Flexible picking method of thin-shell device cover plate picking mechanism in high vacuum state

Abstract

The invention discloses a flexible picking method of a thin-shell device cover plate picking mechanism in a high vacuum state. The flexible picking method solves the problems of how to finish accurate picking of a thin-shell device cover plate in a vacuum environment and how to ensure that the cover plate is not deformed due to impact force in the putting-down process. The floating thin-shell cover plate picking die is connected to the downward output shaft of the linear motor, and the contact impact force between the picking die and the picked thin-shell cover plate is overcome through floating fit between the shaft end of the downward output shaft of the linear motor and the shaft end sleeve; a corrugated pipe sleeve is arranged at the lower end of a sealing cavity of the floating pickup die and the linear motor, so that secondary absorption of contact impact force is realized; besides, the square prismatic column guide rod is arranged between the picking die and the sealing cavity of the linear motor, so that the picking die is effectively prevented from rotating when picking the thin-shell cover plate, the picking positioning accuracy is greatly improved, and a positioning foundation is laid for follow-up processes.

Description

technical field [0001] The invention relates to a microelectronic packaging device, in particular to a mechanism for picking up a cover plate of a thin shell device in a microelectronic packaging assembly in a high vacuum chamber. Background technique [0002] Microelectronic packaging and assembly (MEMS devices), that is, using film technology and micro-processing technology to arrange, paste, fix and connect chips and other elements on the frame or substrate, lead out the connection terminals, and potting and fixing them through plastic insulating media. Then, according to the electrical schematic diagram or logic diagram, microelectronics technology and high-density assembly technology are used to assemble microelectronic devices and micro-miniature components into applicable and producible electronic components, components or a technical process of a system; currently, vacuum packaging equipment It is changing from a single machine to a multi-chamber capable of performin...

AI Technical Summary

Problems solved by technology

[0003] The invention provides a combined pick-up mechanism for the cover plate of the thin-shell device in a high-vacuum state, which solves how to accurately pick up the cover plate of the thin-shell device in a vacuum environment and ensures that the cover plate will not be affected by the impact force when it is put down. Deformed technical issues

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