Porous silver loaded on copper-based carrier in situ as well as preparation method and application of porous silver
A porous silver and copper-based technology, applied in the field of metal materials, can solve the problems of easy aggregation of silver nano-basic units, loss of catalyst performance, long-term synthesis process, etc., and achieve excellent SERS performance, uniform distribution, and excellent catalytic performance.
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Embodiment 1
[0050] A preparation method of porous silver supported in situ on a copper-based carrier, the preparation method is as follows:
[0051] 1) Soak the copper foil with a 50% fluoroboric acid aqueous solution at room temperature for 10 minutes to remove oxides on its surface, then wash with water and dry to obtain a pretreated copper-based carrier.
[0052] 2) Prepare 100mL of silver nitrate (20mmol / L) and 2-chlorobenzoic acid (10mmol / L) mixed solution.
[0053] 3) At 20° C., immerse 20 mg of the pretreated copper foil in 2 mL of the mixed solution for 5 minutes to react.
[0054] 4) Rinse the obtained porous silver-loaded copper foil with ethanol and deionized water in sequence, and dry to obtain the in-situ-loaded porous silver on the copper-based carrier.
[0055] The SEM image of the porous silver supported in situ on the copper-based carrier prepared in this example is as follows Figure 1-4 As shown, the porous structure exists in the form of three-dimensional openings, a...
Embodiment 2
[0057] A method for preparing porous silver supported in situ on a copper-based carrier is as described in Example 1, except that copper foil is used instead of copper foil.
[0058] The SEM morphology of the porous silver supported in situ on the copper-based carrier obtained in this example is as follows Figure 5 It can be seen from the figure that when the copper-based material is replaced by copper foam, a curled porous silver nanosheet structure with uniform distribution and high porosity can still be grown on its surface.
Embodiment 3
[0060] A method for preparing porous silver supported in situ on a copper-based carrier, as described in Example 1, except that a copper mesh is used instead of copper foil.
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