Ultrathin glass single-side thinning method

An ultra-thin glass, single-sided technology, used in machine tools, grinders, grinding/polishing equipment suitable for grinding workpiece planes, etc., can solve the problem of polishing and repairing the bumps and scratches on the surface of the glass, and the effective area of ​​the glass is prone to glue residue. Contamination, the difficulty of tearing off the acid-proof film, etc., to achieve the effect of improving the performance yield, reducing the risk of fragmentation, and being convenient and quick to remove

Pending Publication Date: 2021-09-03
重庆永信科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The existing thinning process is to directly etch the glass with a thickness of 0.3-0.5mm on one side at one time. The defects of this method are: 1. When the glass is thinned to an ultra-thin thickness, the glass surface cannot be repaired by physical polishing Defects such as bumps and scratches

Method used

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  • Ultrathin glass single-side thinning method
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  • Ultrathin glass single-side thinning method

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0037] Example 1

[0038] like Figure 1 ~ 3 As shown, the present invention provides an ultra-thin glass single-sided thinning method, including the following steps:

[0039] Step 1: The non-thinned surface of the glass substrate 1 is attached to the film: where the attachment film includes a photovoltaic membrane 3 and the isolation layer 4, the spacer layer 4 covers the effective circuit region of the glass substrate 1, the isolation layer 4 It can be arranged to be released from paper or electrostatic films, and the release paper can be recovered, and the electrostatic film attachment effect is better, the size of the isolation layer 4 is the same as the size of the effective circuit region of the glass substrate 1, and the film 3 The size is the same as the size of the non-thinned surface of the glass substrate 1, and the photolysis membrane 3 is attached to the isolation layer 4 and the non-thin surface of the glass substrate 1 is covered. The isolation layer 4 protects the r...

Example Embodiment

[0046] Example 2

[0047] Unlike Example 1, the composition and ratio of the etching pretreatment liquid in step 5, the pretreatment mix used by the etching pretreatment includes hydrofluoric acid, sulfuric acid, respectively, with a total mass of the pretreatment liquid, respectively. 2.7%, 45.0-50.0%, the remaining ingredients were water, soaking time was 40-50 min, and the thickness of etch removal was 30 to 50 μm.

[0048] After etching the etched pre-treatment after etching the above ingredient and ratio, the glass substrate 1 having a thickness of 0.3 to 0.5 mm is thinned to 0.05 mm, and the time required for the entire process is 3-4 hours, the glass substrate 1 is thin. The performance is 15.0 ± 2.0%, decoction, scratched, and other surface defects, and thickness CPK = 1.28 (CPK ≥ 1.33 is optimal), and the thickness difference between the monolithic plate is ≤8 μm.

Example Embodiment

[0049] Example 3

[0050] Unlike Examples 1 and Example 2, the components and ratios of the etching pretreatment liquid in step 5 are different, and the pretreatment liquid used in etching pretreatment includes hydrofluoric acid, hydrochloric acid, sulfuric acid, respectively, pretreatment liquid, respectively. The total mass was 2.3-2.7%, 2.0-3.0%, 45.0.0%, the remaining ingredients were water, and the soaking time was 40-50 min, and the etch removal was 30 to 50 μm.

[0051] After etching the etched pre-treatment after etching the above ingredient and ratio, the glass substrate 1 having a thickness of 0.3 to 0.5 mm is thinned to 0.05 mm, and the time required for the entire process is 3-4 hours, the glass substrate 1 is thin. The performance is 88.0 ± 2.0%, decoction, scratches, etc. The non-intensity ratio is 12.0 ± 2.0%, and the thickness CPK = 1.31 (CPK ≥ 1.33 is optimal), the single piece thickness difference is ≤7 μm .

[0052] Comparative analysis of the above Examples 1 t...

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Abstract

The invention relates to an ultrathin glass single-side thinning method, which belongs to the technical field of glass substrate thinning process. The method comprises the following steps: attaching an attaching film on a non-thinning surface of a glass substrate; polishing the thinned surface of the glass substrate; subjecting the polished glass substrate to cleaning and drying and removing the attached film; pasting a back plate after the non-thinned surface of the glass substrate is coated with the attaching film; moving the glass substrate fixed with the back plate into an etching tank, etching firstly, and then performing single-face thinning treatment; after the glass substrate is separated from the back plate, cleaning and drying the thinned glass substrate, removing the attached film, and inspecting. The method has the beneficial effects that the polishing and pretreatment processes are added before single-side etching, and enough supporting force is provided for the polished glass substrate, so that the plate thickness difference of glass incoming materials is reduced, the uniformity of the thickness of the glass plate is improved, the expression yield of products can be improved, and the risk of fragment is reduced.

Description

technical field [0001] The invention relates to the technical field of glass thinning technology, in particular to a single-sided thinning method of ultra-thin glass. Background technique [0002] In recent years, with the development of modern science and technology in our country, the production technology and equipment level of glass have been further improved. As a convenient, efficient and advanced glass product, ultra-thin glass also has great potential in the fields of new energy, energy conservation and environmental protection, electronic information industry, construction industry, automobile industry and other fields in the future because of its good economic benefits and superior performance. Larger development space. [0003] The TSP (Touch Screen Panel, touch screen) glass used in OLED (Organic Light-Emitting Diode, Organic Light-Emitting Diode) displays needs to be protected by an acid-proof film on the side with the ITO circuit when it is thinned. The other...

Claims

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Application Information

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IPC IPC(8): C03C15/00B24B7/24B24B41/06
CPCC03C15/00B24B7/245B24B41/06
Inventor 李章辉徐政权高坤旭潘明明李文铭
Owner 重庆永信科技有限公司
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