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Deposition method for preparing visual light LED

A technology for light-emitting diodes and a manufacturing method, which is applied in the directions of semiconductor devices, electrical components, circuits, etc., can solve the problems of time-consuming production, inability to reduce costs, and influences.

Inactive Publication Date: 2004-03-10
UNITY OPTO TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0013] 1. The action of fixing the chip and bonding wire must be carried out first. The coating glue 94 must be mixed in advance, and then the coating glue 94 that has been pre-mixed to an appropriate concentration must be coated on it. The manufacturing process is quite complicated, and the production cost is relatively low. can not be reduced
[0014] 2. Since the coating glue 94 must be uniformly and completely distributed on the outside of the light-emitting chip 93, the difference in the concentration, film thickness and uniformity of the dispensing glue will affect the amount of phosphor 941 contained in the coating glue 94, which in turn affects the light-emitting diodes. 9 The shape and characteristics of the light emitted, such as the light shape is elliptical or incomplete, etc., the quality of the finished product varies greatly
[0015] 3. After dispensing glue, it must be advanced into the oven, and the coating glue 94 is slightly dried to make it gelled, and then the appearance of the shell 95 can be formed. The production is time-consuming and the production capacity cannot be improved.
[0016] 4. Since the refractive index of the coating glue 94 is different from that of the casing 95, it will affect the light emitted by the LED 9
[0017] 5. If the phosphor 941 is directly applied on the outside of the light-emitting chip 93, such as on the casing 95, the phosphor 941 is easy to fall off, such as being scratched due to collision, etc., and the effect of uniform light mixing cannot be achieved. And the light color is partially blue, or even only blue light is emitted
[0018] 6. The temperature of the chip 93 increases due to the irradiation of ultraviolet rays in the fluorescent body 941, which will cause aging and have a bad influence on the light-emitting diode 9

Method used

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  • Deposition method for preparing visual light LED
  • Deposition method for preparing visual light LED
  • Deposition method for preparing visual light LED

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Embodiment Construction

[0043] see Figure 1 to Figure 3 , the person shown in the figure is the first embodiment selected by the present invention. The present invention provides a deposition and manufacturing method of visible light-emitting diodes. The manufacturing method includes the following steps:

[0044] The first step 11 is to fix the chip: a light-emitting chip 3 is bonded to at least one connector 2 with conductive glue. 2 is a base, and the light-emitting chip 3 can be InGaN on Sapphire Substrate based on sapphire or InGaN on SiC Substrate based on SiC, which can be Light that emits blue wavelengths; and chips of various materials and colors;

[0045] The second step 12, wire bonding: solder conductive wires 4 at appropriate positions between the light-emitting chip 3 and the connector 2;

[0046] The third step 13, semi-molding: forming a light-transmitting interlayer 5 with a predetermined thickness on the outside of the light-emitting chip 3, and the interlayer 5 can be epoxy resin...

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PUM

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Abstract

A deposition process for preparing visual-light LED includes such steps as fixing crystal, welding, semi-finishing and covering, and is featured by that when the isolating layer is in liquid state, the fluorescent mass is mixed inside the surface of isolating layer by deposition method, so uniformly dispersing the fluorescent mass at external side of LED. Its advantages include simple process, low cost and uniform quality of finished products.

Description

technical field [0001] The present invention relates to a manufacturing method of a light-emitting diode, especially a method of mixing phosphors into the surface of a light-emitting diode by a deposition method, so that the phosphors absorb the light of the light-emitting chip and emit light with a wavelength different from that of the absorbed light. The deposition and manufacturing method of visible light-emitting diodes in which the light emitted by the light-emitting chip is mixed with each other into visible light such as white, red, and green light. Background technique [0002] Light-emitting diodes are widely used due to their small size, low power consumption, and excellent shock resistance. In particular, light-emitting diodes that emit white light wavelengths have recently become a trend to replace ordinary lamps for lighting. [0003] However, the existing light-emitting diodes that can emit white light wavelengths use the characteristics of light-emitting diode...

Claims

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Application Information

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IPC IPC(8): H01L33/00H01L33/50
CPCH01L2224/8592H01L2924/181H01L2224/48091H01L2224/48247H01L2224/48257H01L2924/00014H01L2924/00012
Inventor 吴庆辉周春吉
Owner UNITY OPTO TECH CO LTD
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