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Pair of packaging adhesive films and photovoltaic module using same

An encapsulation film and photovoltaic module encapsulation technology, used in photovoltaic power generation, film/sheet adhesives, adhesives, etc., can solve problems such as module overflowing bubbles, cell cracks, and cell conductive adhesive degumming. , to achieve the effect of preventing glue overflow and reducing fluidity

Pending Publication Date: 2021-11-26
HANGZHOU FIRST APPLIED MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] The main purpose of the present invention is to provide a pair of encapsulating adhesive films, a composition forming them and a photovoltaic module, so as to solve the problem of debonding of the conductive adhesive between the cells in the existing photovoltaic module lamination process, and the hidden cracks of the cells, Components have adverse conditions such as overflow glue bubbles

Method used

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  • Pair of packaging adhesive films and photovoltaic module using same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0068] A pair of encapsulating films, denoted as S1, includes a first encapsulating film and a second encapsulating film.

[0069] Wherein the first packaging adhesive film is prepared by the following method:

[0070] The first packaging film comprises: 100 parts by weight of EVA resin with a melt index of 40 g / 10min and 33% VA content, 0.5 parts by weight of tert-butyl peroxyisopropyl carbonate, and 1 part by weight of trimethylolpropane trimethyl acrylate, 2 parts by weight of γ-aminopropyltriethoxysilane, and 0.1 part by weight of bis-2,2,6,6-tetramethylpiperidinol sebacate.

[0071]Mix the above composition evenly, add it into the extruder, extrude it through a T-shaped flat die to form a film, pass through the drying tunnel heating device, the pre-crosslinking degree is 0.01%, and wind up to obtain an encapsulation film with an ML value of 0.08dN·m S1-1.

[0072] Wherein the second packaging adhesive film is prepared by the following method:

[0073] The second encaps...

Embodiment 2

[0080] A pair of encapsulation films, denoted as S2, includes a first encapsulation film and a second encapsulation film.

[0081] Wherein the first packaging adhesive film is prepared by the following method:

[0082] The first packaging film comprises: 100 parts by weight of EVA resin with a melt index of 40 g / 10min and 33% VA content, 0.5 parts by weight of tert-butyl peroxyisopropyl carbonate, and 1 part by weight of trimethylolpropane trimethyl acrylate, 2 parts by weight of γ-aminopropyltriethoxysilane, and 0.1 part by weight of bis-2,2,6,6-tetramethylpiperidinol sebacate.

[0083] Mix the above composition evenly, add it to the extruder, extrude it into a film through a T-shaped flat die, and realize pre-crosslinking through the drying tunnel heating device. The pre-crosslinking degree is 0.01%, and the ML value is 0.08dN m by winding The packaging film S2-1.

[0084] Wherein the second packaging adhesive film is prepared by the following method:

[0085] The second ...

Embodiment 3

[0092] A pair of encapsulation films, denoted as S3, includes a first encapsulation film and a second encapsulation film.

[0093] Wherein the first packaging adhesive film is prepared by the following method:

[0094] The first packaging film includes: 100 parts by weight of ethylene-α-octene copolymer with a melt index of 10 g / 10min, 0.5 parts by weight of 2,5-dimethyl-2,5-bis(tert-butyl peroxy ) hexane, 0.6 parts by weight of trimethylolpropane trimethacrylate, 0.4 parts by weight of pentaerythritol triacrylate, 0.4 parts by weight of vinyltrimethoxysilane, 0.1 parts by weight of bis-2 sebacate, 2,6,6-Tetramethylpiperidinol ester.

[0095] Mix evenly; add to the extruder, extrude through a T-shaped flat die to form a film, pass through the drying tunnel heating device, the pre-crosslinking degree is 4%, and the encapsulation film S3-1 with an ML value of 0.2dN m is obtained by winding .

[0096] Wherein the second packaging adhesive film is prepared by the following meth...

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Abstract

The invention discloses a pair of packaging adhesive films, which is used for packaging a photovoltaic module and at least comprises a first packaging adhesive film and a second packaging adhesive film, the absolute value of the ML value difference value of the first packaging adhesive film and the second packaging adhesive film is 0-0.35 dN.m, and the photovoltaic module comprises the pair of packaging adhesive films. According to the pair of packaging adhesive films, the flowability of any two layers of adhesive films in the photovoltaic module can be adapted in the laminating process, the problems of conductive adhesive degumming, subfissure and fragment of a battery piece and the like caused by mismatching of the flowability of the adhesive films in the module laminating process can be avoided, the appearance problem of adhesive overflow of the photovoltaic module is prevented, and bubble generating in the laminating process is avoided.

Description

technical field [0001] The invention relates to a photovoltaic material and a photovoltaic module, in particular to a pair of packaging adhesive films used for photovoltaic packaging and a photovoltaic module using the same. Background technique [0002] Photovoltaic modules are important devices that convert solar energy into electrical energy by using the photovoltaic effect. In today's society, the contradiction between environment and energy is becoming more and more prominent. Among all new energy sources, solar energy has the characteristics of large reserves, renewable and environmental friendliness, making photovoltaic power generation an important new energy development direction. favored by. [0003] Photovoltaic modules are sequentially laminated and laminated by encapsulating the front plate, the front encapsulating adhesive film, the cell layer, the rear encapsulating adhesive film, and the encapsulating back plate. When the film is heated, flow cross-linking ...

Claims

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Application Information

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IPC IPC(8): C09J7/10C09J7/30C09J4/06C09J4/02H01L31/048
CPCC09J7/10C09J7/30C09J4/06H01L31/0481C09J2203/326Y02E10/50
Inventor 张浙南周光大李伯耿彭瑞群魏梦娟
Owner HANGZHOU FIRST APPLIED MATERIAL CO LTD