Nickel removing liquid agent for electronickelling anti-corrosion layer, preparation method and chemical nickel removing process

An anti-corrosion layer and nickel electroplating technology, applied in the field of chemical nickel stripping solution, can solve the problems of long time, complex stripping process and high use temperature, and achieve the effects of less erosion, short nickel stripping time and fast nickel stripping speed.

Pending Publication Date: 2022-01-21
江苏悦锌达新材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0010] In view of the above-mentioned shortcoming of the prior art, the object of the present invention is to provide a kind of nickel-removing potion for electroplating nickel resist layer, for solving the high service temperature and long time of the traditional chemical nickel-removing potion system in the prior art And take off the complex problem of process, meanwhile, the present invention will also provide a kind of method for preparing the nickel-removing potion used for electroplating nickel resist layer; In addition, the present invention will also provide a kind of chemical nickel-removing process

Method used

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  • Nickel removing liquid agent for electronickelling anti-corrosion layer, preparation method and chemical nickel removing process
  • Nickel removing liquid agent for electronickelling anti-corrosion layer, preparation method and chemical nickel removing process
  • Nickel removing liquid agent for electronickelling anti-corrosion layer, preparation method and chemical nickel removing process

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0045] The equipment uses a polypropylene container, and the preparation of the nickel-removing potion at room temperature includes the following steps:

[0046] Step 1: In 400-500ml of deionized water, add 50g of nitric acid solution with a mass concentration of 65% per liter of nickel-removing potion, and stir evenly;

[0047] 2. Add 30g of hydrogen peroxide with a mass concentration of 35% per liter of nickel-removing potion, and stir evenly;

[0048] 3. Add 1g of benzenesulfonic acid per liter of nickel-removing potion, and stir until completely dissolved;

[0049] 4. Add 2 g of urea per liter of nickel-removing potion, and stir until completely dissolved;

[0050] 5. Add 1g of imidazole per liter of nickel-removing potion, and stir until completely dissolved;

[0051] 6. Add 4g of sodium lauryl sulfate per liter of nickel-removing potion, and stir until completely dissolved;

[0052] 7. Add the remaining amount of deionized water and stir evenly to obtain the nickel-re...

Embodiment 2

[0054] The equipment uses a container made of polyvinyl chloride, and the preparation of the nickel-removing potion at room temperature specifically includes the following steps:

[0055] Step 1: In 400-500ml of deionized water, add 150g of nitric acid solution with a mass concentration of 65% per liter of nickel-removing potion, and stir evenly;

[0056] 2. Add 15g of hydrogen peroxide with a mass concentration of 35% per liter of nickel-removing potion, and stir evenly;

[0057] 3. Add 3g of benzenesulfonic acid per liter of nickel-removing potion, and stir until completely dissolved;

[0058] 4. Add 12g of urea per liter of nickel-removing potion, and stir until completely dissolved;

[0059] 5. Add 5g of imidazole per liter of nickel-removing potion, and stir until completely dissolved;

[0060] 6. Add 0.5g of sodium lauryl sulfate per liter of nickel-removing potion, and stir until completely dissolved;

[0061] 7. Add the remaining amount of deionized water and stir e...

Embodiment 3

[0063] The equipment is made of Teflon container, and the preparation of the nickel-removing potion at room temperature includes the following steps:

[0064] Step 1. Add 250 g of nitric acid solution with a mass concentration of 65% per liter of nickel-removing potion in 400-500 ml of deionized water, and stir evenly;

[0065] 2. Add 30g of hydrogen peroxide with a mass concentration of 35% per liter of nickel-removing potion, and stir evenly;

[0066] 3. Add 10g of benzenesulfonic acid per liter of nickel-removing potion, and stir until completely dissolved;

[0067] 4. Add 2 g of urea per liter of nickel-removing potion, and stir until completely dissolved;

[0068] 5. Add 10g of imidazole per liter of nickel-removing potion, and stir until completely dissolved;

[0069] 6. Add 2g of sodium lauryl sulfate per liter of nickel-removing potion, and stir until completely dissolved;

[0070] 7. Add the remaining amount of deionized water and stir evenly to obtain the nickel-r...

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Abstract

The invention relates to the technical field of a chemical nickel removing liquid agent, in particular to a nickel removing liquid agent for an electronickelling anti-corrosion layer, a preparation method and a chemical nickel removing process. The nickel removing liquid agent contains 50-350 g/L of a nitric acid solution, 5-30 g/L of a hydrogen peroxide solution, 1-10 g/L of benzenesulfonic acid, 2-12 g/L of urea, 0.5-4 g/L of an anionic surfactant, 1-10 g/L of an imidazole heterocyclic ring and derivative thereof, and the balance of water. The problems that in the prior art, a traditional chemical nickel removing liquid agent system is high in use temperature, low in speed and complex in removing technology are solved. When the nickel removing liquid agent is used for treating a circuit board containing the electronickelling anti-corrosion layer, an electronickelling layer on the surface of copper metal can be rapidly and effectively removed by controlling the temperature of the nickel removing liquid agent within the range of 20-40 DEG C, a bright and imprint-free metal copper circuit layer is exposed, and the requirements of a subsequent automatic optical inspection (AOI) procedure for the appearance and brightness of a copper surface are met.

Description

technical field [0001] The invention relates to the technical field of chemical nickel-removing potions, in particular to a nickel-removing potion for electroplating a nickel resist layer, a preparation method and a chemical nickel-removing process. Background technique [0002] In the process of making printed circuit boards, an etching solution is usually required to etch the copper layer to form a circuit pattern. There are generally two methods of line etching: acid etching and alkaline etching. The acid etching method is generally used in the inner circuit manufacturing process of single-sided boards and printed circuit boards, usually using dry film or wet film materials (the main components are photosensitive resin or ink containing binder, photopolymerizable monomer, photoinitiator , organic components such as solvents), dry film or wet film material is used as a resist layer of the circuit pattern to protect the covered circuit from being corroded in the pickling e...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23F1/28C23F1/02C23F1/44
CPCC23F1/28C23F1/02C23F1/44
Inventor 罗坤吕新伟
Owner 江苏悦锌达新材料有限公司
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