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Wafer and wafer processing method

A processing method and wafer technology, which is applied to grinding machine tools, manufacturing tools, grinding machines, etc., can solve problems such as wafer surface scratches and reduce the production yield of chips on the wafer, so as to simplify the processing process and improve the production yield. Effect

Active Publication Date: 2021-10-19
CHANGXIN MEMORY TECH INC
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0002] In the chip manufacturing process, impurities on the edge of the wafer are easily scattered on the polishing pad during the chemical mechanical polishing process, causing scratches on the wafer surface and reducing the production yield of chips on the wafer

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preparation example Construction

[0039] During the preparation of the semiconductor structure, impurity particles are likely to exist in the edge region of the wafer, and the impurity particles are easy to fall off in the subsequent processing process, for example, during the planarization process of the wafer, the impurity particles will fall off on the polishing pad , resulting in damage to the wafer during the grinding process, reducing the yield of the wafer; secondly, when the impurity particles will fall off to the central area of ​​the wafer, in the subsequent etching process, the etching will be incomplete and affect the etching pattern. Or, in the subsequent deposition process, the deposition effect is affected.

[0040] In the embodiment of the present application, pre-grinding the edge region of the wafer to be polished by the grinding pad and the polishing liquid can clean up the impurities in the edge region of the wafer to be polished, prevent the impurities from falling to the central region of ...

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Abstract

The embodiment of the invention provides a wafer and a wafer processing method, and relates to the technical field of semiconductors. The wafer processing method comprises the steps of providing a wafer to be ground, wherein the wafer to be ground comprises a central region and an edge region surrounding the central region; fixing the wafer to be ground onto a clamp, enabling the wafer to be ground to be bent, and bending the central region of the wafer to be ground towards the clamp; placing the bent wafer to be ground on a grinding pad, and grinding and removing the surface part of the edge region of the wafer to be ground through grinding liquid; adjusting the arrangement of the clamp, and enabling the wafer to be ground to be in a straight shape; and grinding the central region of the wafer to be ground by using the grinding pad. According to the embodiment of the invention, the edge region of the wafer to be ground is pre-ground, so that the impurities in the edge region of the wafer to be ground can be cleaned, the impurities are prevented from falling off and scratching the wafer, and the manufacturing yield of chips on the wafer is improved.

Description

technical field [0001] The embodiments of the present application relate to the technical field of semiconductors, and in particular, to a wafer and a wafer processing method. Background technique [0002] During the chip manufacturing process, impurities on the edge of the wafer are easily scattered on the polishing pad during the chemical mechanical polishing process, causing scratches on the wafer surface and reducing the production yield of chips on the wafer. Contents of the invention [0003] Embodiments of the present application provide a wafer and a wafer processing method, which can remove impurities in the edge region of the wafer to be ground, prevent the impurities from falling to the central area of ​​the wafer to be ground, prevent damage to the wafer to be ground, and improve the performance of the wafer to be ground. Grinding the production yield of chips on wafers. [0004] The first aspect of the embodiment of the present application provides a wafer pr...

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B37/00B24B27/033B24B37/27B24B37/11B24B37/20B24B37/30H01L21/306
CPCB24B37/00B24B27/033B24B37/27B24B37/11B24B37/20B24B37/30H01L21/30625
Inventor 马姣
Owner CHANGXIN MEMORY TECH INC