Additives to improve particle dispersion for cmp slurry
A chemical-mechanical, dispersant technology, applied in other chemical processes, chemical instruments and methods, polishing compositions containing abrasives, etc., can solve problems such as substrates that cannot meet strict quality requirements
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[0042] (1) In embodiment (1), a chemical mechanical polishing composition is presented, which comprises:
[0043] (a) from about 0.05% to about 10% by weight of abrasive;
[0044] (b) dispersant, wherein the dispersant is linear or branched C 2 -C 10 alkylene glycols; and
[0045] (c) water,
[0046] Wherein the chemical mechanical polishing composition has a pH of about 1 to about 7.
[0047] (2) The chemical mechanical polishing composition of embodiment (1) is presented in embodiment (2), wherein the composition comprises about 1% by weight to about 5% by weight of the abrasive.
[0048] (3) The chemical mechanical polishing composition of embodiment (1) or embodiment (2) is presented in embodiment (3), wherein the composition comprises about 2.5% by weight to about 3.5% by weight of the abrasive.
[0049] (4) In embodiment (4), the chemical mechanical polishing composition of any one of embodiments (1)-(3) is presented, wherein the abrasive is selected from treated al...
Embodiment 1
[0094] This example demonstrates the stability of polishing compositions comprising colloidal silica and dispersants according to embodiments of the invention.
[0095] As described in Table 1, Polishing Compositions 1A-1G comprised 3% by weight colloidal silica (Akzo Nobel CJ2-2), 1335 ppm malonic acid, 500 ppm glycine, 618 ppm of a 10% ferric nitrate solution, 2.5% by weight superoxide Hydrogen Oxide, Kathlon TM , and varying amounts of 1,4-butanediol (ie, dispersant), at a pH of 3, 4, or 5. The mean particle size (average particle size, average particle size). The results are displayed graphically in the figure 1 middle.
[0096] Table 1: pH and Amount of Dispersant for Polishing Compositions 1A-1G
[0097] polishing composition Dispersant (weight%) pH Initial average particle size (average particle size, average particle size) (nm) 1A (comparison) 0 3 80 1B (comparison) 0 4 80 1C (comparison) 0 5 80 1D (the present inventio...
Embodiment 2
[0101] This example demonstrates the stability of a polishing composition comprising alumina surface-treated with a sulfonic acid-containing polymer and a dispersant according to an embodiment of the invention.
[0102] As described in Table 2, Polishing Compositions 2A-2G contained 250 ppm alumina surface-treated with a sulfonic acid-containing polymer, 1080 ppm malonic acid, 1000 ppm lysine, 1000 ppm arginine, 500 ppm ferric nitrate, 0.5 % by weight hydrogen peroxide, Kathlon TM , and varying amounts of 1,4-butanediol (ie, dispersant), with a pH of 2 or 4. The average particle size (average particle size) was determined using a particle size analyzer commercially available from Malvern Panalytical (Malvern, UK) shortly after preparation of the polishing compositions and after storage at 45°C for 1, 2 and 3 weeks. The results are displayed graphically in the figure 2 middle.
[0103]Table 2: pH and Amount of Dispersant for Polishing Compositions 2A-2G
[0104] ...
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