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Test sample and preparation method thereof

A technology for testing samples and embolization, which is applied in the field of testing samples and their preparation, and can solve problems such as difficult testing and inaccurate testing results

Pending Publication Date: 2021-11-19
YANGTZE MEMORY TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, the test samples prepared in the related art have the problem of inaccurate test results or high difficulty in testing

Method used

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  • Test sample and preparation method thereof
  • Test sample and preparation method thereof
  • Test sample and preparation method thereof

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Embodiment Construction

[0029] In order to make the technical solutions and advantages of the embodiments of the present invention clearer, the specific technical solutions of the present invention will be further described in detail below in conjunction with the drawings in the embodiments of the present invention.

[0030] Taking a three-dimensional memory as an example for illustration, the three-dimensional memory may include a plurality of plug holes, and each plug hole is filled with a first conductive material, such as tungsten. The connection between the storage array or the peripheral circuit and the interconnection layer is realized through the first conductive material filled in the plug hole, so as to realize the connection between the storage array or the peripheral circuit and the external device.

[0031] In the process of testing and analyzing the electrical conditions between the two plugs of the three-dimensional memory, it is necessary to remove all the silicon substrates on the bac...

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Abstract

The embodiment of the invention provides a test sample and a preparation method thereof. The preparation method comprises the following steps: providing a chip, wherein the chip comprises a substrate positioned on the back surface of the chip; removing the substrate by using an etching process so as to expose the plug layer of the chip, wherein the exposed plug layer comprises a first plughole and a second plug hole, the positions of the first plug hole and the second plug hole in the chip are different; and at least filling the first plug hole and the second plug hole with a first conductive material so as to form a first plug in the first plug hole and form a second plug in the second plug hole, so that the test sample is obtained.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a test sample and a preparation method thereof. Background technique [0002] With the development of semiconductor chip technology, the degree of integration is getting higher and higher, and the required semiconductor chip manufacturing technology is becoming more and more sophisticated. During the semiconductor chip manufacturing process or when the manufacturing is completed, it is necessary to test the parameters related to the semiconductor chip. To monitor whether the produced semiconductor chips meet the process requirements, whether the yield rate is qualified, etc., and through testing the relevant parameters of the semiconductor chip, find out the cause of the chip abnormality, and provide a basis for the corresponding process improvement. [0003] However, the test samples prepared in the related art have the problem of inaccurate test results or high difficult...

Claims

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Application Information

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IPC IPC(8): H01L21/66
CPCH01L22/30
Inventor 付燕丽
Owner YANGTZE MEMORY TECH CO LTD