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Preparation method of bismuth alloy sample for EBSD test

A technology of bismuth alloy and EDO86, which is applied in the field of preparation of bismuth alloy samples, can solve the problems of high cost, long cycle, and many sample preparation processes, and achieve the effect of improving imaging quality and high calibration rate

Pending Publication Date: 2022-03-25
泛锐云智科技(郑州)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The observation area of ​​the argon ion polished sample is at the millimeter level, and the observation area is relatively large, but the sample preparation process is many, the cycle is long, and the cost is high
[0003] Due to the different hardness and electrochemical properties of different types of bismuth alloys, it is difficult to obtain a sample surface that meets the EBSD test by traditional single methods such as mechanical, chemical, and electrolytic polishing.

Method used

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  • Preparation method of bismuth alloy sample for EBSD test
  • Preparation method of bismuth alloy sample for EBSD test
  • Preparation method of bismuth alloy sample for EBSD test

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] The preparation method of the bismuth alloy sample used in the EBSD test in this embodiment includes the bismuth alloy sample cutting, grinding, mechanical polishing, electrolytic polishing, cleaning, and drying processes. The specific process steps are as follows:

[0026] (1) The sample is made into a size of 7mm*7mm*3mm in length, width and thickness by wire cutting;

[0027] (2) Use 1500-mesh, 2000-mesh, and 3000-mesh silicon carbide water-grinding paper in turn to rough-grind, fine-grind, and fine-grind the sample;

[0028] (3) Use diamond polishing paste with a particle size of 1.5 μm and 0.5 μm to perform two polishings on the sample in sequence. The speed of the metallographic grinding and polishing machine is 500r / min and 200r / min respectively, and the polishing time is 5min and 3min respectively;

[0029] (4) Put the mechanically polished sample into the electrolytic cell for electrolytic polishing. The electrolytic conditions are: volume ratio of perchloric a...

Embodiment 2

[0034] The preparation method of the bismuth alloy sample used in the EBSD test in this embodiment includes the bismuth alloy sample cutting, grinding, mechanical polishing, electrolytic polishing, cleaning, and drying processes. The specific process steps are as follows:

[0035] (1) The sample is made into a size of 10mm*10mm*2mm in length, width and thickness by wire cutting;

[0036] (2) Use 1500-mesh, 2000-mesh, and 3000-mesh silicon carbide water-grinding paper in turn to rough-grind, fine-grind, and fine-grind the sample;

[0037] (3) Use diamond polishing paste with a particle size of 1.5 μm and 0.5 μm to perform two polishings on the sample in sequence. The speed of the metallographic grinding and polishing machine is 500r / min and 200r / min respectively, and the polishing time is 5min and 3min respectively;

[0038] (4) Put the mechanically polished sample into the electrolytic cell for electrolytic polishing. The electrolytic conditions are: volume ratio of perchloric...

Embodiment 3

[0043] The preparation method of the bismuth alloy sample used in the EBSD test in this embodiment includes the bismuth alloy sample cutting, grinding, mechanical polishing, electrolytic polishing, cleaning, and drying processes. The specific process steps are as follows:

[0044] (1) The sample is made into a size of 10mm*7mm*2mm in length, width and thickness by wire cutting;

[0045] (2) Use 1500-mesh, 2000-mesh, and 3000-mesh silicon carbide water-grinding paper in turn to rough-grind, fine-grind, and fine-grind the sample;

[0046] (3) Use diamond polishing paste with a particle size of 1.5 μm and 0.5 μm to perform two polishings on the sample in sequence. The speed of the metallographic grinding and polishing machine is 500r / min and 200r / min respectively, and the polishing time is 5min and 3min respectively;

[0047] (4) Put the mechanically polished sample into the electrolytic cell for electrolytic polishing. The electrolytic conditions are: volume ratio of perchloric ...

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Abstract

The invention provides a preparation method of a bismuth alloy sample for EBSD (electron back-scattered diffraction) test, which is characterized in that the sample preparation method comprises the working procedures of alloy sample cutting, grinding, mechanical polishing, electrolytic polishing, cleaning and drying; in the sample cutting process, the bismuth alloy is cut into samples with preset sizes; the grinding procedure comprises rough grinding, fine grinding and accurate grinding, and the surface of the sample is ground on silicon carbide abrasive paper until scratches are consistent; in the mechanical polishing process, polishing paste and ethylenediamine oleate EDO86 are adopted for polishing; in the electrolytic polishing step, a mixed solution of perchloric acid, glacial acetic acid and ethyl alcohol with the volume ratio of 1: 5: 4 is adopted as an electrolyte for polishing. When the bismuth alloy sample prepared through the method is used for EBSD testing, the calibration rate is high, and imaging is clear.

Description

technical field [0001] The invention relates to a sample preparation method, in particular to a preparation method of a bismuth alloy sample used for EBSD testing. Background technique [0002] Electron Backscatter Diffraction (EBSD) technology is an important analytical method to determine the crystal structure and orientation information in the field of material research, but the Kikuchi pattern obtained by EBSD experiment requires the sample surface to be clean and flat without strain layer. At present, the commonly used EBSD sample preparation methods are mechanical polishing, chemical polishing, electrolytic polishing, focused ion beam (FIB) polishing, argon ion polishing, etc. Mechanically polished samples have good leveling properties and high brightness, but the labor intensity is high, the sample gloss is inconsistent, and the gloss retention time is short. It is more suitable for processing simple parts, medium and small products. Chemical polishing is fast and ef...

Claims

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Application Information

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IPC IPC(8): G01N23/20008G01N23/203
CPCG01N23/20008G01N23/203G01N2223/053G01N2223/102
Inventor 史金涛方璐李法香郭杰王凯金红红李文豪雷妍王莹梁晴晴
Owner 泛锐云智科技(郑州)有限公司
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