Unlock instant, AI-driven research and patent intelligence for your innovation.

Power element with zener diodes

A technology of Zener diodes and power components, applied in the direction of diodes, electrical components, transistors, etc., can solve problems such as inability to effectively reduce product volume, limit the design range of output voltage, increase complexity, etc., and achieve wide design range and high degree of change , The effect of simplifying the complexity of the process

Pending Publication Date: 2021-11-26
CYSTECH ELECTRONICS CORP
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this connection method between circuit elements and power elements will increase the complexity of product manufacturing and cannot effectively reduce the volume of the product
Furthermore, the design range of the output voltage of the existing power components has certain limitations.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Power element with zener diodes
  • Power element with zener diodes
  • Power element with zener diodes

Examples

Experimental program
Comparison scheme
Effect test

no. 1 example

[0036] see Figure 1A to Figure 1H , figure 2 and image 3 As shown, the first embodiment of the present invention provides a method for manufacturing a power device 100 . The manufacturing method of the power device includes steps S110 to S180. in, Figure 1A to Figure 1H It is a schematic flow chart of the manufacturing method of the power element according to the first embodiment of the present invention, figure 2 It is a schematic cross-sectional view of a power element according to the first embodiment of the present invention (indicates the equivalent circuit corresponding to the element structure), and image 3 is an equivalent circuit diagram of a power element according to the first embodiment of the present invention.

[0037] It must be noted that the order of the steps and the actual operation mode in this embodiment can be adjusted according to the needs, and are not limited to the one in this embodiment.

[0038] The power device 100 of this embodiment is a...

no. 2 example

[0097] see Figure 4 and Figure 5 As shown, the second embodiment of the present invention also provides a power element 100'. Figure 4 is a partial schematic diagram of a power element according to the second embodiment of the present invention, and Figure 5 is an equivalent circuit diagram of a power element according to the second embodiment of the present invention.

[0098] The structural design of the power element 100' of the second embodiment of the present invention is substantially the same as that of the above-mentioned first embodiment, except that the power element 100' of this embodiment includes a plurality of zener diodes 4 (V Z1 to V ZN ), which is configured to receive a reverse bias.

[0099] Such as Figure 4 shown, a plurality of the Zener diodes 4 (V Z1 to V ZN ) are formed on the cladding insulating layer 23 of the insulating layer 2 in series with each other, and are located in the Zener diode forming region B1 of the circuit element forming r...

no. 3 example

[0105] see Image 6 and Figure 7As shown, the third embodiment of the present invention also provides a power element 100". Image 6 is a partial schematic diagram of a power element according to a third embodiment of the present invention, and Figure 7 is an equivalent circuit diagram of a power element according to a third embodiment of the present invention.

[0106] The structural design of the power element 100 ″ of the third embodiment of the present invention is substantially the same as that of the above-mentioned second embodiment, the difference is that the power element 100 ″ of this embodiment further includes a plurality of common diodes 7 (V F1 to V FN ), and a plurality of the ordinary diodes 7 (V F1 to V FN ) is further connected in series with the aforementioned plurality of zener diodes 4 (V Z1 to V ZN ).

[0107] In this embodiment, a plurality of common diodes 7 (V F1 to V FN ) is also formed on the cladding insulating layer 23 of the insulating...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
Thicknessaaaaaaaaaa
Login to View More

Abstract

The invention discloses a power element with Zener diodes. The power element comprises a substrate structure, an insulating layer, a dielectric layer, a transistor and the plurality of Zener diodes, wherein the transistor is located in a transistor formation region of the substrate structure, and the plurality of Zener diodes are located in the circuit element forming region of the substrate structure and are connected in series with each other. Each Zener diode comprises a Zener diode doped structure and a Zener diode metal structure, the Zener diode doped structure is formed on the insulating layer and covered by the dielectric layer, the Zener diode doped structure comprises a P-type doped region and an N-type doped region which are connected with each other, and the Zener diode metal structure is formed on the dielectric layer and partially penetrates through the dielectric layer so as to be electrically connected to the P-type doped region and the N-type doped region of the Zener diode doped structure. According to the power element with the Zener diodes of the invention, various power element products with different output voltages can be designed by adjusting the number of the Zener diodes.

Description

technical field [0001] The invention relates to a power element, in particular to a power element with a zener diode. Background technique [0002] In the existing power components, such as: metal oxide semiconductor field effect transistor (MOSFET), bipolar junction transistor (BJT), if it is necessary to add other circuit components (such as: resistors or Zener diodes) in the circuit design ) to form electronic circuits with specific functions, these circuit components need to be electrically connected to power components by welding. However, this connection method between the circuit element and the power element will increase the complexity of product manufacturing and cannot effectively reduce the volume of the product. Furthermore, the design range of the output voltage of the existing power elements is limited to a certain extent. [0003] Therefore, the inventor feels that the above-mentioned deficiency can be improved, so he devoted himself to research and combine...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H01L27/06H01L21/8249
CPCH01L27/0629H01L21/8249
Inventor 徐信佑
Owner CYSTECH ELECTRONICS CORP