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Low loss dielectric composite comprising a hydrophobized fused silica

A technology of composite materials and silicon dioxide, applied in the direction of circuit substrate materials, dielectric properties, electronic equipment, etc., can solve the difficulties of dielectric materials, affect peel strength, flammability grade thermal stability and oxidation stability, water absorption chemical resistance etc.

Pending Publication Date: 2021-10-01
ROGERS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, designing dielectric materials with low dissipative losses is difficult because modifying one element in a dielectric material to achieve the desired low dissipative losses often adversely affects other important parameters such as peel strength, flammability rating, thermal stability and oxidation stability, water absorption, or chemical resistance

Method used

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  • Low loss dielectric composite comprising a hydrophobized fused silica
  • Low loss dielectric composite comprising a hydrophobized fused silica
  • Low loss dielectric composite comprising a hydrophobized fused silica

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0077] Example 1: Preparation of Hydrophobized Fused Silica

[0078] A silane mixture of 194 grams (g) fluorosilane, 583 g phenylsilane, 179 g distilled water, 3 g 1.5 normal (N) hydrochloric acid, and 182 g dichloromethane was prepared while mixing. The silane mixture was stirred for 2 hours after the silane mixture became clear.

[0079] Add 85.5 pounds (lbs) (38.8 kilograms (kg)) of fused silica to the PK blend and distribute evenly. Start the blender and turn on the intensifier bar. The silane mixture was then filtered using an in-line 1 micron filter and added to the blender with the help of a peristaltic pump. The silane mixture was added at a constant rate over a 7 minute span. After adding the silane mixture, the intensifier rod was turned on for an additional 5 minutes, then the mixer and intensifier rod were turned off. Tap the outside of the blender with a hand hammer to help remove material from the inside surfaces of the blender, turn the blender 180 degrees a...

Embodiment 2

[0081] Embodiment 2: Preparation of thermosetting composition

[0082] Thermoset compositions as described in Table 2 were formed for the preparation of prepregs for woven glass reinforced composites.

[0083]

Embodiment 3-5

[0084] Examples 3-5: Formation of prepregs for woven glass reinforced composites

[0085] Prepregs were formed by treating glass fabrics 1, 2 or 3 with the thermosetting composition of Example 2. A single-ply prepreg or a stack of prepregs with 1 / 2 oz copper foil laminated. Table 3 shows various characteristics of the obtained laminate. In the tables, the weight % of the dielectric resin concentration is based on the total weight of the cured composite material comprising the glass fabric.

[0086]

[0087] Table 3 shows that composites formed from the present thermoset compositions exhibit a dielectric constant of 3.0 to 3.5 at 10 GHz and a dissipative loss of less than 0.005 at 10 GHz. The composites also exhibit good Tg values ​​and good CTE values ​​along the x, y and z directions.

[0088] Composite materials ranging in thickness from 76 microns to 798 microns resulting from the prepreg layers associated with Examples 3 to 5 all exhibited a UL94 V0 flammability r...

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Abstract

In an embodiment, a dielectric composite comprises a thermoset derived from a functionalized poly(arylene ether). a triallyl (iso)cyanurate, and a functionalized block copolymer; a hydrophobized fused silica; and a reinforcing fabric. The dielectric composite can be prepared by forming a thermosetting composition comprising the methacrylate functionalized poly(arylene ether), the triallyl (iso)cyanurate, the functionalized block copolymer, the hydrophobized fused silica, an initiator, and a solvent; coating the reinforcing fabric with the thermosetting composition; at least partially curing the thermosetting composition to form a prepreg; and optionally laminating the prepreg and at least one electrically conductive layer to form the circuit material.

Description

[0001] Cross References to Related Applications [0002] This application claims the benefit of U.S. Provisional Patent Application Serial No. 62 / 811,186, filed February 27, 2019. The related application is hereby incorporated by reference in its entirety. Background technique [0003] Circuit Materials High-performance circuit applications operating at high frequencies or high data rates benefit from materials with low dielectric loss (also known as dissipative loss) and low insertion loss. [0004] The dissipation factor is a measure of the rate at which energy is lost by an oscillating electrical mode in a dissipative system. Potential energy is dissipated to some extent in all dielectric materials, usually as heat, and can vary depending on the dielectric material and the frequency of the oscillating electrical signal. [0005] Insertion loss is the loss of a signal when entering or leaving a given circuit or entering or leaving a given component. Insertion loss is expr...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/03H05K1/02H05K3/02
CPCH05K2201/0133H05K2201/0158H05K2201/0355H05K1/0366H05K1/0373H05K2201/0239H05K2201/0209H05K1/024H05K2201/029H05K3/022C08J5/244C08J5/249B32B27/08B32B27/12B32B2255/02B32B2260/021B32B2260/046B32B2307/204B32B2307/3065B32B2371/00B32B2457/08B32B27/04B32B2457/00
Inventor 托马斯·A·库斯奥斯卡·奥祖娜·桑切斯
Owner ROGERS CORP