatable disk.

A method and apparatus is disclosed for affixing a cover layer formed of liquid crystal polymer to a flex circuit consisting of circuit elements mounted to a liquid crystal polymer substrate in order to encapsulate the circuit elements between the cover layer and substrate to protect them from exposure to moisture and contaminants and to provide thermal protection of temperature sensitive circuit elements within the flex circuit during the encapsulation process.

Provided is an optical waveguide device capable of reducing stress that occurs inside an optical waveguide substrate due to a difference in a coefficient of thermal expansion. The optical waveguide device (10) includes an optical waveguide substrate (11) having a thickness of 30 μm or less, and a liquid crystal polymer substrate (12) which holds the optical waveguide substrate (11) and has permittivity lower than that of the optical waveguide substrate (11). The optical waveguide substrate (11) and the liquid crystal polymer substrate (12) are bonded to each other by an adhesive layer (14). Coefficients of thermal expansion of the optical waveguide substrate (11) and the liquid crystal polymer substrate (12) have anisotropy in each substrate plane, and a relative direction between the optical waveguide substrate (11) and the liquid crystal polymer substrate (12) is adjusted in such a manner that anisotropic axial directions of the optical waveguide substrate (11) and anisotropic axial directions the liquid crystal polymer substrate (12) are aligned.

The present invention provides for a method for the fabrication of microchannels, and more particularly to the fabrication of microchannels for use in Microelectromechanical (MEMS) devices and MEMS related devices. In accordance with an embodiment of the present invention, microchannels are formed by a microfabrication method utilizing electronic imaging techniques in combination with chemical etching and subsequent metallization. The method of the present invention is effective in producing networks of channels in liquid crystal polymer (LCP) polymeric substrates which are highly defined in terms of their patterns, and thus are able to encompass a wide variety of end uses.

The present invention provides an electrolytic copper foil. The electrolytic copper foil is an electrolytic copper foil in which roughened particles are formed on the roughened surface (M surface) of the electrolytic copper foil. It is characterized in that the average size of the roughened particles is 0.1~1.0μm. The present invention provides an electrolytic copper foil and a manufacturing method thereof. The properties of the electrolytic copper foil are not deteriorated, the roughening treatment layer on the copper foil can be improved, and the bonding strength between the copper foil and the resin substrate can be improved; especially , Compared with general-purpose epoxy resin-based substrates (FR‑4, etc.), peeling can be achieved when using a combination of a substrate for semiconductor packaging or a liquid crystal polymer substrate that generally has low adhesion to copper foil and an electrolytic copper foil. Stronger electrolytic copper foil. An object of the present invention is to provide an electrolytic copper foil useful as an electrolytic copper foil used as a negative electrode material for a printed wiring board or a battery (LiB, etc.).

The invention discloses to a solid silicon rubber compound used in liquid crystal polymer, which comprises the organic polysiloxane (A) with aliphatic unsaturated bond, (B) organic hydrogen polysiloxane, at least one (C) acryl, methacryloyl, or the (methyl) acrylate compound that soluble with (A), and (D) platinum group metallic catalyst. With inventive silicon rubber compound, the solid that canadhere the LCP basic plate can be prepared, especially the inventive silicon rubber compound can provides the solid with better transparence, to effectively adhere he liquid crystal polymer basic plate used in the package of light displays, while it can be effectively used in the application of basic plate of optical correlator.

The invention discloses a preparation method of a flexible copper-clad liquid crystal polymer substrate. First, a layer of LCP glue is coated on a layer of copper foil, and then dried in a tunnel oven, and then the obtained copper foil with an LCP glue layer is The foil is laminated with another layer of copper foil to obtain a substrate, which is then post-cured in a programmed oven to obtain a flexible copper-clad liquid crystal polymer substrate. Through this method, the thickness of the LCP adhesive layer can be easily made ultra-thin, which is conducive to the development of ultra-thin electronic products in the future, and the low-temperature press is used to replace the high-temperature press during lamination, which greatly reduces the cost and improves the production capacity. It has also been improved, and the post-curing step is performed on the laminated substrate to effectively eliminate internal stress, improve the bonding strength and cohesive strength, and improve the strength of the entire flexible copper-clad liquid crystal polymer substrate.

The invention discloses a liquid crystal polymer substrate and a processing method thereof, wherein the liquid crystal polymer substrate comprises a composite liquid crystal polymer film and a metal conductive layer covering at least one surface of the composite liquid crystal polymer film; the composite liquid crystal polymer film including melting point T m1 liquid crystal polymer resin, and a melting point of T m2 liquid crystal polymer resin, where T m1 greater than T m2 , with a melting point of T m2 The mass percentage of the liquid crystal polymer resin in the total resin amount of the liquid crystal polymer film is 1.0-30.0%. The present invention mainly solves the problem of low bonding strength between the liquid crystal polymer film and the metal conductive layer in the liquid crystal polymer substrate in the prior art, or the poor heat resistance of the liquid crystal polymer film, or the high frequency of the liquid crystal polymer film. Technical issues with poor characteristics.