Material thermal conductivity testing method and device convenient to operate

Abstract

The invention relates to a material thermal conductivity testing method and device convenient to operate. The method comprises the following steps: 1) arranging and connecting a material thermal conductivity testing device; 2) controlling a direct-current power supply to heat a constant-temperature ceramic heating sheet, and taking the constant-temperature ceramic heating sheet as a heat source, so that heat is transferred to a heat dissipation copper plate from the constant-temperature ceramic heating sheet through the sample; (3) the data recorder measures the temperature of the constant-temperature ceramic heating piece and the temperature of the heat dissipation copper plate through a K-type thermocouple till the temperature is stable; and 4) turning off the direct-current power supply, measuring the temperature change of the heat dissipation copper plate in the natural cooling process through the K-type thermocouple, transmitting the acquired temperature data to a computer through a data recorder, drawing a cooling curve of the heat dissipation copper plate in the natural cooling process by the computer, and calculating the heat dissipation rate of the heat dissipation copper plate through the cooling curve. The heat transfer rate, namely the heat conductivity, of the sample is obtained. Compared with the prior art, the method has the advantages of simplicity in operation, convenience and accuracy in calculation, low cost and the like.

Description

technical field [0001] The invention relates to the technical field of testing the thermal conductivity of materials, in particular to a method and device for testing the thermal conductivity of materials with convenient operation. Background technique [0002] In the actual engineering field, it is a very critical issue to quickly and accurately measure the thermophysical parameters of materials. According to the thermophysical parameters of materials, the thermal performance of materials can be judged and the materials can be classified. Among them, thermal conductivity, also known as thermal conductivity, is a kind of thermophysical parameter and an important parameter to measure the thermal conductivity of a material. It directly reflects the ability of a material to conduct heat and represents the efficiency of heat transfer between objects. [0003] For different materials, the thermal conductivity is different. For the same material, the thermal conductivity will also...

AI Technical Summary

Problems solved by technology

Among them, the advantage of the steady-state guard plate method is that the measurement temperature range is large, but due to the large error caused by the temperature imbalance, this problem has always been a technical problem, although the thermopile form composed of multiple thermocouples can be reduced. error, but the number of thermocouples is not unlimited to improve the sensitivity of the sensor, although the use of ultra-high-precision digital voltmeters for measurement and control can reduce the number of thermocouples in the thermopile, but this is not enough for ordinary steady-state shields The heat flow meter method is not realistic; the steady-state heat flow meter method takes too long to measure, and the heat loss is large. The low heat flow measurement in the coefficient test has a large error, and it is not possible to calibrate the heat flow meter and use standard materials with ultra-low thermal conductivity for calibration

However, it is worth noting that the device for testing thermal conductivity by the steady-state method is still relatively complicated, which greatly increases the cost of the test. Therefore, there is an urgent need for a new, simple and low-cost thermal conductivity test method.

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