Copper foil excellent in adhesion to resin, method for producing same, and negative electrode material for printed wiring board or battery using the same

A technology of electrolytic copper foil and substrate, applied in non-aqueous electrolyte batteries, printed circuits, printed circuits, etc., can solve problems such as limited effect, increase peel strength, improve adhesion strength, and improve the roughening treatment layer. Effect

Active Publication Date: 2018-09-07
JX NIPPON MINING & METALS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, even the idea of ​​adding additives to an acidic copper electroplating bath mainly composed of copper sulfate and sulfuric acid has limited effects, and further improvement is desired.

Method used

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  • Copper foil excellent in adhesion to resin, method for producing same, and negative electrode material for printed wiring board or battery using the same
  • Copper foil excellent in adhesion to resin, method for producing same, and negative electrode material for printed wiring board or battery using the same
  • Copper foil excellent in adhesion to resin, method for producing same, and negative electrode material for printed wiring board or battery using the same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0119] Using an IPC grade 3 electrolytic copper foil with a thickness of 12 μm, a treatment for forming roughened particles was performed on the rough surface of the copper foil.

[0120] The plating bath composition and electrolytic treatment conditions of the treatment (electroplating) electrolytic solution for forming roughened particles are as follows.

[0121] (Electrolyte composition)

[0122] Cu: 15g / L

[0123] h 2 SO 4 : 100g / L

[0124] W addition amount: 3mg / L (added in the form of sodium tungstate dihydrate, the same below)

[0125] Addition of sodium lauryl sulfate: 4mg / L

[0126] (Electrolyte temperature) 38°C

[0127] (current condition)

[0128] Current density: 54A / dm 2

[0129] Next, on the above-mentioned roughened surface, plating is performed with an electrolytic bath containing sulfuric acid / copper sulfate in order to prevent falling off of roughened particles and to increase peel strength. The processing conditions for plating are as follows.

...

Embodiment 2

[0150] Using an IPC grade 3 electrolytic copper foil with a thickness of 12 μm, a treatment for forming roughened particles was performed on the rough surface of the copper foil.

[0151] The plating bath composition and electrolytic treatment conditions of the electrolytic solution at the time of roughening particle formation treatment (electroplating) are as follows.

[0152] (Electrolyte composition)

[0153] Cu: 15g / L

[0154] h 2 SO 4 : 100g / L

[0155] W addition amount: 3mg / L (added in the form of sodium tungstate dihydrate, the same below)

[0156] Addition of sodium lauryl sulfate: 4mg / L

[0157] (Electrolyte temperature) 38°C

[0158] (current condition)

[0159] Current density: 54A / dm 2

[0160] Next, on the above-mentioned roughened surface, plating is performed with an electrolytic bath containing sulfuric acid / copper sulfate in order to prevent falling off of roughened particles and to increase peel strength. The processing conditions for plating are as f...

Embodiment 3

[0179] Using an IPC grade 3 electrolytic copper foil with a thickness of 12 μm, a treatment for forming roughened particles was performed on the rough surface of the copper foil.

[0180] The plating bath composition and electrolytic treatment conditions of the electrolytic solution at the time of roughening particle formation treatment (electroplating) are as follows.

[0181] (Electrolyte composition)

[0182] Cu: 20g / L

[0183] h 2 SO 4 : 100g / L

[0184] W addition amount: 3mg / L (added in the form of sodium tungstate dihydrate, the same below)

[0185] Addition of sodium lauryl sulfate: 4mg / L

[0186] (Electrolyte temperature) 38°C

[0187] (current condition)

[0188] Current density: 54A / dm 2

[0189] Next, on the above-mentioned roughened surface, plating is performed with an electrolytic bath containing sulfuric acid / copper sulfate in order to prevent falling off of roughened particles and to increase peel strength. The processing conditions for plating are as...

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Abstract

The present invention provides an electrolytic copper foil. The electrolytic copper foil is an electrolytic copper foil in which roughened particles are formed on the roughened surface (M surface) of the electrolytic copper foil. It is characterized in that the average size of the roughened particles is 0.1~1.0μm. The present invention provides an electrolytic copper foil and a manufacturing method thereof. The properties of the electrolytic copper foil are not deteriorated, the roughening treatment layer on the copper foil can be improved, and the bonding strength between the copper foil and the resin substrate can be improved; especially , Compared with general-purpose epoxy resin-based substrates (FR‑4, etc.), peeling can be achieved when using a combination of a substrate for semiconductor packaging or a liquid crystal polymer substrate that generally has low adhesion to copper foil and an electrolytic copper foil. Stronger electrolytic copper foil. An object of the present invention is to provide an electrolytic copper foil useful as an electrolytic copper foil used as a negative electrode material for a printed wiring board or a battery (LiB, etc.).

Description

technical field [0001] The present invention relates to a copper foil excellent in adhesion to resins, a method for producing the same, and a negative electrode material for a printed wiring board or a battery using the electrolytic copper foil. -4, etc.), when a base material for semiconductor encapsulation or a liquid crystal polymer base material with low adhesion to copper foil is used in combination with an electrodeposited copper foil, an electrodeposited copper foil with a higher peel strength can be obtained, the electrodeposited copper A method for producing the foil, and a negative electrode material for a printed wiring board or a battery using the electrolytic copper foil. The electrodeposited copper foil is useful as an electrodeposited copper foil used as a negative electrode material for printed wiring boards or batteries (LiB, etc.). Background technique [0002] The printed wiring board as the prior art will be described. The printed wiring board is general...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D7/06H05K3/38
CPCC25D1/04C25D3/50C25D5/48C25D7/12H05K1/09H05K3/384H05K2201/0355H01M4/661H01M4/70H01M10/052H01M2004/027Y02E60/10C25D3/38C25D7/06
Inventor 古曳伦也森山晃正
Owner JX NIPPON MINING & METALS CORP
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