Conductive silver paste for low-temperature sintering LTCC (Low Temperature Co-Fired Ceramic) and preparation method thereof

A technology of low-temperature sintering and conductive silver paste, which is applied in the manufacture of cables/conductors, conductive materials dispersed in non-conductive inorganic materials, circuits, etc., which can solve the problem of insufficient bonding force between the silver layer and the ceramic interface and hinder the development of electronic paste technology , device cracking and delamination, and achieve strong bonding, low shrinkage, and improved construction performance

Pending Publication Date: 2022-03-29
江苏飞特尔通信有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In recent years, the country's requirements for the localization of electronic components have become more and more urgent. Some domestic manufacturers have gradually developed their own LTCC green tapes, but the conductive silver paste market is mainly monopolized by Ferro, Dupont and other internationally renowned overseas companies. This field has not been able to obtain key technologies, the quality of the paste produced is poor, and there are few varieties. It still has not got rid of the high price and controlled situation of foreign products, which seriously hinders the development of my country's electronic paste technology.
[0004] Nowadays, LTCC ceramics are realized by doping part of low-melting point oxide or low-melting point glass. The complex system makes it difficult to match the existing traditional silver paste. There are problems such as cracking and delamination inside, so the development of a conductive silver paste that matches the LTCC green tape is of great significance to the development of the LTCC field

Method used

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  • Conductive silver paste for low-temperature sintering LTCC (Low Temperature Co-Fired Ceramic) and preparation method thereof
  • Conductive silver paste for low-temperature sintering LTCC (Low Temperature Co-Fired Ceramic) and preparation method thereof
  • Conductive silver paste for low-temperature sintering LTCC (Low Temperature Co-Fired Ceramic) and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] This embodiment provides a conductive silver paste for low temperature sintering LTCC, including the following components: spherical silver powder 75.8wt%, nano-spherical silver powder 6.2wt%, spherical glass powder 0.5wt% and organic binder 17.5wt% , the organic binder includes ethyl cellulose 20wt%, rosin 15wt% and terpineol 65wt%.

[0024] The conductive silver paste for low temperature sintering LTCC is prepared by the following method:

[0025] (1) After weighing the components in proportion, mix the components of the organic binder, and stir at 75°C for 1 hour to prepare the organic binder;

[0026] (2) After mixing the organic binder prepared in step (1) with silver powder and glass powder, heat to 55° C. and stir for 1 hour to obtain a uniform premix;

[0027] (3) Grinding and filtering the homogeneous premix to prepare conductive silver paste for low-temperature sintering LTCC.

Embodiment 2

[0029] This embodiment provides a conductive silver paste for low temperature sintering LTCC, including the following components: 78.8wt% of spherical silver powder, 6.2wt% of nano-spherical silver powder, 1wt% of spherical glass powder and 14wt% of organic binder, organic The binder includes 18wt% of ethyl cellulose, 10wt% of rosin and 72wt% of diethylene glycol butyl ether.

[0030] The conductive silver paste for low temperature sintering LTCC is prepared by the following method:

[0031] (1) After weighing the components in proportion, mix the components of the organic binder and stir for 2 hours at 85°C to prepare the organic binder;

[0032] (2) After mixing the organic binder prepared in step (1) with silver powder and glass powder, heat to 65° C. and stir for 2 hours to obtain a uniform premix;

[0033] (3) Grinding and filtering the homogeneous premix to prepare conductive silver paste for low-temperature sintering LTCC.

Embodiment 3

[0035] This embodiment provides a conductive silver paste for low temperature sintering LTCC, comprising the following components: spherical silver powder 79.5wt%, nano-spherical silver powder 8.5wt%, spherical glass powder 2wt% and organic binder 10wt%, organic The binder includes 25 wt% of ethyl cellulose, 10 wt% of rosin and 65 wt% of diethylene glycol monoethyl ether acetate.

[0036] The conductive silver paste for low temperature sintering LTCC is prepared by the following method:

[0037] (1) After weighing the components in proportion, mix the components of the organic binder, and stir at 80° C. for 1 hour to prepare the organic binder;

[0038] (2) After mixing the organic binder prepared in step (1) with silver powder and glass powder, heat to 60° C. and stir for 1 hour to obtain a uniform premix;

[0039] (3) Grinding and filtering the homogeneous premix to prepare conductive silver paste for low-temperature sintering LTCC.

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Abstract

The invention discloses conductive silver paste for low temperature sintering LTCC and a preparation method thereof, the conductive silver paste comprises the following components: 84-91 wt% of silver powder, 1-3 wt% of glass powder and 7-14 wt% of an organic binder, the silver powder comprises spherical silver powder and nanometer spherical silver powder, and the mass of the nanometer spherical silver powder is 8-12% of the mass of the spherical silver powder. The prepared conductive silver paste for low-temperature sintering of LTCC has excellent conductivity, smoothness and compactness after sintering, the effect of co-firing with ceramic is optimal, the bonding force of a silver layer and a ceramic interface is high, the phenomenon of cracking and layering in a device is avoided, and the conductive silver paste has important practical significance in development of the field of LTCC.

Description

technical field [0001] The invention belongs to the technical field of conductive paste, and in particular relates to a conductive silver paste for low-temperature sintered LTCC and a preparation method thereof. Background technique [0002] With the increasing penetration rate of 5G mobile phones and the rapid development of WiFi applications, the requirements for miniaturization, integration and modularization of components are becoming more and more urgent. Low temperature cofired ceramic technology (low temperature cofired ceramic LTCC) is a rather remarkable multidisciplinary integrated component technology that has emerged in recent years. Because of its excellent electronic, mechanical and thermal characteristics, it has become The preferred method of modularization is widely used in the fields of substrates, packaging and microwave devices. [0003] Low-temperature co-fired ceramic technology (LTCC) is a high-density integrated packaging technology, and the conducti...

Claims

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Application Information

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IPC IPC(8): H01B1/22H01B13/00
CPCH01B1/22H01B13/0036
Inventor 庄乃川陈志源王洪洋钱可伟
Owner 江苏飞特尔通信有限公司
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