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Heat-conducting silica gel and preparation process thereof

A preparation process and heat-conducting silicon technology, applied in the field of silicone gel, can solve the problems of rubber viscosity increase, long-term low-temperature storage, transportation and use inconvenience, etc., achieve the effect of complete reaction process and increase curing speed

Active Publication Date: 2022-01-18
SUZHOU HI TECH ELECTRONICS CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002]The one-component thermally conductive silicone gel currently on the market can be made of addition-type silicone as the base material and added with thermally conductive fillers. This thermally conductive silicone gel is made of vinyl silicone oil / The addition reaction of silicone resin and hydrogen-containing silicone oil / silicone resin completes the curing. Add platinum catalyst and acetylenic alcohol inhibitor or polyvinyl ring inhibitor to the rubber compound to adjust the curing time and operation time of silicone. In order to meet the complete and rapid curing of silica gel at high temperature, the addition of inhibitors is limited. The storage time of the rubber material at around 25°C generally does not exceed 48 hours. During this period, the viscosity of the rubber material will increase significantly. This solution requires long-term low-temperature storage. Inconvenience in transportation and use

Method used

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  • Heat-conducting silica gel and preparation process thereof

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preparation example Construction

[0025] The preparation process of the thermally conductive silicone gel of one embodiment of the present invention comprises the following steps:

[0026] S1. Prepare a thermally conductive filler.

[0027] Wherein, S1 specifically includes the following steps: adding filler raw materials into a mixer, then adding a coupling agent into the mixer under ultraviolet radiation, heating and stirring evenly, and obtaining a thermally conductive filler.

[0028] Among them, ultraviolet rays can be generated by low-pressure mercury lamps. The power and quantity of the low-pressure mercury lamps vary depending on the size of the mixer. In a specific embodiment, a 1.5kw low-pressure mercury lamp can be selected and installed on the cover of the mixer.

[0029] In a specific embodiment, the coupling agent can be diluted with ethanol first, then added to the mixer, and then heated and stirred evenly.

[0030] Wherein, the specific conditions for heating and stirring are as follows: the ...

Embodiment 1

[0037] Add 200g of spherical boron nitride, 850g of spherical alumina and 150g of aluminum nitride into the mixer, mix 12g of γ-aminopropyltriethoxysilane with 30g of ethanol and add them to the mixer, and Irradiated by a 1.5kw low-pressure mercury lamp, mixed and stirred for 120min at a temperature of 140°C and a rotational speed of 1500rpm to obtain a thermally conductive filler.

[0038] Take by weighing 96g thermally conductive filler, 1g platinum capsule catalyst and 30g silica gel (in parts by weight, 70% of 200cp divinyl end-capped silicone oil, 2% chain extender, 5% of 500cp side chain polyvinyl silicone oil, 20 % of 2000cp divinyl-terminated silicone oil, 2% of hydrogen-containing silicone oil (hydrogen content of 0.18%), and 1% of vinyl silicone resin) are mixed evenly to obtain a thermally conductive silicone gel.

Embodiment 2

[0040] Add 10g of spherical boron nitride, 700g of spherical alumina and 10g of aluminum nitride into the blender, mix 0.72g of LD-70 and 10g of ethanol evenly, add them to the blender, and irradiate with a 1.5kw low-pressure mercury lamp , the temperature is 120° C., and the rotation speed is 800 rpm, and the mixture is mixed and stirred for 40 minutes to obtain the thermally conductive filler.

[0041] Take by weighing 70g thermally conductive filler, 0.1g platinum capsule catalyst and 4g silica gel (in parts by weight, 30% of 200cp divinyl terminated silicone oil, 10% chain extender, 20% of 500cp side chain polyvinyl silicone oil, 20% of 2000cp divinyl-terminated silicone oil, 10% of hydrogen-containing silicone oil (hydrogen content of 0.18%), and 10% of vinyl silicone resin) are evenly mixed to obtain a thermally conductive silicone gel.

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Abstract

The invention discloses a heat-conducting silica gel and a preparation process thereof. The heat-conducting silica gel comprises the following components in parts by weight: 4-30 parts of silica gel, 0.1-1.0 part of a platinum capsule catalyst and 70-96 parts of a heat-conducting filler, wherein the heat-conducting filler is prepared by modifying a filler raw material, and the modification step comprises the steps of mixing the filler raw material with a coupling agent under the irradiation of ultraviolet rays, and heating and uniformly stirring to obtain the heat-conducting filler. The heat-conducting silica gel disclosed by the invention can be stored for a long time at room temperature, and the advantage of improving the curing speed of the heat-conducting silica gel after heating is achieved.

Description

technical field [0001] The invention relates to the technical field of silica gel, in particular to a heat-conducting silica gel and a preparation process thereof. Background technique [0002] The one-component thermally conductive silicone gel currently on the market can be made of addition-type silica gel as the base material and added with thermally conductive fillers. This thermally conductive silicone gel is cured through the addition reaction of vinyl silicone oil / silicone resin and hydrogen-containing silicone oil / silicone resin. , add platinum catalyst and acetylenic alcohol inhibitor or polyvinyl ring inhibitor to the rubber compound to adjust the curing time and operation time of the silica gel. In order to meet the complete and rapid curing of this silica gel at high temperature, the addition of inhibitors is limited. The storage time of the rubber at around 25°C generally does not exceed 48 hours, during which the viscosity of the rubber will increase significan...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L83/07C08L83/05C08K9/10C08K9/06C08K7/18C08K3/28C08K9/04C09K5/14
CPCC08L83/04C09K5/14C08K2003/282C08K9/10C08K9/06C08K7/18C08K3/28C08K9/04
Inventor 汪义方金天辉
Owner SUZHOU HI TECH ELECTRONICS CO LTD