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Manufacturing method of multilayer board with ultra-low copper residual semi-conducting through hole

A manufacturing method and multi-layer board technology are applied in multi-layer circuit manufacturing, superimposed layer plating, chemical/electrolytic method to remove conductive materials, etc., which can solve problems that cannot meet high-frequency circuits and achieve good results. Increased space for outer layer wiring and good airtightness

Pending Publication Date: 2022-04-08
JIANGSU PROVISION ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] With the continuous promotion of the information industry, the speed of digital signal transmission is getting faster and higher, and the frequency is getting higher and higher. The traditional design can no longer meet the needs of this high-frequency circuit.

Method used

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  • Manufacturing method of multilayer board with ultra-low copper residual semi-conducting through hole
  • Manufacturing method of multilayer board with ultra-low copper residual semi-conducting through hole
  • Manufacturing method of multilayer board with ultra-low copper residual semi-conducting through hole

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0069] Example: such as Figure 1-13 Shown, a kind of manufacturing method with ultra-low copper residual semiconducting hole multilayer board, comprises the following steps:

[0070] Step 1: Cutting and baking: cutting several substrates of a certain size, putting them in an oven for baking, the substrate 10 is a double-sided copper-clad substrate, and the double-sided copper-clad substrate has an inner insulating layer 11 and Two copper foil layers are respectively pressed on the front and back sides of the inner insulating layer; the purpose of cutting is to facilitate subsequent equipment processing; the baking conditions are: temperature 122-148 ℃, baking time 2-4h ; The substrate is baked to eliminate the stress of the substrate, prevent the substrate from warping, improve the dimensional stability of the substrate, and reduce the expansion and contraction of the substrate; It is a four-layer board, but in practical applications, six-layer boards, eight-layer boards, et...

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PUM

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Abstract

The invention relates to a manufacturing method of a multilayer board with ultra-low copper residual semi-conducting through holes. Comprising the following steps of cutting and baking, inner-layer circuit forming, pressing, outer-layer drilling, copper deposition and electroplating, first-time resin hole plugging and grinding, second-time target drilling, deep drilling, first-time copper residue removing, second-time copper residue removing, second-time resin hole plugging and grinding, copper deposition returning, outer-layer circuit forming, solder resisting and nickel gold electroplating. According to the method, the special etching liquid medicine is utilized to carry out two times of copper residue removal treatment on the blind hole, so that the manufactured semi-conducting through hole of the multilayer board has ultra-low copper residue, and the requirement of a high-frequency circuit product is met.

Description

technical field [0001] The invention relates to the manufacture of multilayer boards, in particular to a method for manufacturing multilayer boards with ultra-low copper residue semi-conducting holes. Background technique [0002] With the continuous promotion of the information industry, the speed of digital signal transmission is getting faster and higher, and the frequency is getting higher and higher. The traditional design can no longer meet the needs of this high-frequency circuit. The research on signal integrity transmission has become an increasingly critical and important core technology. When the frequency of the circuit signal increases to a certain height, the useless copper residue in the via hole is equivalent to the antenna, generating signal radiation to other surrounding The interference caused by the signal will affect the normal operation of the line system in severe cases. Therefore, the demand for reducing the copper residue in the hole is becoming more...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00H05K3/06H05K3/22H05K3/46C23C28/02C25D5/12C25D7/00
Inventor 马洪伟姜寿福
Owner JIANGSU PROVISION ELECTRONICS CO LTD
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