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Preparation method of yttrium-containing high-thermal-conductivity die-casting aluminum-silicon-copper alloy without heat treatment

A technology of silicon-copper alloy and high thermal conductivity, which is applied in the field of aluminum alloy preparation, can solve the problems of high cost and achieve the effects of low production cost, reduced resistivity, and reduced scattering effect

Active Publication Date: 2021-12-17
GUANGXI UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the preparation process of die-casting aluminum alloy, heat treatment steps are generally carried out, because its comprehensive performance is greatly improved after heat treatment, but the corresponding cost is also high

Method used

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  • Preparation method of yttrium-containing high-thermal-conductivity die-casting aluminum-silicon-copper alloy without heat treatment
  • Preparation method of yttrium-containing high-thermal-conductivity die-casting aluminum-silicon-copper alloy without heat treatment
  • Preparation method of yttrium-containing high-thermal-conductivity die-casting aluminum-silicon-copper alloy without heat treatment

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Embodiment 1

[0049] A method for preparing a yttrium-containing high thermal conductivity die-casting aluminum-silicon-copper alloy without heat treatment, comprising the following steps:

[0050] (1) Prepare various raw materials in proportion: pure aluminum ingot, Al-Cu master alloy, Al-Fe master alloy, Al-Y master alloy, Si element;

[0051] (2) After the surface of the pure aluminum ingot is cleaned and dried, it is melted into molten aluminum in an induction furnace, and its melting temperature is 740°C;

[0052] (3) When the temperature of the aluminum liquid reaches 740°C, add the dried Al-Cu master alloy and Al-Fe master alloy to the aluminum liquid, then raise the temperature to 760°C and keep it warm for 20 minutes;

[0053] (4) Add Si element after the heat preservation is completed, and continue to heat for 20 minutes after the Si element melts;

[0054] (5) Cool down the mixed aluminum liquid to 740°C, add Al-Y intermediate alloy, and keep warm for 25 minutes after it is comp...

Embodiment 2

[0060] The difference from Example 1 is that the mass percent of each component is: silicon 9.5%, copper 1.4%, iron 0.9%, rare earth yttrium 0.2%, impurity elements ≤ 0.1%, the rest is aluminum, and the rest of the steps are the same.

Embodiment 3

[0062] The difference from Example 1 is that the mass percent of each component is: silicon 11%, copper 1.6%, iron 0.8%, rare earth yttrium 0.3%, impurity elements ≤ 0.1%, the rest is aluminum, and the rest of the steps are the same.

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Abstract

The invention relates to a preparation method of a yttrium-containing high-thermal-conductivity die-casting aluminum-silicon-copper alloy without heat treatment, which can obtain a high-thermal-conductivity aluminum alloy with heat-conducting property and comprehensive mechanical property superior to those of ADC12 by perfecting the process and adding a proper amount of rare earth yttrium as an alterant and a refiner without adding any heat treatment procedure. The aluminum-silicon-copper alloy comprises the following components in percentage by mass: 9.0-11.5% of silicon, 1.4-1.6% of copper, 0.7-1.0% of iron, 0-0.5% of rare earth yttrium, less than or equal to 0.2% of impurity elements and the balance of aluminum. The yttrium-containing high-thermal-conductivity die-casting aluminum-silicon-copper alloy prepared by the preparation method disclosed by the invention is relatively low in production cost, high in thermal conductivity and electrical conductivity, suitable for electronic products, communication base stations, large-scale LED lighting equipment and the like, and capable of being subjected to industrial production.

Description

technical field [0001] The invention belongs to the technical field of aluminum alloy preparation, in particular to a method for preparing a yttrium-containing high thermal conductivity die-casting aluminum-silicon-copper alloy without heat treatment. Background technique [0002] Aluminum alloy is widely used in various industries due to its low density, high specific strength, excellent electrical and thermal conductivity, easy processing, easy recycling and low price, such as automobile manufacturing, aerospace, transportation, communication, electronics, etc. and other fields. With the continuous development of modern science and technology, the cooling shells of electronic products, communication base stations and large-scale LED lighting equipment are all developing towards miniaturization, light weight and integration, but the heat generation per unit volume has increased sharply, so These industries put forward more stringent requirements on the heat dissipation per...

Claims

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Application Information

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IPC IPC(8): C22C1/03C22C1/06C22C21/02
CPCC22C1/03C22C1/026C22C1/06C22C21/02
Inventor 汤宏群周嘉昶彭昱晨陈思敏文灵有尹志新甘培原韦德仕胡振光
Owner GUANGXI UNIV