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Copper foil excellent in adhesion with resin, method for manufacturing same, and printed wiring board or battery negative electrode material using electrolytic copper foil

A technology of electrolytic copper foil and manufacturing method, applied in non-aqueous electrolyte storage batteries, printed circuits, printed circuits, etc., can solve problems such as limited effect, increase peel strength, improve adhesion strength, and improve the roughening treatment layer. Effect

Active Publication Date: 2014-06-11
JX NIPPON MINING & METALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, even the idea of ​​adding additives to an acidic copper electroplating bath mainly composed of copper sulfate and sulfuric acid has limited effects, and further improvement is desired.

Method used

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  • Copper foil excellent in adhesion with resin, method for manufacturing same, and printed wiring board or battery negative electrode material using electrolytic copper foil
  • Copper foil excellent in adhesion with resin, method for manufacturing same, and printed wiring board or battery negative electrode material using electrolytic copper foil
  • Copper foil excellent in adhesion with resin, method for manufacturing same, and printed wiring board or battery negative electrode material using electrolytic copper foil

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1）

[0119] A treatment of forming roughened particles was performed on the rough surface of the copper foil using an IPC3 grade electrolytic copper foil having a thickness of 12 μm.

[0120] The plating bath composition and electrolytic treatment conditions of the treatment (electroplating) electrolytic solution for forming roughened particles are as follows.

[0121] (Electrolyte composition)

[0122] Cu: 15g / L

[0123] h 2 SO 4 : 100g / L

[0124] W addition amount: 3mg / L (added in the form of sodium tungstate dihydrate, the same below)

[0125] Addition amount of sodium decyl sulfate: 4mg / L

[0126] (Electrolyte temperature) 38°C

[0127] (current condition)

[0128] Current density: 54A / dm 2

[0129] Next, on the above-mentioned roughened surface, plating is performed with an electrolytic bath containing sulfuric acid / copper sulfate in order to prevent falling off of roughened particles and to increase peel strength. The processing conditions for plating are as follows...

Embodiment 1

[0146] The number of coarse particles measured in Example 1 (pieces / μm 2 ), particle size (average μm), surface roughness (Ra, Rt, Rz) and peel strength (BT substrate peel strength (kN / m): normal and welded peel strength) are shown in Table 1.

[0147] Table 1

[0148]

Embodiment 2）

[0150] A treatment of forming roughened particles was performed on the rough surface of the copper foil using an IPC3 grade electrolytic copper foil having a thickness of 12 μm.

[0151] The plating bath composition and electrolytic treatment conditions of the electrolytic solution in the roughened particle forming treatment (electroplating) are as follows.

[0152] (Electrolyte composition)

[0153] Cu: 15g / L

[0154] h 2 SO 4 : 100g / L

[0155] W addition amount: 3mg / L (added in the form of sodium tungstate dihydrate, the same below)

[0156] Addition amount of sodium decyl sulfate: 4mg / L

[0157] (Electrolyte temperature) 38°C

[0158] (current condition)

[0159] Current density: 54A / dm 2

[0160] Next, on the above-mentioned roughened surface, plating is performed with an electrolytic bath containing sulfuric acid / copper sulfate in order to prevent falling off of roughened particles and to increase peel strength. The processing conditions for plating are as follo...

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Abstract

An electrolytic copper foil is characterized by having a roughened surface (M surface) on which roughening particles are formed, wherein the roughening particles have an average size of 0.1 to 1.0 mum. Provided is the electrolytic copper foil capable of, without deteriorating various characteristics of the electrolytic copper foil, improving a roughening treatment layer on the copper foil and enhancing the adhesion strength between the copper foil and a resin substrate, especially, capable of obtaining a stronger peeling strength in comparison with a general-purpose epoxy resin substrate (FR-4 and the like) when used in combination with a semiconductor package substrate having a generally low adhesion with a copper foil and a liquid crystal polymer substrate, and also provided is a method for manufacturing the electrolytic copper foil. The present invention addresses the problem of providing the electrolytic copper foil useful as an electrolytic copper foil to be used for a printed wiring board or a battery (LiB and the like) negative electrode material.

Description

technical field [0001] The present invention relates to a copper foil excellent in adhesion to resins, a method for producing the same, and a negative electrode material for a printed wiring board or a battery using the electrolytic copper foil. -4, etc.), when a base material for semiconductor encapsulation or a liquid crystal polymer base material with low adhesion to copper foil is used in combination with an electrodeposited copper foil, an electrodeposited copper foil with a higher peel strength can be obtained, the electrodeposited copper A method for producing the foil, and a negative electrode material for a printed wiring board or a battery using the electrolytic copper foil. The above-mentioned electrolytic copper foil is useful as an electrolytic copper foil used as a negative electrode material for a printed wiring board or a battery (LiB, etc.). Background technique [0002] The printed wiring board as the prior art will be described. The printed wiring board i...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D7/06H05K3/38
CPCH05K3/384C25D3/50C25D7/12H05K2201/0355H01M2004/027H01M4/70C25D1/04C25D5/48H01M4/661H01M4/00H05K1/09H01M10/052H05K3/38Y02E60/10C25D3/38C25D7/06
Inventor 古曳伦也森山晃正
Owner JX NIPPON MINING & METALS CO LTD
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