LTCC substrate as well as preparation method and application thereof

Abstract

The invention discloses an LTCC substrate as well as a preparation method and application thereof. The preparation method comprises the following steps: 1) carrying out ball milling on hollow spherical SiO2 and Al2O3, and calcining to obtain SiO2@Al2O3 powder; 2) mixing KBS glass powder, the SiO2@Al2O3 powder and an additive, and carrying out ball milling to obtain ceramic slurry; (3) forming the ceramic slurry, laminating membranes, carrying out isostatic pressing, and cutting into a ceramic blank; and 4) sintering the ceramic blank to obtain the LTCC substrate. By adding the hollow spherical SiO2, the dielectric constant of the LTCC ceramic is reduced, the dielectric constant of the material is as low as 3.5, and the dielectric loss is as low as 0.2%; and the surface of the hollow spherical SiO2 is coated with Al2O3, the surface binding force of glass and SiO2 in the sintering process is improved, the strength of the substrate is improved to 220 MPa, and the ultralow dielectric constant LTCC substrate which is good in compactness and high in bending strength is obtained and is suitable for the fields of high-frequency communication and radio frequency.

Description

technical field [0001] The invention relates to the technical field of ceramic substrates, in particular to an LTCC substrate and a preparation method and application thereof. Background technique [0002] With the advent of 5G communication and the era of Internet of Everything, high-frequency applications have become a trend. In order to reduce signal transmission loss and speed up signal transmission rate, low dielectric constant low-temperature co-fired ceramic (LTCC) ceramic materials have received more and more attention. The widely used low dielectric ceramic powder is mostly made of glass + Al 2 o 3 system material, due to Al 2 o 3 The dielectric constant is relatively high (9-11), and the dielectric constant of existing material systems is generally higher than 5.0. It is difficult to further reduce the dielectric constant of porcelain powder. In the previous patent CN201910155188X, a material was disclosed, in glass+Al 2 o 3 Add SiO to the system 2 The way ...

AI Technical Summary

Problems solved by technology

The widely used low dielectric ceramic powder is mostly made of glass+Al2O3 system material, because Al2O3The dielectric constant is high (9~11), the dielectric constant of the existing material system is generally higher than 5.0, and it is difficult to further reduce the dielectric constant of ceramic powder

In the previous patent CN201910155188X, a material was disclosed, in glass+Al 2 o 3 Add SiO to the system 2 The way to reduce the dielectric constant and improve the density, but the minimum dielectric constant can only reach 4.3 in this method, and SiO 2 The surface has poor bonding with glass, resulting in low bending strength of LTCC substrates, making it difficult to meet high reliability requirements

The dielectric constant of organic-inorganic composite ceramic materials under development can be as low as 4.0 or less, but organic polymers have poor temperature resistance and are not compatible with the current LTCC integration process, which cannot meet the needs of high-density integration

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