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Ultrathin glass single-side thinning method

An ultra-thin glass, single-sided technology, used in machine tools, grinders, grinding/polishing equipment suitable for grinding workpiece planes, etc., can solve the problem of polishing and repairing the bumps and scratches on the surface of the glass, and the effective area of ​​the glass is prone to glue residue. Contamination, the difficulty of tearing off the acid-proof film, etc., to achieve the effect of improving the performance yield, reducing the risk of fragmentation, and being convenient and quick to remove

Pending Publication Date: 2021-09-03
重庆永信科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The existing thinning process is to directly etch the glass with a thickness of 0.3-0.5mm on one side at one time. The defects of this method are: 1. When the glass is thinned to an ultra-thin thickness, the glass surface cannot be repaired by physical polishing Defects such as bumps and scratches affect product yield; 2. When the glass is thinned to an ultra-thin thickness, it is difficult to tear off the acid-proof film, which is easy to cause damage, and the effective area of ​​​​the glass is easily polluted by residual glue; 3. , The uniformity of the plate thickness after glass thinning is poor

Method used

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Examples

Experimental program
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Effect test

Embodiment 1

[0038] like Figure 1 ~ Figure 3 As shown, the present invention provides a method for thinning one side of ultra-thin glass, comprising the following steps:

[0039] Step 1: Paste the attached film on the non-thinning surface of the glass substrate 1: the attached film includes a photodissociation film 3 and an isolation layer 4, the isolation layer 4 covers the effective circuit area of ​​the glass substrate 1, and the isolation layer 4 It can be set as a release paper or an electrostatic film, the release paper can be recycled and reused, and the electrostatic film has a better attachment effect. The size is the same as that of the non-thinned surface of the glass substrate 1 , and the photodissociation film 3 is attached on the isolation layer 4 and covers the non-thinned surface of the glass substrate 1 . The isolation layer 4 protects the effective circuit area of ​​the glass substrate 1 from being polluted by the residual glue of the photodissociation film 3, further e...

Embodiment 2

[0047] Different from Example 1, the composition and proportioning of the etching pretreatment solution in step 5 are different, and the used pretreatment solution of etching pretreatment includes hydrofluoric acid and sulfuric acid, accounting for 2.3-3% of the total mass of the pretreatment solution respectively. 2.7%, 45.0-50.0%, the remaining components are water, the soaking time is 40-50min, and the thickness removed by etching is 30-50μm.

[0048] After the etching pretreatment with the above composition and proportioning etching pretreatment liquid, the glass substrate 1 with a thickness of 0.3-0.5mm is thinned to 0.05mm. The time required for the whole process is 3-4 hours, and the glass substrate 1 is thin. After melting, the performance yield rate reaches 85.0±2.0%, the proportion of surface defects such as pits and scratches is 15.0±2.0%, the plate thickness CPK=1.28 (CPK≥1.33 is the best), and the single plate thickness difference is ≤8μm.

Embodiment 3

[0050] Different from Example 1 and Example 2, the composition and proportioning of the etching pretreatment liquid in step 5 are different, and the pretreatment liquid used for etching pretreatment includes hydrofluoric acid, hydrochloric acid, sulfuric acid, respectively accounting for the pretreatment liquid The total mass is 2.3-2.7%, 2.0-3.0%, 45.0-50.0%, the rest is water, the soaking time is 40-50min, and the thickness removed by etching is 30-50μm.

[0051] After the etching pretreatment with the above composition and proportioning etching pretreatment liquid, the glass substrate 1 with a thickness of 0.3-0.5mm is thinned to 0.05mm. The time required for the whole process is 3-4 hours, and the glass substrate 1 is thin. After melting, the performance yield rate reaches 88.0±2.0%, the raw material defect ratio such as pits and scratches is 12.0±2.0%, the board thickness CPK=1.31 (CPK≥1.33 is the best), and the single-piece board thickness difference is ≤7μm .

[0052] ...

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Abstract

The invention relates to an ultrathin glass single-side thinning method, which belongs to the technical field of glass substrate thinning process. The method comprises the following steps: attaching an attaching film on a non-thinning surface of a glass substrate; polishing the thinned surface of the glass substrate; subjecting the polished glass substrate to cleaning and drying and removing the attached film; pasting a back plate after the non-thinned surface of the glass substrate is coated with the attaching film; moving the glass substrate fixed with the back plate into an etching tank, etching firstly, and then performing single-face thinning treatment; after the glass substrate is separated from the back plate, cleaning and drying the thinned glass substrate, removing the attached film, and inspecting. The method has the beneficial effects that the polishing and pretreatment processes are added before single-side etching, and enough supporting force is provided for the polished glass substrate, so that the plate thickness difference of glass incoming materials is reduced, the uniformity of the thickness of the glass plate is improved, the expression yield of products can be improved, and the risk of fragment is reduced.

Description

technical field [0001] The invention relates to the technical field of glass thinning technology, in particular to a single-sided thinning method of ultra-thin glass. Background technique [0002] In recent years, with the development of modern science and technology in our country, the production technology and equipment level of glass have been further improved. As a convenient, efficient and advanced glass product, ultra-thin glass also has great potential in the fields of new energy, energy conservation and environmental protection, electronic information industry, construction industry, automobile industry and other fields in the future because of its good economic benefits and superior performance. Larger development space. [0003] The TSP (Touch Screen Panel, touch screen) glass used in OLED (Organic Light-Emitting Diode, Organic Light-Emitting Diode) displays needs to be protected by an acid-proof film on the side with the ITO circuit when it is thinned. The other...

Claims

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Application Information

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IPC IPC(8): C03C15/00B24B7/24B24B41/06
CPCC03C15/00B24B7/245B24B41/06
Inventor 李章辉徐政权高坤旭潘明明李文铭
Owner 重庆永信科技有限公司
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