A device and method for reducing the influence of dynamic protective gas on temperature control in heat treatment process

Abstract

The invention discloses a device and a method for reducing the influence of dynamic protective gas on temperature control in a heat treatment process, comprising: a removal chamber, which is provided with a uniform gas ring and a heating unit; and a sample tray unit, which is arranged inside the removal chamber , including: a sample holder with a heat insulating seat on which a porous sample pan is placed; a multi-layer metal constant temperature cover, which is nested on the heat insulating seat, and the multi-layer metal constant temperature cover completely covers the porous sample pan The sides of each multi-layer metal constant temperature cover are provided with ventilation holes; the two ends of the porous sample tray are respectively provided with a precision temperature measurement probe A and a precision temperature measurement probe B, and the precision temperature measurement probe A and the precision temperature measurement probe B extend into the multi-layer metal constant temperature cover; the removal chamber is respectively connected with a vacuum system, an air intake system and an exhaust system, and the air intake system is connected with the homogeneous ring. The invention greatly reduces the influence of the dynamic flow of the protective gas on the temperature measurement of the heat treatment sample, and greatly improves the controllability and repeatability of the process.

Description

technical field [0001] The invention belongs to the technical field of precise temperature control heat treatment, and more particularly, the invention relates to a device and method for reducing the influence of dynamic protective gas on temperature control in a heat treatment process. Background technique [0002] The precision temperature-controlled heat treatment process is widely used in scientific research and production. In many cases, the precision temperature-controlled heat treatment process requires pre-evacuation and a protective carrier gas (such as high-purity nitrogen or argon) throughout the process to reduce oxygen. or other impurity gases on the heat treatment process. For example, mandrel removal technology is a common method for preparing hollow microspheres. Taking the preparation of hollow GDP (glow discharge plasma polymer) microspheres as an example, it mainly has three steps. First, hollow PAMS (poly-α-methylbenzene) is prepared. Ethylene) microsphe...

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Problems solved by technology

[0004] In the prior art mandrel removal technology to prepare hollow microspheres in the heat treatment process, after the protective gas is introduced, due to the change of the air flow in the treatment chamber, the temperature of the atmosphere will also change with the change of the pressure in the treatment chamber, and it will also affect the degradation chamber. The uniformity of temperature has a great influence. Due to the position difference between the temperature measuring probe and the actual sample, there will be a large deviation between the actual degradation temperature on the sample and the measured temperature of the probe.

In this way, after the dynamic protective gas is introduced, the accuracy and controllability of the temperature measurement during the precision temperature control heat treatment process will be deteriorated.

After the heat treatment of the microspheres, the process cannot accurately ensure the important technical indicators such as the geometric parameters, light transmittance and surface quality of the microspheres, which makes the controllability and repeatability of the process engineering obvious shortcomings

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