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Laser spot splicing method and laser equipment

A laser spot and laser equipment technology, applied in laser welding equipment, welding equipment, metal processing equipment and other directions, can solve the problems of not meeting the uniformity requirements of the focused spot energy distribution and the deterioration of the beam quality, so as to improve the processing efficiency and Process quality, avoid energy loss, reduce energy consumption

Pending Publication Date: 2022-04-12
安阳睿恒数控机床股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

To further increase the cladding width, a higher power laser is required. The particularity of the semiconductor laser stack structure determines that increasing the output power of the laser will result in a deterioration of the beam quality, which cannot achieve the energy distribution of the focused spot in the laser surface modification process. uniformity requirements

Method used

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  • Laser spot splicing method and laser equipment
  • Laser spot splicing method and laser equipment
  • Laser spot splicing method and laser equipment

Examples

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Effect test

Embodiment approach 1

[0055] Take six groups of laserline10000w semiconductor laser fiber transmission laser head spot splicing as an example, the head diameter is 70mm, the collimated beam diameter is 35.64mm, the focal length is f=500mm, and the focused rectangular spot size is 28*3mm. Head position press figure 1 Arrangement shown. The rectangular frame in the figure indicates the installation platform, and the circles marked ①, ②, ③, ④, ⑤, and ⑥ with a diameter of 80 mm respectively indicate the positions of the 6 groups of optical heads on the installation surface. The small circles in the big circle indicate the focusing mirror of the optical head, and H indicates the focus Beams (only two groups of focused beams are drawn, the rest are omitted), D represents the rectangular spot of the focused beam at the focal plane and is labeled 1, 2, 3, 4, 5, 6, corresponding to the 6 optical heads respectively, forming L* 3mm mosaic spot, L=28*6=168mm. The optical heads ② and ⑤ at the middle line are ...

Embodiment approach 2

[0057] 2 sets of laserlineOTS-5 semiconductor optical fiber transmission laser head line-shaped spot splicing, focal length f=500mm, line-shaped light spot 135*1.0mm. Head position press image 3 Arrangement shown. The rectangular frame in the figure represents the installation platform, and the circles labeled ① and ② respectively represent the positions of the two groups of optical heads on the installation platform, the small circle in the big circle represents the focusing mirror of the optical head, H represents the focused beam, and D represents the focused beam at the focal plane Rectangular spot and labeled 1, 2 correspond to the bald heads at ① and ② respectively, forming a 135*2.0mm spliced ​​spot.

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Abstract

The invention relates to the technical field of laser processing, in particular to a laser spot splicing method and laser equipment. The laser spot splicing method comprises the following steps: projecting light spots output by light heads connected with a plurality of lasers on a focal plane, and adjusting the positions and / or optical axis angles of the light heads to splice a plurality of light spots. Through combined use of a plurality of existing optical heads, light spots are spliced, and the requirements of large power and large light spots of large-area laser surface modification treatment on laser are met under the condition of not increasing an internal cooling system and a protection level of an optical head lens group; energy loss caused by multi-channel scanning lap joint in single-light-head large-area laser surface modification treatment is avoided, energy consumption is reduced, and machining efficiency and machining quality are improved. And in the large-area laser surface modification treatment, one-time completion can be achieved, and lap joint is avoided.

Description

technical field [0001] The invention relates to the technical field of laser processing, in particular to a laser spot splicing method and laser equipment. Background technique [0002] At present, 10,000-watt high-power lasers have been widely used in laser surface modification (including laser glazing, laser remelting, laser quenching, laser alloying, laser coating, etc.). Taking laser cladding as an example, laserline semiconductor 10,000-watt Laser, optical fiber transmission, focusing spot is 28*3mm, can carry out 28mm wide ribbon laser cladding. To further increase the cladding width, a higher power laser is required. The particularity of the semiconductor laser stack structure determines that increasing the output power of the laser will result in a deterioration of the beam quality, which cannot achieve the energy distribution of the focused spot in the laser surface modification process. uniformity requirements. In addition, the high-power laser output has higher ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/352B23K26/70
Inventor 杜建伟王阳阳
Owner 安阳睿恒数控机床股份有限公司