Preparation method of high-sensitivity epoxy solder resist acrylic oligomer and photoresist or ink composition
A technology of acrylic oligomer and epoxy acrylic acid, which is applied in the direction of ink, photosensitive material for optomechanical equipment, applications, etc., can solve problems such as poor performance of immersion tin, difficulty in meeting the performance requirements of solder resist ink, and small molecular weight
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[0024] The present invention also provides a method for preparing a highly photosensitive epoxy solder resist acrylic oligomer, comprising the steps of:
[0025] (1) In terms of parts by mass, react 30-40 parts of solvent, 20-40 parts of epoxy resin, 2-5 parts of epoxy resin linking agent and 0.01-0.1 part of the first type of catalyst in the reactor, and the temperature is controlled 140°C-160°C, react for 4-8 hours, and when the measured epoxy equivalent is the set value, the linked epoxy resin can be obtained. In this step, it is mainly controlled by the reaction time and the epoxy equivalent weight (EEW) after crosslinking.
[0026] (2) Add 10-15 parts of acrylic acid and / or methacrylic acid, 0.5-1 part of polymerization inhibitor and 0.1-0.5 part of the second type of catalyst in the epoxy resin of the link that step (1) obtains, and the reaction temperature is 100 ℃-135℃, the acid value should be 5-8mgKOH / g, and the measured epoxy equivalent is 15000-20000 to obtain the...
Embodiment 1
[0043] The formulations of Example 1, Example 2, Comparative Example 1 and Comparative Example 2 are shown in Table 1.
[0044] Table 1
[0045]
[0046] Wherein, solvent DCAC is diethylene glycol ethyl ether acetate;
[0047] The above formulations were prepared according to the following preparation methods to prepare epoxy solder mask acrylic oligomers respectively.
[0048] (1) According to the formula in Table 1, the solvent, epoxy resin, epoxy resin crosslinking agent and the first type of catalyst are reacted in the reactor, the temperature is controlled at 150°C-155°C, and the reaction is 5-7 hours. When the epoxy equivalent is 300-400, the chain-extended epoxy resin is obtained. In this step, it is mainly controlled by the reaction time and the epoxy equivalent weight (EEW) after crosslinking.
[0049] (2) Add acrylic acid and / or methacrylic acid, polymerization inhibitor and the second catalyst in the epoxy resin of link that step (1) obtains, and reaction temp...
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