System packaging module half-hole burr processing improvement method, packaging plate and application

Abstract

The invention belongs to the technical field of SIP module board half-hole tin plating treatment, and discloses a system packaging module half-hole burr processing improvement method, a packaging board and application. A fine line half-hole module board adjusting process within 3 / mil of line width and line distance is adopted, so that half-hole walls and hole rings are protected by tinning, other positions are protected by dry films, then alkaline etching is carried out, the problem of half-hole wall flashing is solved fundamentally, the manual repairing cost of half-hole flashing is avoided, and the production efficiency is improved. And hole copper stripping caused by poor repair or higher scrapping caused by loss of poor plates to clients are avoided. According to the invention, the problem of hole wall flashing of the half hole of the 5G system packaging module board is effectively solved, and the structure is mainly a half-hole HDI product with a fine circuit on the outer layer. During alkaline etching, the hole wall and the hole ring of the half hole are protected by tin, and other positions of the plate surface are protected by a dry film, so that burrs can be effectively removed by alkaline etching, and adverse process influence on other positions is avoided.

Description

technical field [0001] The invention belongs to the technical field of SIP module board half-hole tinning treatment, and discloses a method for improving half-hole draping processing of a system packaging module, a 5G system packaging board, an information processing terminal and an application thereof. Background technique [0002] At present, according to the level design of the outer line, the mainstream technology is produced according to three processes: [0003] (1) The line width and line spacing of the outer layer are ≥3 / 3mil, and the half hole is protected by positive tin plating, and the half hole is removed and then alkaline etched; production process: pre-process (all processes from cutting to the last pressing), drilling (Laser drilling is required for blind hole design), electroplating (hole filling is required for blind holes), outer graphics, graphics, half-hole fishing, outer circuit (alkaline etching, half-hole caps are removed in this process) ), solder m...

AI Technical Summary

Problems solved by technology

[0006] Through the above analysis, the problems and defects of the existing technology are: (1) Method 1 can only be used for traditional low-end half-hole module boards, mainly for 2-4GSIP applications, with a small number of I / Os and a line width of 3 / 3mil or more; (2) Method 2 cannot remove the edge of the half-hole wall at the root; (3) Method 3 cannot solve the problem of half-hole wall dotted holes

[0007] The difficulty in solving the above problems and defects is: the SIP module board with fine lines, in order to meet the line process capability, must adopt the negative film process, but the disadvantage of the negative film process is that the half-hole wall is formed by forming, and the hole wall is electroplated with copper. It has good ductility and softness. In the process of forming half holes, there will be small copper skins on the hole walls that cannot be effectively removed. network short circuit

At present, the selected ink is used to plug the hole and cover the surface. After forming half of the hole, pass the etching line, and quickly etch to remove the burr and burr on the hole wall. However, the selective ink on the part of the hole wall is not 100% covered, and the etching will break the dotted hole.

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