Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

LTCC substrate as well as preparation method and application thereof

A substrate and ball milling technology, applied in glass manufacturing equipment, manufacturing tools, glass furnace equipment, etc., can solve the problems of poor temperature resistance, incompatibility, and poor bonding of organic polymers, and achieve lower dielectric constant and lower dielectric Loss, the effect of improving the binding force

Inactive Publication Date: 2021-09-21
GUANGDONG FENGHUA ADVANCED TECH HLDG
View PDF5 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The widely used low dielectric ceramic powder is mostly made of glass+Al2O3 system material, because Al2O3The dielectric constant is high (9~11), the dielectric constant of the existing material system is generally higher than 5.0, and it is difficult to further reduce the dielectric constant of ceramic powder
In the previous patent CN201910155188X, a material was disclosed, in glass+Al 2 o 3 Add SiO to the system 2 The way to reduce the dielectric constant and improve the density, but the minimum dielectric constant can only reach 4.3 in this method, and SiO 2 The surface has poor bonding with glass, resulting in low bending strength of LTCC substrates, making it difficult to meet high reliability requirements
The dielectric constant of organic-inorganic composite ceramic materials under development can be as low as 4.0 or less, but organic polymers have poor temperature resistance and are not compatible with the current LTCC integration process, which cannot meet the needs of high-density integration

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • LTCC substrate as well as preparation method and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0043] 1. Preparation of K-B-Si(KBS) glass

[0044] 1.1 Weigh the raw material SiO according to the mass fraction of 56.9wt%, 41.1wt%, 1.5wt%, 0.1wt%, 0.2wt%, 0.2wt% 2 、H 3 BO 3 、K 2 CO 3 、Na 2 CO 3 , CaCO 3 、BaCO 3 . Using an agate ball mill tank, using deionized water as a medium, planetary ball milling for 4 hours, discharging, drying at 100°C for 12 hours, to obtain raw material powder;

[0045] 1.2 Put the dried raw material powder in a platinum crucible, place it in a high-temperature furnace, and keep it warm at 1300 ° C for 2 hours to homogenize the glass liquid, take out the glass liquid at high temperature, and quench it in deionized water;

[0046] 1.3 Put the above-mentioned quenched glass in an agate ball mill jar, use zirconia balls as the medium, deionized water as the medium, and planetary ball mill for 12 hours to obtain glass slurry, and dry the glass slurry at 100°C for 12 hours to obtain KBS glass powder;

[0047] 2. Al 2 o 3 coated SiO2 Core-s...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
dielectric lossaaaaaaaaaa
Login to View More

Abstract

The invention discloses an LTCC substrate as well as a preparation method and application thereof. The preparation method comprises the following steps: 1) carrying out ball milling on hollow spherical SiO2 and Al2O3, and calcining to obtain SiO2@Al2O3 powder; 2) mixing KBS glass powder, the SiO2@Al2O3 powder and an additive, and carrying out ball milling to obtain ceramic slurry; (3) forming the ceramic slurry, laminating membranes, carrying out isostatic pressing, and cutting into a ceramic blank; and 4) sintering the ceramic blank to obtain the LTCC substrate. By adding the hollow spherical SiO2, the dielectric constant of the LTCC ceramic is reduced, the dielectric constant of the material is as low as 3.5, and the dielectric loss is as low as 0.2%; and the surface of the hollow spherical SiO2 is coated with Al2O3, the surface binding force of glass and SiO2 in the sintering process is improved, the strength of the substrate is improved to 220 MPa, and the ultralow dielectric constant LTCC substrate which is good in compactness and high in bending strength is obtained and is suitable for the fields of high-frequency communication and radio frequency.

Description

technical field [0001] The invention relates to the technical field of ceramic substrates, in particular to an LTCC substrate and a preparation method and application thereof. Background technique [0002] With the advent of 5G communication and the era of Internet of Everything, high-frequency applications have become a trend. In order to reduce signal transmission loss and speed up signal transmission rate, low dielectric constant low-temperature co-fired ceramic (LTCC) ceramic materials have received more and more attention. The widely used low dielectric ceramic powder is mostly made of glass + Al 2 o 3 system material, due to Al 2 o 3 The dielectric constant is relatively high (9-11), and the dielectric constant of existing material systems is generally higher than 5.0. It is difficult to further reduce the dielectric constant of porcelain powder. In the previous patent CN201910155188X, a material was disclosed, in glass+Al 2 o 3 Add SiO to the system 2 The way ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): C04B35/14C04B35/622C04B35/626C04B41/88C03C3/089C03B5/16
CPCC04B35/14C04B35/62665C04B35/6261C04B35/62605C04B35/62675C04B35/622C04B41/009C04B41/5116C04B41/88C03C3/089C03B5/16C04B2235/3217C04B2235/365C04B2235/6025C04B2235/612C04B2235/656C04B2235/6567C04B2235/96
Inventor 陈涛黄国洪崔三川曹秀华沓世我付振晓
Owner GUANGDONG FENGHUA ADVANCED TECH HLDG
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com