Preparation process and application of solder resist adhesive layer

A preparation process and technology of solder mask, applied in the field of H05K, can solve the problems of uniformity of dry film thickness, unevenness of coating thickness, lower production efficiency, etc., and achieve good bonding effect, good developing effect, and good opening high precision effect

Active Publication Date: 2021-12-21
常州硕成半导体材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

201480001532.5 synthesized a resin composition through oligomers, resins, monomers and inorganic particles, and dried the resin composition by directly coating it on the carrier film. However, this method has the problem of uneven coating thickness. Resulting in unstable performance during the application process; 201710098304.X The dry film obtained by resin, plasticizer, adhesive, etc. is directly applied to the PCB board for multiple exposures and developments, but it does not solve the thickness of the dry film Uniformity, simultaneous multiple exposure and development operations are complicated, which greatly reduces production efficiency

Method used

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  • Preparation process and application of solder resist adhesive layer
  • Preparation process and application of solder resist adhesive layer

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0063] Embodiment 1 of the present invention provides a preparation process of a solder resist adhesive layer, which is as follows: add ethylene glycol monomethyl ether to the coating film reactant obtained by mixing to make the viscosity reach 20cPs, and then spray it on the coating material with 5m Coating at a speed of / min to obtain a wet adhesive layer, and then drying at 40°C for 30 minutes to obtain a solder resist adhesive layer, and then bonding the surface of the solder resist adhesive layer to the protective film at 40°C to obtain a 60 μm solder resist adhesive layer; in parts by weight, 18 parts of models are kpl-12365 in the film reactant, purchased from Shandong Kepler Biotechnology Co., Ltd. epoxy acrylic resin, 18 parts of pentaacrylate dipentaerythritol, 8 parts of purchased T31 epoxy resin curing agent from Jinan Linhai Chemical Co., Ltd., 25 parts of talcum powder purchased from Kuandian Manchu Autonomous County Sanxing Mining Co., Ltd., and 14 parts of N-met...

Embodiment 2

[0066] Embodiment 2 of the present invention provides a preparation process of a solder resist adhesive layer, which is as follows: add ethylene glycol monomethyl ether to the coating film reactant obtained by mixing to make the viscosity reach 20000cPs, and then place it on the coating material at 20m Coating at a speed of 1 / min to obtain a wet adhesive layer, and then drying at 150 ° C for 1 min to obtain a solder resist adhesive layer, and then attach the surface of the solder resist adhesive layer to the protective film at 100 ° C to obtain a 60 μm solder resist adhesive layer; in parts by weight, 18 parts of models are kpl-12365 in the film reactant, purchased from Shandong Kepler Biotechnology Co., Ltd. epoxy acrylic resin, 18 parts of pentaacrylate dipentaerythritol, 8 parts of purchased T31 epoxy resin curing agent from Jinan Linhai Chemical Co., Ltd., 25 parts of talcum powder purchased from Kuandian Manchu Autonomous County Sanxing Mining Co., Ltd., and 14 parts of N-...

Embodiment 3

[0069] Embodiment 3 of the present invention provides a preparation process of a solder resist adhesive layer, which is as follows: add ethylene glycol monomethyl ether to the coating film reactant obtained by mixing to make the viscosity reach 10000cPs, and then apply it on the coating material with 12m Coating at a speed of / min to obtain a wet adhesive layer, and then drying at 120°C for 10 minutes to obtain a solder resist adhesive layer, and then bonding the surface of the solder resist adhesive layer and the protective film at 65°C to obtain a 60μm solder resist adhesive layer; in parts by weight, 18 parts of models are kpl-12365 in the film reactant, purchased from Shandong Kepler Biotechnology Co., Ltd. epoxy acrylic resin, 18 parts of pentaacrylate dipentaerythritol, 8 parts of purchased T31 epoxy resin curing agent from Jinan Linhai Chemical Co., Ltd., 25 parts of talcum powder purchased from Kuandian Manchu Autonomous County Sanxing Mining Co., Ltd., and 14 parts of ...

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Abstract

The invention relates to the technical field of H05K, and concretely relates to a preparation process and application of a solder resist adhesive layer. The preparation process of the solder resist adhesive layer comprises the following steps: adding a glycol ether substance into a film coating reactant obtained by mixing to enable the viscosity of the film coating reactant to reach 20-20000 cPs, then coating a coating material with the film coating reactant to obtain a wet adhesive layer, and then drying to obtain the solder resist adhesive layer, thereby obtaining the solder resist adhesive layer. The coating reactant comprises acidic photosensitive resin, a polymeric monomer, an initiation reactant, a cured product, a natural filler and a solvent. The solder resist adhesive layer obtained by the invention is high in flatness, uniform in thickness and good in adhesiveness with a circuit board.

Description

technical field [0001] The present invention relates to the technical field of H05K, more specifically, the present invention relates to a preparation process and application of a solder resist adhesive layer. Background technique [0002] Solder mask is more and more widely used in circuit board applications. 201480001532.5 A resin composition was synthesized by oligomers, resins, monomers and inorganic particles, and the resin composition was directly coated on the carrier film to dry. However, this method has the problem of uneven coating thickness. Resulting in unstable performance during the application process; 201710098304.X The dry film obtained by resin, plasticizer, adhesive, etc. is directly applied to the PCB board for multiple exposures and developments, but it does not solve the thickness of the dry film Uniformity, while multiple exposure and development operations are complicated, which greatly reduces production efficiency. Contents of the invention [0...

Claims

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Application Information

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IPC IPC(8): H05K3/28H05K3/00H05K3/22
CPCH05K3/282H05K3/0082H05K3/227
Inventor 孙军梁广意陆乾刚
Owner 常州硕成半导体材料有限公司
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