MEMS packaging method

Abstract

The invention relates to an MEMS (Micro Electro Mechanical System) packaging method, which comprises the following steps of: mounting a chip group on a substrate, baking, and connecting a gold wire between the chip group and the substrate in a bonding manner; solder paste is dispensed on the copper foil on the periphery of the substrate, the packaging shell covers the solder paste on the substrate, and the solder paste is melted through reflow soldering, so that the packaging shell is welded with the substrate; the upper surface of the top face of the packaging shell is attached to an inverted mold with epoxy resin, and after heating, the epoxy resin is squeezed into the cavity of the packaging shell through the small hole and blocks the small hole; curing the product, so that the epoxy resin in the cavity and the small hole of the packaging shell is cured; laser lettering is conducted on the product according to requirements; and cutting the product into single finished products by using a cutting machine. According to the method, the purpose of plugging the small holes is achieved, meanwhile, the size of a product is not increased, the production cost of the product is not increased, and the practicability is very high.

Description

Technical field [0001] The present invention relates to a packaging method, and more particularly to a low cost MEMS package method. Background technique [0002] With the in-depth development of MEMS, MEMS's application is increasing, and the requirements for MEMS are also increasing, such as noise requirements, drift, etc. for MEMS, with the development of electronic products, for the use of MEMS devices Accuracy and so on put forward higher requirements. [0003] The detection of MEMS is achieved by micromechanical movement, and the mechanical stress affecting micromechanical has always been one of the main factors that plague MEMS performance improvement. The stress source is mainly due to different materials that are in contact with each other after the MEMS package, such as The plastic resin wrapped in the MEMS chip, the welding reflux after the cover, especially after the development of multi-chip assembled SIP, used in thin and small electronic products, the shape require...

AI Technical Summary

Problems solved by technology

Although the vacuum coating technology is very mature, there are the following defects in this type of products. One is that the coating resin has a certain thickness, usually up to 0.15mm, which increases the thickness of the product by 0.15mm; moreover, the coating resin is expensive , currently imported materials, the price of a piece of 90*90mm resin exceeds 100 yuan, which increases the cost of a single product by nearly 0.1 yuan; in addition, the lamination process also requires the addition of expensive lamination equipment, a single machine reaches 200,000 US dollars, and the finished product is depreciated The product is also not a small expense

[0006] The above results in an increase in product thickness, which limits the application of ultra-thin products required by the client and affects market promotion; the increase in product costs also affects the competitiveness of the product

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