A kind of cutting device for aluminum-based printed circuit board
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- 江油星联电子科技有限公司
- Publication Date
- 2021-12-14
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Abstract
Description
technical field
[0001] The invention relates to the related technical field of printed circuit board processing or material cutting equipment, in particular to a cutting device for aluminum-based printed circuit boards. Background technique
[0002] The aluminum substrate is a copper-clad printed board with an aluminum plate as the substrate, which is mainly composed of a metal circuit board material, copper foil, a thermally conductive insulating layer and an aluminum substrate. Among them, the circuit layer is equivalent to the copper clad laminate of ordinary PCB, and the thickness of the circuit copper foil is 1oz to 10oz. The insulating layer, which is a layer of low thermal resistance thermally conductive insulating material, has a thickness of 0.003 inches to 0.006 inches. The base layer is usually a metal substrate, usually aluminum or copper, aluminum-based copper-clad laminates or traditional epoxy glass cloth laminates, etc. The metal base layer is the supportin...