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Circuit board laser cutting machine capable of slowly falling finished products

A laser cutting machine, circuit board technology, applied in laser welding equipment, welding equipment, metal processing equipment, etc., can solve the problems of harmful gas pollution, circuit boards bumping against each other, and low circuit board yield, etc., to avoid damage. , reduce vibration, improve efficiency and the effect of cutting accuracy

Inactive Publication Date: 2022-04-12
徐州赛福电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Due to the rapid development of the current society, the integration of electronic components on the circuit board is getting higher and higher. The traditional cutting method is easy to cause damage to the electronic components, resulting in a low yield rate of the circuit board. Therefore, laser cutting is usually used for precision circuit boards. Cutting, but the circuit boards will collide with each other during the falling process, causing the package to be damaged, and at the same time, harmful gases will be produced to pollute the environment

Method used

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  • Circuit board laser cutting machine capable of slowly falling finished products
  • Circuit board laser cutting machine capable of slowly falling finished products
  • Circuit board laser cutting machine capable of slowly falling finished products

Examples

Experimental program
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Embodiment 1

[0045] see Figure 1-Figure 6 , a circuit board laser cutting machine whose finished product is slowly falling, including a main body 1 and a working cabin 101 opened at the upper end, the lower end of the main body 1 is provided with a ventilation pipe 6, a cutting assembly 2 is arranged inside the working cabin 101, and the cutting assembly 2 includes a sliding rod 21 and the cutting head 22 slidably connected to the sliding rod 21. A pair of fixing frames 3 are arranged inside the working cabin 101. The fixing frame 3 includes a cross bar 32 and a vertical bar 31 fixedly connected to the left and right ends thereof. The opposite sides of the cross bar 32 are provided with The displacement groove 321, the electric clamping block 33 is slid inside the cross bar 32, the bottom end of the cross bar 32 is provided with a material bearing bar, the inside of the working cabin 101 and located in the middle of the pair of fixing frames 3 is provided with a buffer suction component 4,...

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PUM

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Abstract

The invention discloses a circuit board laser cutting machine capable of slowly falling finished products, and belongs to the technical field of laser cutting. According to the scheme, suction holes are formed in scattering strips, suction force is generated in cooperation with an air pump, and smoke dust generated in the working process of the laser cutting machine is discharged into an air processor through a ventilation pipe; a large number of suction holes effectively reduce harm to workers caused by the fact that smoke is diffused to the external environment, meanwhile, the slow descending strip is tightened along with air through suction force of the suction holes, and in the falling process of finished circuit boards, the finished circuit boards pass through the tightened slow descending strip and then slowly slide into the electric conveying belt along with the slow descending strip, so that the finished circuit boards are prevented from falling off. The falling impact force of the finished circuit board is effectively reduced, the yield of the finished circuit board is improved, the slow descending strip is easy to tighten in cooperation with attraction of the electromagnet to the magnetic strip, the buffering effect on the finished circuit board is improved, and the practicability is improved.

Description

technical field [0001] The invention relates to the technical field of laser cutting, and more particularly, to a circuit board laser cutting machine whose finished product is slowly falling. Background technique [0002] The laser cutting machine is to focus the laser light emitted from the laser into a high power density laser beam through the optical path system. The laser beam is irradiated on the surface of the workpiece to make the workpiece reach the melting point or boiling point. At the same time, the high-pressure gas coaxial with the beam will blow away the molten or vaporized metal. purpose of cutting. [0003] Due to the rapid development of the current society, the integration of electronic components on the circuit board is getting higher and higher. The traditional cutting method is easy to cause damage to the electronic components, resulting in a low yield rate of the circuit board. Therefore, lasers are usually used for precision circuit boards. Cutting, ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/38B23K26/142B23K26/70
Inventor 高宏国高洪福
Owner 徐州赛福电子有限公司
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