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Manufacturing method for improving oil falling of PAD edge of tin immersion plate

A production method and technology of tin plate, which is applied in the fields of printed circuit manufacturing, electrical components, printed circuit liquid treatment, etc., can solve the problem of not completely solving the problem of soldering oil loss at the edge of PAD, affecting production quality and delivery time, and oil loss at the edge of PAD, etc. problem, achieve the effect of improving the oil loss problem, enhancing the binding force and improving production efficiency

Pending Publication Date: 2022-03-08
SHENZHEN SUNTAK MULTILAYER PCB
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] During the immersion tin process, due to the attack of the potion on the solder resist ink, the problem of oil loss on the edge of the PAD (solder resist ink peeling) often occurs. Nowadays, the solder resist ink resistant to immersion tin or a new type of ultra-roughening potion is used to treat the PCB to improve the ink and solder resist. The bonding strength of the copper surface, these two methods have high production costs and cannot completely solve the problem of oil loss due to solder resistance on the PAD side, which seriously affects the production quality and delivery time; factors that affect the super-roughening effect: concentration of liquid medicine, Cu 2+ Content, amount of micro-etching, pressure of liquid medicine tank and washing tank, temperature of chemical water tank, speed of grinding plate, drying temperature, etc.

Method used

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Experimental program
Comparison scheme
Effect test

Embodiment

[0020] The manufacturing method of a circuit board shown in this embodiment can improve the problem of oil loss on the PAD side of the immersion tin board, and includes the following processing steps in sequence:

[0021] (1) Cutting: Cut out the core board according to the panel size of 520mm×620mm. The thickness of the core board is 0.5mm, and the thickness of the copper layer on both surfaces of the core board is 0.5oz.

[0022] (2) Inner layer circuit production (negative film process): Inner layer graphics transfer, use a vertical coating machine to coat photosensitive film, the film thickness of the photosensitive film is controlled to 8 μm, use a fully automatic exposure machine, and use a 5-6 grid exposure ruler (21 grid exposure ruler) to complete the exposure of the inner layer circuit, and form the inner layer circuit pattern after development; inner layer etching, etch the exposed and developed core board to etch the inner layer circuit, and the inner layer line wid...

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PUM

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Abstract

The invention discloses a manufacturing method for improving oil falling of a PAD edge of a tin immersion plate, and the method comprises the steps: carrying out the super-roughening treatment of a production plate before a solder mask is manufactured on the production plate, and adding 1.3 + / -0.3 L of liquid medicine into a super-roughening cylinder in the super-roughening treatment when the production plate of 400 square inches is produced, so as to enable the Cu < 2 + > content of the liquid medicine in the super-roughening cylinder to be controlled at 10-35 g / L. According to the method, technological process parameters are optimized, and the problem of oil falling of the PAD edge of the tin immersion plate is solved by optimizing the activity of the ultra-coarsening liquid medicine and the liquid medicine proportion.

Description

technical field [0001] The invention relates to the technical field of printed circuit board production, in particular to a production method for improving oil loss on the PAD side of an immersion tin board. Background technique [0002] Immersion tin is a kind of PCB surface treatment process. The purpose is to chemically deposit metal tin coating on the surface of the pad to protect the pad from oxidation and ensure good solderability. The immersion tin process is as follows: [0003] Upper board → degreasing → first-level washing → second-level washing → third-level washing → micro-etching → first-level washing → second-level washing → third-level washing → pre-dipping tin → immersion tin → post-dipping tin → thiourea washing → water washing → LONIXSF wash → second level hot water wash → third level hot water wash → lower plate. [0004] During the immersion tin process, due to the attack of the potion on the solder resist ink, the problem of oil loss on the edge of the...

Claims

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Application Information

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IPC IPC(8): H05K3/00
CPCH05K3/0085
Inventor 张盼盼宋建远孙保玉
Owner SHENZHEN SUNTAK MULTILAYER PCB