Preparation method of low-temperature ceramic combined SiC grinding material

A technology of low-temperature ceramics and ceramic binders, applied in abrasives, chemical instruments and methods, manufacturing tools, etc., can solve problems such as rising production costs and environmental pollution, and achieve good grinding performance, wide application, and rough particle surface. Effect

Pending Publication Date: 2022-01-11
HENAN UNIVERSITY OF TECHNOLOGY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, during the preparation of silicon carbide, a large amount of ultrafine silicon carbide powder will be produced. These silicon carbide powders cannot be effectively used due to their fine particle size, resulting in increased production costs and certain environmental pollution.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] In this embodiment, a method for preparing a low-temperature ceramic bonded SiC abrasive, the specific preparation process is:

[0027] S1: Weigh 30g of silicon carbide micropowder, add the silicon carbide micropowder in S2 into 30ml of ethanol aqueous solution under the condition of ultrasonic stirring, and keep stirring for 2h until fully dispersed. The volume ratio is 1.5:1, and the mass ratio of the volume of absolute ethanol to the silicon carbide powder is 1ml:1g;

[0028] S2: prepare a low-temperature vitrified bond, the mass ratio of the low-temperature vitrified bond to SiC micropowder is 10%;

[0029] S21: According to the total mass of the low-temperature vitrified bond in S2, the weight percentages of each oxide are respectively Al 2 o 3 5%, SiO 2 65%, B 2 o 3 12%, CaO 7%, K 2 O 11%, the oxides are fully mixed;

[0030] S22: Put the oxide powder in S21 into a frit furnace, melt it at 1500°C and keep it warm for 1 hour, then quench it with water and g...

Embodiment 2

[0036] In this embodiment, a method for preparing a low-temperature ceramic bonded SiC abrasive, the specific preparation process is:

[0037] S1: Weigh 30g of silicon carbide micropowder, add the silicon carbide micropowder in S2 into 30ml of ethanol aqueous solution under the condition of ultrasonic stirring, and keep stirring for 2h until fully dispersed. The volume ratio is 2:1, and the mass ratio of the volume of absolute ethanol to the silicon carbide micropowder is 1ml:1g;

[0038] S2: prepare a low-temperature vitrified bond, the mass ratio of the low-temperature vitrified bond to SiC micropowder is 15%;

[0039] S21: According to the total mass of the low-temperature vitrified bond in S2, the weight percentages of each oxide are respectively Al 2 o 3 5%, SiO 2 65%, B 2 o 3 12%, CaO 7%, K 2 O 7%, Na 2 O 4%, the oxides are fully mixed;

[0040] S22: Put the oxide powder in S21 into a frit furnace, melt it at 1500°C and keep it warm for 1 hour, then quench it wi...

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PUM

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Abstract

The invention provides a preparation method of a low-temperature ceramic combined SiC grinding material, and belongs to the field of grinding material preparation and nano composite materials. The preparation method comprises the following specific preparation steps: adding silicon carbide micro powder into an ethanol water solution, ultrasonically stirring for 1-2 hours, adding a prepared low-temperature ceramic bond, and ultrasonically stirring for 1-2 hours; adding PVA into the silicon carbide mixed powder, performing mechanical stirring for 1-2 h, and performing sealed standing for 5-10 h; and granulating and drying the mixed powder, and carrying out heat treatment at 600-800 DEG C for 2-5 hours to obtain the low-temperature ceramic bonded SiC grinding material with reconstructed granularity. The silicon carbide is stable in property and excellent in use performance, but is relatively high in production cost, and more silicon carbide powder cannot be used due to too small particles in the production process, so that resource waste is caused. By introducing the low-temperature ceramic bond, the heat treatment temperature during particle size reconstruction of the silicon carbide is remarkably reduced, and the low-temperature ceramic bonded silicon carbide abrasive material after particle size reconstruction still has sharp edges and corners, higher strength and excellent grinding performance.

Description

technical field [0001] The invention belongs to the field of abrasive preparation and nanocomposite materials, and in particular relates to a preparation method of low-temperature ceramic bonded SiC abrasive. Background technique [0002] The crystalline structure of silicon carbide belongs to a typical covalent bond structure with good stability, and the stability is good. There are almost no pure silicon carbide compounds in nature. Silicon carbide has been widely used in the field of abrasives because of its good superhard properties, and can be prepared into various grinding wheels, emery cloths, sandpaper or directly used as abrasives. [0003] Abrasives can be divided into two categories: natural abrasives and artificial abrasives according to their sources. Diamond, natural corundum, garnet, quartz, etc. belong to natural abrasives, corundum series, carbide series, superhard series, etc. Belonging to one of the carbide series, because of its excellent performance, it...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09K3/14B24D3/14B24D3/34
CPCC09K3/1409C09K3/1427B24D3/14B24D3/34B24D3/342
Inventor 刘世凯宋志健陈颖鑫王嘉琳周诗婷郭子杰赵晓东李欣哲孙亚光
Owner HENAN UNIVERSITY OF TECHNOLOGY
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