Involute laser-assisted wafer cutting processing method and system and stress detection method
A laser-assisted cutting processing technology, applied in laser welding equipment, metal processing equipment, welding/welding/cutting items, etc., can solve the problems of large residual stress and high roughness of the incision, achieve low residual stress and improve detection speed and stability, smooth cut
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[0057] In order to make the purpose, technical solution and advantages of the present application clearer, the present application will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present application, and are not intended to limit the present application.
[0058] In the description of the present invention, unless otherwise stated, the terms "comprising", "having" and any variations thereof are intended to cover a non-exclusive inclusion, for example, a process, method, system, Products or equipment are not necessarily limited to those steps or units that have been explicitly listed, but may also include other steps or units that are not explicitly listed but inherent to these processes, methods, products or equipment, or further The steps or units added by the optimization scheme.
[0059] An embodiment of the present inve...
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