Pair of packaging adhesive films and photovoltaic module using same
An encapsulation film and photovoltaic module encapsulation technology, used in photovoltaic power generation, film/sheet adhesives, adhesives, etc., can solve problems such as module overflowing bubbles, cell cracks, and cell conductive adhesive degumming. , to achieve the effect of preventing glue overflow and reducing fluidity
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Embodiment 1
[0068] A pair of encapsulating films, denoted as S1, includes a first encapsulating film and a second encapsulating film.
[0069] Wherein the first packaging adhesive film is prepared by the following method:
[0070] The first packaging film comprises: 100 parts by weight of EVA resin with a melt index of 40 g / 10min and 33% VA content, 0.5 parts by weight of tert-butyl peroxyisopropyl carbonate, and 1 part by weight of trimethylolpropane trimethyl acrylate, 2 parts by weight of γ-aminopropyltriethoxysilane, and 0.1 part by weight of bis-2,2,6,6-tetramethylpiperidinol sebacate.
[0071]Mix the above composition evenly, add it into the extruder, extrude it through a T-shaped flat die to form a film, pass through the drying tunnel heating device, the pre-crosslinking degree is 0.01%, and wind up to obtain an encapsulation film with an ML value of 0.08dN·m S1-1.
[0072] Wherein the second packaging adhesive film is prepared by the following method:
[0073] The second encaps...
Embodiment 2
[0080] A pair of encapsulation films, denoted as S2, includes a first encapsulation film and a second encapsulation film.
[0081] Wherein the first packaging adhesive film is prepared by the following method:
[0082] The first packaging film comprises: 100 parts by weight of EVA resin with a melt index of 40 g / 10min and 33% VA content, 0.5 parts by weight of tert-butyl peroxyisopropyl carbonate, and 1 part by weight of trimethylolpropane trimethyl acrylate, 2 parts by weight of γ-aminopropyltriethoxysilane, and 0.1 part by weight of bis-2,2,6,6-tetramethylpiperidinol sebacate.
[0083] Mix the above composition evenly, add it to the extruder, extrude it into a film through a T-shaped flat die, and realize pre-crosslinking through the drying tunnel heating device. The pre-crosslinking degree is 0.01%, and the ML value is 0.08dN m by winding The packaging film S2-1.
[0084] Wherein the second packaging adhesive film is prepared by the following method:
[0085] The second ...
Embodiment 3
[0092] A pair of encapsulation films, denoted as S3, includes a first encapsulation film and a second encapsulation film.
[0093] Wherein the first packaging adhesive film is prepared by the following method:
[0094] The first packaging film includes: 100 parts by weight of ethylene-α-octene copolymer with a melt index of 10 g / 10min, 0.5 parts by weight of 2,5-dimethyl-2,5-bis(tert-butyl peroxy ) hexane, 0.6 parts by weight of trimethylolpropane trimethacrylate, 0.4 parts by weight of pentaerythritol triacrylate, 0.4 parts by weight of vinyltrimethoxysilane, 0.1 parts by weight of bis-2 sebacate, 2,6,6-Tetramethylpiperidinol ester.
[0095] Mix evenly; add to the extruder, extrude through a T-shaped flat die to form a film, pass through the drying tunnel heating device, the pre-crosslinking degree is 4%, and the encapsulation film S3-1 with an ML value of 0.2dN m is obtained by winding .
[0096] Wherein the second packaging adhesive film is prepared by the following meth...
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