Preparation process of integrated large-area two-dimensional material device

Abstract

The invention discloses a preparation process of an integrated large-area two-dimensional material device, and belongs to the technical field of semiconductor processing. The process is characterized in that the process comprises at least comprising the following steps: S1, pretreatment; S2, gluing; S3, electron beam exposure; S4, developing; S5, etching; S6, gluing; S7, overlay; S8, evaporation; S9, stripping. The technical problems that the adsorption capacity of the two-dimensional material is not strong and the two-dimensional material is easy to fall off in the technological processes of developing, stripping and the like are solved by adopting an ingenious method of selecting proper photoresist and developing solution, directly making overlay marks by adopting the photoresist and directly coating the two-dimensional material without removing the photoresist after etching the two-dimensional material. In addition, compared with an ultraviolet lithography mode, an electron beam lithography mode is adopted, so the manufacturing step of a lithography mask plate is omitted, the method is very flexible and convenient, and has very high processing efficiency and nanoscale processing precision.

Description

technical field [0001] The invention belongs to the technical field of semiconductor processing, and in particular relates to a preparation process of an integrated large-area two-dimensional material device. Background technique [0002] In recent years, with the rapid development of science and technology, various advanced devices based on silicon-based materials have led the modern information technology revolution, and various advanced devices based on silicon-based materials have had an important impact on the progress of social science and technology. However, with the continuous reduction of chip size, the short channel effect and thermal effect are becoming more and more obvious. The above factors seriously limit the development of the chip industry. The development of new material systems and the preparation of related high-quality devices have become the current research hotspots of science and technology. As an important quantum material, two-dimensional materials...

AI Technical Summary

Problems solved by technology

However, with the continuous reduction of chip size, the short channel effect and thermal effect are becoming more and more obvious. The above factors seriously limit the development of the chip industry. The development of new material systems and the preparation of related high-quality devices have become the current research hotspots of science and technology.

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