Method for manufacturing segment through metallization of Ti foil diamond under assistance of ultrasonic waves
A diamond and ultrasonic technology, which is applied in the field of sintered diamond block manufacturing, can solve the problems of easy oxidation of Ti and full contact of diamond, etc., and achieve the effect of firm bonding
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Embodiment 1
[0013] Step 1. Diamond surface metallization: first spread a layer of titanium powder on the surface of the steel substrate, then place titanium foil, place diamond, then spread a layer of titanium foil and titanium powder, then place diamond, spread a layer of titanium foil and titanium powder, and then Place the diamond, and spread the last layer of titanium foil and titanium powder. Among them, the particle size of diamond abrasive grains is 120-450 microns, the purity of Ti foil and Ti powder is 99-100%, the thickness of Ti foil is 0.08mm, the particle size of Ti powder is 30-150 microns, and the thickness of Ti powder is 30-100mm. 40 microns. Then put the steel substrate, diamond and Ti powder in a closed container to evacuate first, then pass in argon gas as a protective gas, then press the ultrasonic indenter on the diamond and Ti powder, start the ultrasonic assisted vibration to make the diamond and titanium foil and titanium The powder generates friction and heats u...
Embodiment 2
[0018] Step 1. Diamond surface metallization: first spread a layer of titanium powder on the surface of the steel substrate, then place titanium foil, place diamond, then spread a layer of titanium foil and titanium powder, then place diamond, spread a layer of titanium foil and titanium powder, and then Place the diamond, and spread the last layer of titanium foil and titanium powder. Among them, the particle size of diamond abrasive grains is 120-450 microns, the purity of Ti foil and Ti powder is 99-100%, the thickness of Ti foil is 0.1mm, the particle size of Ti powder is 30-150 microns, and the thickness of Ti powder is 40-100%. 50 microns. Then put the steel substrate, diamond and Ti powder in a closed container to evacuate first, then pass in argon gas as a protective gas, then press the ultrasonic indenter on the diamond and Ti powder, start the ultrasonic assisted vibration to make the diamond and titanium foil and titanium The powder generates friction and heats up ...
Embodiment 3
[0023] Step 1. Diamond surface metallization: first spread a layer of titanium powder on the surface of the steel substrate, then place titanium foil, place diamond, then spread a layer of titanium foil and titanium powder, then place diamond, spread a layer of titanium foil and titanium powder, and then Place the diamond, and spread the last layer of titanium foil and titanium powder. Among them, the particle size of diamond abrasive grains is 120-450 microns, the purity of Ti foil and Ti powder is 99-100%, the thickness of Ti foil is 0.08mm-0.1mm, the particle size of Ti powder is 30-150 microns, and the thickness of Ti powder is At 30-40 microns. Then put the steel substrate, diamond, and Ti powder in a closed container to evacuate first, then pass in argon as a protective gas, then press the ultrasonic indenter on the diamond and Ti powder, and start the ultrasonic assisted vibration to make the diamond, titanium foil and titanium The powder generates friction and heats u...
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