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A kind of polyimide material and its preparation method and application

A polyimide and polyimide resin technology, applied in the field of functional film materials, can solve the problems of proton oxygen erosion, inability to take into account anti-static discharge, etc. Harmful effect

Active Publication Date: 2022-07-05
CHINA UNIV OF GEOSCIENCES (BEIJING)
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The first purpose of the present invention is to provide polyimide materials to solve the problem that polyimide materials in the prior art cannot take into account anti-static discharge, anti-atomic oxygen erosion and other comprehensive properties

Method used

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  • A kind of polyimide material and its preparation method and application
  • A kind of polyimide material and its preparation method and application
  • A kind of polyimide material and its preparation method and application

Examples

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preparation example Construction

[0031] In some embodiments of the present invention, the preparation method of polyimide material specifically includes the following steps:

[0032] (A) uniformly mixing the composite solution containing the silicon-containing antioxidant atom filler and the phosphorus-containing polyimide resin with the dispersion solution containing the conductive filler to obtain a mixed solution;

[0033] (B) The mixed solution is heated and solidified.

[0034] In some embodiments of the present invention, the curing at elevated temperature includes spreading the mixed solution on the surface of the substrate, and after curing at elevated temperature, a polyimide film is obtained.

[0035] In some specific embodiments of the present invention, the organic solution of the phosphorus-containing polyimide resin is uniformly mixed with the organic solution in which the silicon-containing antigenic oxygen filler is dissolved to obtain a composite solution.

[0036] In some specific embodimen...

Embodiment 1

[0056] The polyimide film provided in this embodiment is a polyimide film containing 10 wt % graphene and 18 wt % trisilanol phenyl cage polysilsesquioxane (TSP-POSS).

[0057] The preparation method of the polyimide film provided by this embodiment is:

[0058] To a 500 mL volume three-necked flask equipped with a mechanical stirrer, an electric heating bath, a Dean-Stark trap, and a nitrogen inlet and outlet at room temperature, was charged with 2,5-bis[(4-aminophenoxy)benzene base] diphenylphosphine oxide (BADPO, 24.6250g, 50mmol) and N,N-dimethylacetamide (DMAc, 120.0g), under nitrogen protection, stirred to obtain a homogeneous solution, then, 2,2' -Bis(trifluoromethyl)-4,4',5,5'-biphenyltetracarboxylic dianhydride (6FBPDA, 21.5105g, 50mmol) and N,N-dimethylacetamide (DMAc, 64.5g) added to the solution. The solids content of the reaction mixture was controlled to 20 wt%. The reaction was stirred at 25° C. for 20 h to generate a polyamic acid (PAA) reaction solution. T...

Embodiment 2

[0061] The polyimide film provided in this embodiment is a polyimide film containing 10 wt % of carbon nanotubes and 18 wt % of trisilanol phenyl cage polysilsesquioxane (TSP-POSS).

[0062] The preparation method of the polyimide film provided by this embodiment is:

[0063] The preparation method of phosphorus-containing polyimide resin is the same as that in Example 1.

[0064] For the preparation method of the polyimide film, refer to Example 1, except that graphene is replaced with carbon nanotubes.

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Abstract

The invention relates to the technical field of functional thin film materials, in particular to a polyimide material and a preparation method and application thereof. The polyimide material, in parts by weight, includes: 1-40 parts of conductive fillers, 1-30 parts of silicon-antigen oxygen-containing fillers, and 30-98 parts of phosphorus-containing polyimide resin. In the polyimide material of the present invention, silicon-containing antigenic oxygen filler and conductive filler are introduced into the intrinsic antigenic oxygen-containing phosphorus-containing polyimide resin, so as to maintain the good comprehensive performance of the polyimide material and at the same time endow the polyimide material. The excellent antigenic oxygen properties and anti-static discharge properties of the polyimide material enable the polyimide material to be used in the aerospace field.

Description

technical field [0001] The present invention relates to the technical field of functional thin film materials, in particular, to a polyimide material and a preparation method and application thereof. Background technique [0002] In recent years, my country's space exploration activities are increasing day by day, and great progress has been made. Among many space activities, Low Earth Orbit (LEO, 200-1000km above sea level) is one of the most important activity areas, and the space station under construction in my country operates in this orbital area. In this orbital space environment, atomic oxygen (AO) is one of the most important and dangerous factors affecting the service life of polymer materials for spacecraft. Atomic oxygen is a kind of high-energy substance formed by molecular bond breaking of oxygen molecules after being irradiated by solar protons with wavelengths less than 243nm (energy>5.12eV). When an aircraft operating at LEO travels at an operating spee...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L79/08C08L83/04C08K3/04C08J5/18C08G73/10
CPCC08J5/18C08G73/1057C08G73/1071C08J2379/08C08J2483/04C08K3/042C08K3/041C08K2201/001C08K2201/011
Inventor 张燕刘金刚吕凤柱职欣心
Owner CHINA UNIV OF GEOSCIENCES (BEIJING)
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