Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Ink-jet printing microstructure transduction element and preparation method thereof

A technology of inkjet printing and energy conversion element, which is applied in the direction of offensive equipment, additive manufacturing, fuze, etc., can solve the problems of low material utilization rate, long time consumption, complicated process, etc., and achieves convenient control of bridge film thickness and simple and efficient preparation method , the effect of high degree of integration

Pending Publication Date: 2022-04-05
NANJING UNIV OF SCI & TECH
View PDF6 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Thin film deposition and transducer forming are divided into two steps, which are time-consuming, costly, low material utilization and complicated process, and the industrial wastewater generated during the process also increases the burden on the environment

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Ink-jet printing microstructure transduction element and preparation method thereof
  • Ink-jet printing microstructure transduction element and preparation method thereof
  • Ink-jet printing microstructure transduction element and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] Inkjet printing to prepare silver film bridge transducers, figure 1 Schematic diagram of the structure of the silver membrane bridge, figure 2 Print patterns for silver film transducers, image 3 It is the physical picture of the silver film bridge and the picture under the microscope of the bridge area. It can be seen from the figure that the surface of the silver film bridge prepared by inkjet printing is uniform, and the pattern formation is in good condition.

[0033] In order to obtain a 1Ω silver film bridge, the number of printing layers is set to 2 layers, and the aspect ratio of the pattern in the bridge area is 1:1.2. The preparation of the silver film transducer element comprises the following steps:

[0034] Step 1: Sonicate the silicon dioxide wafer in deionized water and ethanol liquid for 15 minutes, take it out and dry it;

[0035] Step 2: Put the silicon dioxide wafer into the UV cleaning machine for 15 minutes for surface treatment;

[0036] Step ...

Embodiment 2

[0040] Such as Figure 4 As shown, the printing pattern of the transducer element is a double V shape. In order to design a 0.8Ω silver film bridge, the number of printing layers is set to 2 layers, and the aspect ratio of the pattern in the bridge area is 2:1. The preparation of the silver film transducer element comprises the following steps:

[0041] Step 1: Sonicate the silicon dioxide wafer in deionized water and ethanol liquid for 15 minutes, take it out and dry it;

[0042] Step 2: Put the silicon dioxide wafer into the UV cleaning machine for 15 minutes for surface treatment;

[0043] Step 3: Add nano-silver ink to the printer cartridge, fix the silicon dioxide wafer on the printer substrate, set the heating temperature of the substrate to 55°C, set the inkjet spacing to 25μm, set the temperature of the nozzle to 35°C, and the piezoelectric waveform to be a double wave. The piezoelectric voltage is set at 20V, the number of printing layers is 2 layers, the printing i...

Embodiment 3

[0047] Such as Figure 5 As shown, the printing pattern of the transducer element is "I" font. In order to design a 0.8Ω silver film bridge, the number of printing layers is set to 1 layer, and the aspect ratio of the pattern in the bridge area is 2:1. The preparation of the silver film transducer element comprises the following steps:

[0048] Step 1: Sonicate the silicon dioxide wafer in deionized water and ethanol liquid for 15 minutes, take it out and dry it;

[0049] Step 2: Put the silicon dioxide wafer into the UV cleaning machine for 15 minutes for surface treatment;

[0050] Step 3: Add nano-silver ink to the printer cartridge, fix the silicon dioxide wafer on the printer substrate, set the heating temperature of the substrate to 55°C, set the inkjet spacing to 25μm, set the temperature of the nozzle to 35°C, and the piezoelectric waveform to be a double wave. The piezoelectric voltage is set at 20V, the number of printing layers is 2, and the pre-curing time is 30 ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
electrical resistivityaaaaaaaaaa
thicknessaaaaaaaaaa
sizeaaaaaaaaaa
Login to View More

Abstract

The invention discloses an ink-jet printing microstructure transduction element and a preparation method thereof.According to the method, conductive ink is deposited on a substrate material according to a designed transduction element pattern through ink-jet printing, and the microstructure transduction element can be obtained through sintering. Material deposition, shape control and one-time forming of the transduction element can be achieved at the same time, and the method has the advantages of high efficiency, low cost and high material utilization rate.

Description

technical field [0001] The invention belongs to the field of pyrotechnic ignition devices, and relates to an inkjet printing microstructure transducer element and a preparation method thereof. Background technique [0002] The rapid development of national defense technology in recent years has led to the technological innovation of contemporary weapon systems. Conventional weapons and equipment have changed to high-tech weapons and equipment. The volume of weapon systems has changed to miniaturization. Miniaturization and intelligence put forward higher requirements, so the pyrotechnic system is also developing continuously. At present, my country has developed to the fourth generation of pyrotechnics: MEMS pyrotechnics. A typical MEMS pyrotechnic device consists of three parts: a micro-structure transducer, a micro-energy chip, and a micro-security mechanism (micro-security chip), which together form a micro-initiation sequence or a micro-ignition sequence. [0003] For ME...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): F42C19/12B22F5/00B22F10/10B22F10/20B22F12/53B33Y10/00B33Y30/00B33Y80/00
Inventor 朱顺官李林易镇鑫张琳李燕
Owner NANJING UNIV OF SCI & TECH
Features
  • Generate Ideas
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com