Method for preparing three-dimensional heat dissipation film and three-dimensional heat dissipation film

Abstract

The invention relates to the technical field of heat dissipation films, and particularly discloses a method for preparing a three-dimensional heat dissipation film and the three-dimensional heat dissipation film prepared based on the method. The method comprises the steps of 1, obtaining the three-dimensional shape of a surface needing heat dissipation; and 2) forming a recess matched with the three-dimensional shape on the single-layer or multi-layer composite heat dissipation film to obtain the three-dimensional heat dissipation film. The method is simple in process and easy to operate, and the heat dissipation film in the three-dimensional shape is directly prepared through die cutting or die forming, so that the heat dissipation requirement of heating electronic devices in irregular shapes is met, and the defect that traditional heat conduction glue is low in heat dissipation efficiency is overcome.

Description

technical field [0001] The invention relates to the technical field of heat dissipation films, and specifically discloses a method for preparing a three-dimensional heat dissipation film and the three-dimensional heat dissipation film. Background technique [0002] Smartphones, laptops, smart AR, VR wearables, smart homes, and display screens are developing rapidly. In order to meet functional specialization, diversification, and portability, the integration of chips and the compactness of each component are getting higher and higher. Ultimately, The result is increased power consumption and smaller heat dissipation space, causing many similar smart products to easily heat up. At present, the most widely used heat dissipation film (usually thermal conductivity K≥1200W / mK) is synthetic graphite heat dissipation film, and graphene heat dissipation film (also known as graphene heat conduction film) is used in individual mobile phone terminals. [0003] At present, all heat dis...

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Problems solved by technology

[0003] At present, all heat dissipation films are attached to the heat source in a planar manner, that is to say, the heat dissipation film itself has a uniform thickness; however, since the surface of many irregular heating components is not a plane, it cannot be used directly. In the prior art, most heat dissipation films bonded in this planar manner use thermally conductive glue to lay on the surface of these irregular heating elements to form a plane that can be attached to the heat dissipation film, and then use this plane to bond the heat conduction film or Other heat dissipation components; however, the thermal conductivity of general thermal conductivity K<5W / mK, compared with directly pasting the heat dissipation film, resulting in a significant drop in heat dissipation efficiency

[0004] On the other hand, in order to directly use the heat dissipation film, small pieces of heat dissipation film can also be cut out for each relatively small plane on these irregular heating components, and then mounted separately. It will bring repetitive and tedious work to thermal design and subsequent placement

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