Chemical silver plating and deplating method for surface of ceramic copper-clad substrate

A technology of ceramic copper cladding and substrate surface, applied in the direction of liquid chemical plating, coating, metal material coating process, etc., can solve problems such as troublesome operation, poor adhesion of electroplating layer, over-corrosion of base metal, etc., and achieve saving Production cost, enhanced flame retardancy, effect of improved compatibility

Pending Publication Date: 2021-12-28
江苏富乐华半导体科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Similarly, if the operating conditions are not suitable for the characteristics of the product, although the coating is removed, the base metal will also produce "over-corrosion". The adhesion of the coating becomes poor, so grinding or leveling is necessary to obtain a high-quality surface coating, and the operation is quite troublesome. Therefore, the composition of the deplating solution and the deplating conditions vary depending on the type of coating and the base metal. different

Method used

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  • Chemical silver plating and deplating method for surface of ceramic copper-clad substrate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0033] Embodiment 1: Soak the defective silver-plated product in the deplating solution, and observe the deplating situation.

[0034] Before deplating: the surface of the ceramic copper-clad substrate is a silver-plated layer;

[0035] After deplating: The ceramic copper-clad substrate is restored to the original color of copper, and there is no silver layer residue on the surface, no over-corrosion and blackening of the substrate, and the surface of the ceramic copper-clad substrate is smooth and flat.

Embodiment 2

[0036] Embodiment 2: described preparation process comprises the following steps:

[0037] S1: Take the ceramic copper-clad substrate and plate it with silver;

[0038] S2: Select defective products and perform deplating;

[0039] S3: washing the stripped ceramic copper-clad substrate with water, neutralizing, washing with water again, drying, and preparing for silver plating.

[0040] Described deplating comprises the following steps:

[0041] S1: Configure the deplating solution: mix potassium permanganate, sodium hydroxide, and ammonia water evenly;

[0042] S2: Deplating: immerse the ceramic copper-clad substrate in the deplating solution, and after deplating, inject carbon monoxide into the deplating solution to recover elemental silver;

[0043] S3: ultrasonically treating the stripped ceramic copper-clad substrate for 3 minutes.

[0044] The materials required for the stripping solution in the step S1 include, in terms of concentration: 10 g / L of potassium permangan...

Embodiment 3

[0057] Embodiment 3: described preparation process comprises the following steps:

[0058] S1: Take the ceramic copper-clad substrate and plate it with silver;

[0059] S2: Select defective products and perform deplating;

[0060] S3: washing the stripped ceramic copper-clad substrate with water, neutralizing, washing with water again, drying, and preparing for silver plating.

[0061] Described deplating comprises the following steps:

[0062] S1: Configure the deplating solution: mix potassium permanganate, sodium hydroxide, and ammonia water evenly;

[0063] S2: Deplating: immerse the ceramic copper-clad substrate in the deplating solution, and after deplating, inject carbon monoxide into the deplating solution to recover elemental silver;

[0064] S3: ultrasonically treating the stripped ceramic copper-clad substrate for 3.5 minutes.

[0065] The materials required for the stripping solution in the S1 step include, in terms of concentration: potassium permanganate 11g / ...

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PUM

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Abstract

The invention discloses a chemical silver plating and deplating method for the surface of a ceramic copper-clad substrate. The preparation process comprises the following steps that S1, the ceramic copper-clad substrate is taken, and silver plating is carried out; S2, defective products are selected for deplating; and S3, the deplated ceramic copper-clad substrate is subjected to water washing, neutralization, water washing again and drying, and then silver plating is prepared. The deplating comprises the following steps of S1, preparing a deplating solution; S2, carrying out deplating, specifically, immersing the ceramic copper-clad substrate in the deplating solution, and introducing carbon monoxide into the deplating solution after deplating; and S3, carrying out ultrasonic treatment on the deplated ceramic copper-clad substrate for 3-5 minutes. By means of the chemical silver plating and deplating method, the prepared deplating solution solves the problem that secondary silver plating performance is affected due to incomplete deplating and local silver plating layer residues, and the phenomena of floating, pocking marks, pinholes, roughness, unevenness and the like caused by over-corrosion of the surface of the ceramic copper-clad substrate due to deplating are avoided; and elemental silver can be recycled by introducing the carbon monoxide, so that the cost is saved, and the prepared ceramic copper-clad substrate is good in heat resistance.

Description

technical field [0001] The invention relates to the field of ceramic copper-clad substrate preparation technology and surface plating technology, in particular to a method for electroless silver plating and deplating on the surface of a ceramic copper-clad substrate. Background technique [0002] During the process of electroplating or chemical plating, due to various reasons, the quality of the coating is not good, and various defects appear, such as rough and uneven crystallization, foaming, poor bonding force, dark color, and some coatings have cracks, missed plating, Pinholes or spots etc. When there are defects in the coating, the coating should be removed and re-plated to obtain a good coating quality. [0003] Deplating: It is an inevitable treatment process in the field of electroplating. It is a process of using chemical reagents to dissolve and remove the metal coating deposited on the metal or non-metal surface. Different coatings choose different deplating solu...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23F1/40C23D5/00C23C18/42C22B7/00C22B11/00C03C8/00
CPCC23F1/40C23D5/00C23C18/42C22B7/006C22B11/046C03C8/00Y02P10/20
Inventor 李辛未贺贤汉李炎马敬伟
Owner 江苏富乐华半导体科技股份有限公司
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