Deposition method for preparing visual light LED
A technology for light-emitting diodes and a manufacturing method, which is applied in the directions of semiconductor devices, electrical components, circuits, etc., can solve the problems of time-consuming production, inability to reduce costs, and influences.
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[0043] see Figure 1 to Figure 3 , the person shown in the figure is the first embodiment selected by the present invention. The present invention provides a deposition and manufacturing method of visible light-emitting diodes. The manufacturing method includes the following steps:
[0044] The first step 11 is to fix the chip: a light-emitting chip 3 is bonded to at least one connector 2 with conductive glue. 2 is a base, and the light-emitting chip 3 can be InGaN on Sapphire Substrate based on sapphire or InGaN on SiC Substrate based on SiC, which can be Light that emits blue wavelengths; and chips of various materials and colors;
[0045] The second step 12, wire bonding: solder conductive wires 4 at appropriate positions between the light-emitting chip 3 and the connector 2;
[0046] The third step 13, semi-molding: forming a light-transmitting interlayer 5 with a predetermined thickness on the outside of the light-emitting chip 3, and the interlayer 5 can be epoxy resin...
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