MEMS inertial sensor chip module and preparation method thereof

Abstract

The invention discloses an MEMS inertial sensor chip module and a preparation method thereof. The MEMS inertial sensor chip module comprises a shell, a PCB and a metal support column are fixed on the shell, an MEMS inertial sensor chip assembly is supported on the metal support column, and connecting terminals on the MEMS inertial sensor chip assembly are connected with connecting terminals on the PCB through metal wires. According to the invention, a primary packaging process is not needed, the packaging and integration cost is greatly reduced, the integration volume is reduced, the thermal stress caused by surface mounting is avoided, rapid heat conduction can be realized, various performance indexes of the MEMS inertial sensor chip level can be maintained, the application limitation of the prior art on an MEMS inertial sensor chip can be improved, and the influence of the thermal stress of the first-stage packaging or the second-stage packaging on the system integration application is avoided.

Description

technical field [0001] The invention relates to semiconductor devices, in particular to a MEMS inertial sensor chip module and a preparation method thereof, which are used for integrated assembly of inertial sensor chips such as MEMS gyroscopes and MEMS accelerometers. Background technique [0002] Inertial sensors based on MEMS technology have the advantages of light weight, low cost, small size, and mass production, and have extremely broad application and development prospects in civil, aerospace, and military fields; Ceramic shell package, plastic package, ceramic substrate COB package and other first-level packaging forms, and then adopt surface mount technology (SMT), chip direct mount technology (DCA), through-hole mount technology (THT) and other technologies, together with passive components Installed together on a PCB or other substrates (secondary packaging form) to become a component or a complete machine, the overall process is relatively complicated; or surface...

AI Technical Summary

Problems solved by technology

[0002] Inertial sensors based on MEMS technology have the advantages of light weight, low cost, small size, and mass production, and have extremely broad application and development prospects in civil, aerospace, and military fields; Ceramic shell package, plastic package, ceramic substrate COB package and other first-level packaging forms, and then adopt surface mount technology (SMT), chip direct mount technology (DCA), through-hole mount technology (THT) and other technologies, together with passive components Installed together on PCB or other substrates (secondary packaging form) to become a component or a complete machine, the overall process is relatively complicated; or use low-temperature solder paste for surface mounting, but it is not conducive to subsequent process development

[0003] In the process of first-level packaging and second-level packaging, due to the large difference in coefficient of thermal expansion (CTE) between materials, thermal stress and welding stress are easily caused, and MEMS inertial sensor chips are easily affected by packaging stress and welding stress, especially Full-temperature characteristic index; in single-chip integrated packaging, ASIC and MEMS chips are often stacked, and the heat generated by ASIC will also affect the output performance of MEMS; in addition, ceramic shells, ceramic substrates, plastic shells, etc. are molded or processed by themselves The cost is relatively high, it is not versatile, and the relative chip volume is obviously increased several times, or even larger, and the volume contradiction is particularly obvious in the application of inertial measurement unit (IMU) integration

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