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Composites for high-frequency printed circuit boards and methods of making

A technology of composites and polymers, applied in printed circuits, printed circuits, printed circuit components, etc., can solve problems such as poor bonding properties, poor post-processing capabilities, and insufficient dimensional stability

Pending Publication Date: 2021-12-28
CORNING INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

PTFE-based composites suffer from poor post-processing capabilities (e.g., insufficient dimensional stability during machining), and / or poor bonding properties (e.g., insufficient adhesion to copper foil cladding)

Method used

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  • Composites for high-frequency printed circuit boards and methods of making
  • Composites for high-frequency printed circuit boards and methods of making
  • Composites for high-frequency printed circuit boards and methods of making

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0071] Embodiment 1——compound preparation

[0072] pass figure 2 The melting process shown is used to prepare samples, whereby at least one thermoplastic polymer, at least one PTFE-based polymer and at least one reinforcing material are mixed, and then heated at 150° C. to 350° C. (for example, 250° C.), or Melting at a temperature in the range of 175°C to 325°C, or 200°C to 300°C, or 225°C to 275°C, or 250°C to 350°C, or 150°C to 250°C (or any range or value therein) . Prior to mixing and melting, the at least one reinforcing material is segmented into predetermined sizes, shapes and other characteristics that are most suitable for the melting process. In addition, the melting time is 1 minute to 45 minutes, or 2 minutes to 30 minutes, or 5 minutes to 25 minutes, or 10 minutes to 20 minutes (for example, 15 minutes), or 12.5 minutes to 17.5 minutes, or wherein Any range or value for . In some examples, the mixture is prepared using at least one thermoplastic polymer an...

Embodiment 2

[0076] Example 2 - Compound Test

[0077] The composites prepared as described above and having certain compositions had dielectric properties as summarized in Table 2.

[0078]

[0079]

[0080] Table 2

[0081] As seen in Table 2, samples 7-9 all use TP1 and PTFE [TP1 and PTFE by themselves (samples 4 and 1, respectively) each have 5×10 -4 or less loss tangent], the samples 7-9 have less than or equal to about 5 x 10 -4 The dielectric loss tangent of , which is compared with sample 5 (TP3 / PTFE(60:40)) and sample 6 (TP2 / PTFE(60:40)), the dielectric loss tangent of sample 5 and sample 6 is greater than about 5×10 -4 . Samples 7-9 also showed excellent adhesion properties to metals as well as rigidity. For example, when the composite is hot pressed together with first and second stainless steel (SS) sheets on either side of the composite, one of the stainless steel sheets holds the composite during the peel test, whereby the first One SS sheet is pulled away from ...

Embodiment 3

[0083] A formulation comprising: (1) at least one thermoplastic dielectric polymer (e.g., TOPAS (cycloolefin copolymer), polystyrene, polypropylene / polystyrene blend) as a binder melted in a compound mixture); and (2) at least one powdered fluoropolymer (which does not melt when making the compound) for improving the flame retardancy of the final product (for example, powdered PTFE, for example, at up to 60% by weight exist).

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Abstract

A composite includes at least one thermoplastic polymer; and at least one PTFE-based polymer, such that the composite has a dielectric loss tangent of less than 10-3. Moreover, a method for preparing a composite includes mixing at least one thermoplastic polymer with at least one PTFE-based polymer to form a homogenous mixture; melting the mixture to form a composite material; and hot pressing the composite material to form a composite sheet.

Description

[0001] background 1. Technical field [0002] This application claims the benefit of priority under 35 U.S.C. §119 to U.S. Provisional Application Serial No. 62 / 819,852, filed March 18, 2019, the contents of which are based upon and incorporated by reference in its entirety. [0003] The present disclosure relates to compounds for printed circuit board (PCB) applications. 2. Background technology [0004] Currently available printed circuit boards (PCBs) typically employ FR4 composites (i.e., consisting of woven fiberglass cloth with epoxy resin binder) or polytetrafluoroethylene (PTFE)-based composites (i.e., use PTFE as the base polymer material / dielectric polymer impregnated with a predetermined amount of (1) microfiber glass; (2) woven glass reinforcement; or (3) ceramic). [0005] Future PCBs are expected to have less than or equal to about 5×10 at frequencies greater than or equal to about 10 GHz -4 Dielectric loss tangent, as well as enhanced thermal stability (eg, ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B17/04B32B17/06B32B27/30B32B27/32C08L25/06C08L27/18C08L45/00C08L71/12H05K1/03
CPCC08L71/123C08L27/18C08L45/00C08L25/06B32B27/322B32B27/06B32B2270/00B32B27/325B32B27/302B32B27/285B32B27/288B32B27/281H05K2201/0129H05K1/0366H05K2201/029H05K1/0353H05K1/024H05K2201/0209H05K2201/015C08K3/36B29C43/10C08L2203/20C08L2207/04
Inventor 蒋大跃G·欧文
Owner CORNING INC