Three-dimensional model surface path planning method, system, equipment, terminal and application

Abstract

The invention belongs to the technical field of laser etching processing, and discloses a three-dimensional model surface path planning method, system and device, a terminal and application. The method comprises steps of solving the size of a divided area of a laser scanning galvanometer processed on a surface of the three-dimensional model every time by using a minimum bounding rectangle method according to the processing range and maximum processing focal depth of the scanning galvanometer of the laser etching processing system, and extracting a central point of the area as a positioning vertex of path planning; and then taking the positioning vertex set as an initial point set for three-dimensional model surface path planning, performing path planning on initial point positions in a space by using an improved chicken flock algorithm, and outputting and storing a planned positioning point index sequence. According to the method, the surface area of the three-dimensional model is divided based on the thought of partition processing and path planning, and the processing path is planned by using the improved chicken flock algorithm, so the length of a motion track in the laser etching processing process is greatly reduced, a distance for positioning and idle stroke is shortened, and processing efficiency is improved.

Description

technical field [0001] The invention belongs to the technical field of laser etching processing, and in particular relates to a three-dimensional model surface path planning method, system, equipment, terminal and application. Background technique [0002] At present, in the development of laser etching processing, surface processing technology for complex models has become a very important technical requirement. Nowadays, the shapes of the processed models are more and more diverse, and the etching processing of the surface is also more and more complicated. The larger the model, the more etching processing is required on the surface of the model, and the more times the five-axis processing machine tool needs to be positioned in the laser etching processing system, so the invalid stroke of the machine tool used for frequent movement to determine the next processing position is also more. many. If there is no reasonable processing route, the resulting invalid travel will b...

AI Technical Summary

Problems solved by technology

[0003] Through the above analysis, the existing problems and defects of the existing technology are: in the existing processing technology for complex model surfaces, the larger the model, the more etching processing is required on the model surface, and the five-axis processing of the laser etching processing system The more times the machine tool needs to be positioned, the more invalid strokes the machine tool uses to frequently move to determine the next processing position, and the resulting invalid strokes increase greatly, making the overall processing efficiency low

[0004] The difficulty in solving the above problems and defects is that the traditional path planning algorithms mainly used in laser processing, such as topology method, artificial potential field method, grid method, etc., take too long to calculate when dealing with large-scale models. Compared with the optimal planning path, the calculated processing path still has a large gap, the processing time is still very long, and it is still not ideal in terms of improving processing efficiency

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