Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Automatic IED chip wire welding device

A wire bonding device and chip technology, which is applied in the field of wire bonding machines, can solve problems such as inaccurate placement, sore eyes, burns, etc., and achieve the effect of uniform length, precise position, and cleanliness

Pending Publication Date: 2022-04-05
聂卫平
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In order to overcome the inaccurate placement of the LED manual welding wire, long-term observation of the welding position will cause eye soreness and eye pain, and the welding machine has the disadvantage of burning people. The technical problem to be solved: provide an automatic peeling, automatic clamping wire Automatic IED chip wire bonding device with pump and automatic wire cutting

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Automatic IED chip wire welding device
  • Automatic IED chip wire welding device
  • Automatic IED chip wire welding device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] An automatic IED chip wire bonding device, such as figure 1 , figure 2 , Figure 4 and Figure 5As shown, it includes a processing table 1, a processing frame 2, a processing guide column 3, a processing spring 4, a wire welding machine 5, a square guide rail 6B, a support frame 6A, a terminal block 601, a pay-off table 602, a transmission device, and a motor table 11 , power motor 12 and wire clamping device, processing frame 1 is fixedly connected with processing frame 2, and processing frame 2 is provided with a rectangular gap, wire welding machine 5 is slidably connected on the gap, and processing frame 2 is fixedly connected with processing guide column 3 , the processing guide post 3 is cylindrical, the processing guide post 3 is covered with a processing spring 4, the processing spring 4 provides reset force for the wire bonding machine 5, and the processing guide post 3 is slidably connected with a wire bonding machine 5, and the wire bonding machine 5 It c...

Embodiment 2

[0033] On the basis of Example 1, such as Figure 4 and Figure 7 As shown, the transmission device includes a processing rack 7, a gear cover plate 8, a pulley 9 and a processing belt 10, and a processing rack 7 is slidably connected to the support frame 6A, and the processing rack 7 is fixedly connected with the wire welding machine 5 to support The frame 6A is fixedly connected with a gear cover plate 8, and the gear cover plate 8 is rotationally connected with two symmetrical pulleys 9, the pulley 9 is wound with a processing belt 10, the surface of the processing belt 10 is toothed, and the teeth on the processing belt 10 are connected to the Processing tooth bar 7 engagements, processing tooth bar 7 can drive wire welding machine 5 to descend when processing belt 10 rotates upwards.

[0034] When the clamping device starts to move away from the wire, it will engage with the teeth on the processing belt 10, and drive the processing belt 10 to rotate upwards around the pu...

Embodiment 3

[0036] On the basis of Example 2, such as Figure 5 , Figure 6 and Figure 8 As shown, the clamping device includes a power shaft 13, a belt upper gear 14, a lower shaft 15, a belt lower gear 16, a transmission belt 17, a guide post 18 under a splint, a splint spring 19, a lower splint 20, a power gear 21, and an upper shaft 22, the power upper gear 23, the guide post 24 on the clamping plate, the upper clamping plate 25 and the clamping plate rack 2501, the power rotating shaft 13 is fixedly connected on the rotating shaft of the power motor 12, the power rotating shaft 13 is connected with the motor platform 11 in rotation, and the power rotating shaft 13 is fixed Be connected with belt upper gear 14, can drive belt upper gear 14 to rotate when power rotating shaft 13 rotates, the square guide rail 6B below is rotated and is connected with lower rotating shaft 15, is fixedly connected with belt lower gear 16 on the lower rotating shaft 15, belt upper gear 14 and The belt ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to a wire welding machine, in particular to an automatic IED chip wire welding device. The technical problem to be solved is to provide the automatic IED chip wire welding device which is capable of automatically peeling, automatically clamping a wire pump and automatically cutting wires. According to the technical scheme, the automatic IED chip wire welding device comprises a machining table, a machining frame, machining guide columns, machining springs, a square guide rail, a supporting frame, a wiring table, a pay-off table, a transmission device, a motor table, a wire welding machine and the like. A machining frame is fixedly connected to the machining table, a machining guide column is fixedly connected to the machining frame, a machining spring is sleeved on the machining guide column, a wire welding machine is slidably connected to the machining guide column, and the two ends of the machining spring are fixedly connected with the wire welding machine and the machining frame respectively. According to the invention, through the peeling device, a wire with a skin can be automatically peeled, and the removed skin can be brought into a waste barrel, so that the situation that the wire skin needs to be manually cleaned when falling to the ground is avoided.

Description

technical field [0001] The invention relates to a wire bonding machine, in particular to an automatic IED chip wire bonding device. Background technique [0002] The LED lamp is an electroluminescent semiconductor material chip, which is cured on the bracket with silver glue or white glue, and then connected to the chip and the circuit board with silver or gold wires, and sealed with epoxy resin around it to protect the inner core wire. Function, the shell is finally installed, so the shock resistance of the LED lamp is good. [0003] When welding LED light wires, people need to pick up the wires by hand. The wires to be welded must be cut and peeled in advance, and then placed at the position to be welded, and then start the switch of the wire welding machine , Lower the wire welding machine to weld the wires. The position is not uniform when placed manually. It is necessary to confirm the placement position with eyes. The speed of manual welding can only be improved accor...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): B23K37/00B21F11/00B23P23/04H02G1/12
Inventor 聂卫平
Owner 聂卫平
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products