Copper-containing antibacterial high-entropy alloy and preparation method thereof

A high-entropy alloy and alloy ingot technology, applied in the field of alloys, can solve problems such as poor mechanical properties, and achieve the effects of excellent antibacterial properties, reduced preparation costs, and excellent mechanical and antibacterial properties.

Active Publication Date: 2022-03-04
DALIAN UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to propose a copper-containing antibacterial high-entropy alloy, which has poor antibacterial properties in the as-cast state, in view of the above-mentioned traditional copper-containing antibacterial alloys with poor mechanical properties in the as-cast state and the need to obtain antibacterial efficacy through complicated heat treatment processes. Far beyond the traditional copper-containing 304 stainless steel, while having good mechanical properties

Method used

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  • Copper-containing antibacterial high-entropy alloy and preparation method thereof
  • Copper-containing antibacterial high-entropy alloy and preparation method thereof
  • Copper-containing antibacterial high-entropy alloy and preparation method thereof

Examples

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Embodiment 1

[0029] This embodiment discloses a copper-containing antibacterial high-entropy alloy, whose general formula is FeCo 0.4 Cr 0.9 Cu 0.3 .

[0030] FeCo 0.4 Cr 0.9 Cu 0.3 The specific preparation method is as follows: the raw materials Fe, Co, Cr and Cu are piled up according to the molar ratio shown in the general formula, and the Fe, Co, Cr and Cu elements are all selected from industrial grade pure raw materials with a purity of more than 99.5wt.%. Then vacuum arc melting is adopted. When alloy is fused, the Cr and Cu are placed at the bottom, and the Fe and Co are placed at the top, and the vacuum is evacuated to 3×10 -3 Pa, then backflush argon to 0.05MPa. Each alloy ingot is melted at least six times during arc melting to ensure uniform composition.

Embodiment 2

[0034] This embodiment discloses a copper-containing antibacterial high-entropy alloy, whose general formula is FeCo 0.5 Cr 0.9 Cu 0.3 . The preparation method of the copper-containing antibacterial high-entropy alloy in this example is the same as that in Example 1.

[0035] After testing this embodiment FeCo 0.5 Cr 0.9 Cu 0.3 with example FeCo 0.4 Cr 0.9 Cu 0.5 It also has excellent mechanical properties and antibacterial properties. The 24-hour antibacterial rate against Escherichia coli can reach 99.97%, and the 24-hour antibacterial rate against Staphylococcus aureus can reach 99.96%. It can be widely used in the field of antibacterial metal materials.

Embodiment 3

[0037] This embodiment discloses a copper-containing antibacterial high-entropy alloy, whose general formula is FeCo 0.35 Cr 0.7 Cu 0.3 . The preparation method of the copper-containing antibacterial high-entropy alloy in this example is the same as that in Example 1.

[0038] After testing this embodiment FeCo 0.35 Cr 0.7 Cu 0.3 with example FeCo 0.4 Cr 0.9 Cu 0.3 It also has excellent mechanical properties and antibacterial properties. The 24-hour antibacterial rate against Escherichia coli can reach 99.95%, and the 24-hour antibacterial rate against Staphylococcus aureus can reach 99.96%. It can be widely used in the field of antibacterial metal materials.

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Abstract

The invention provides a copper-containing antibacterial high-entropy alloy and a preparation method thereof. The general formula of the copper-containing antibacterial high-entropy alloy is FeCoxCryCuz, x is larger than or equal to 0.3 and smaller than or equal to 0.5, y is larger than or equal to 0.5 and smaller than or equal to 1.0, z is larger than or equal to 0.2 and smaller than or equal to 0.6, and x, y and z are molar ratios. The preparation method of the copper-containing antibacterial high-entropy alloy comprises the following steps that after Fe, Co, Cr and Cu are stacked according to the proportion, vacuum arc melting is adopted, and the copper-containing antibacterial high-entropy alloy is obtained. The copper-containing antibacterial high-entropy alloy has excellent antibacterial performance in an as-cast state, after the copper-containing antibacterial high-entropy alloy and escherichia coli / staphylococcus aureus (the bacterial concentration is about 105 CFU / mL) are co-cultured for 24 hours at the temperature of 37 DEG C, the antibacterial rate reaches up to 99.97%, the antibacterial efficiency is far better than that of traditional copper-containing 304 stainless steel, meanwhile, the copper-containing antibacterial high-entropy alloy has excellent strength and certain plasticity, and the copper-containing antibacterial high-entropy alloy can be widely applied to the field of stainless steel. The compression yield strength of an as-cast sample at room temperature exceeds 950 MPa, and the engineering strain (compression fracture strain) exceeds 30%.

Description

technical field [0001] The invention relates to alloy technology, in particular to a copper-containing antibacterial high-entropy alloy and a preparation method thereof. Background technique [0002] At present, the commonly used antibacterial metal materials are mostly alloy antibacterial metal materials. Because the entire matrix is ​​distributed with antibacterial elements, the interior and surface of the alloy also have antibacterial effects, and can maintain efficient and durable antibacterial effects, thus being widely used. At present, the commonly used alloy antibacterial metal materials are mainly based on traditional alloys such as stainless steel, cobalt-chromium alloy, titanium and titanium alloy, and the natural antibacterial element copper is introduced, and then formed in the matrix through complex antibacterial annealing and other heat treatment processes. Copper-rich phase, when the copper-containing antibacterial alloy is in contact with the environmental m...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C22C30/00C22C1/02A01N59/20
CPCC22C30/00C22C1/02A01N59/20
Inventor 卢一平任广宇
Owner DALIAN UNIV OF TECH
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