Unlock instant, AI-driven research and patent intelligence for your innovation.

Polyimide glue solution with passivation stability control force and high insulation and thermal conductivity for chip passivation layer and preparation method of polyimide glue solution

A technology of polyimide glue and polyimide glue is applied in the direction of adhesives, semiconductor devices, polymer adhesive additives, etc., which can solve the problem that polyimide coatings cannot have good thermal conductivity and adhesion Performance passivation and stable control force, inability to achieve low hygrothermal cyclic stress, etc., to achieve the effect of realizing hygrothermal cyclic stress, excellent and stable passivation control force, and low hygrothermal cyclic stress

Pending Publication Date: 2022-04-15
上海贤思齐半导体材料有限公司
View PDF5 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] The present invention aims to solve the problem that the existing polyimide coating used as a passivation layer cannot simultaneously have good thermal conductivity, bonding performance, stable passivation and stable control force, and cannot achieve low humidity and heat cycle stress. Polyimide glue with stable passivation control and high insulation and thermal conductivity for chip passivation layer and preparation method

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Polyimide glue solution with passivation stability control force and high insulation and thermal conductivity for chip passivation layer and preparation method of polyimide glue solution
  • Polyimide glue solution with passivation stability control force and high insulation and thermal conductivity for chip passivation layer and preparation method of polyimide glue solution
  • Polyimide glue solution with passivation stability control force and high insulation and thermal conductivity for chip passivation layer and preparation method of polyimide glue solution

Examples

Experimental program
Comparison scheme
Effect test

specific Embodiment approach 1

[0029] Specific embodiment one: the polyimide glue liquid that this embodiment is used for the chip passivation layer has passivation stable control force and high insulation thermal conductivity, and it is made up of 100 parts of polyimide solution, 15 parts by mass parts by mass. Prepared from 1-30 parts of micron boron nitride / nanocellulose composite and 0.1-2 parts of interface coupling agent;

[0030] The structural formula of polyimide in described polyimide solution is:

[0031] The n is 4-20;

[0032] Described Ar is:

[0033] The beneficial effects of this specific embodiment are: this specific embodiment provides a polyimide glue solution for chip passivation layer with stable passivation control force and high insulation and thermal conductivity. The polyimide coating formed by using the glue prepared in this specific embodiment realizes the buffering effect on the damp heat cycle stress through the stable control force, can effectively reduce pinholes or cr...

specific Embodiment approach 2

[0039] Embodiment 2: The difference between this embodiment and Embodiment 1 is that the micron boron nitride / nanocellulose composite is specifically prepared according to the following steps:

[0040] Weigh 10 to 20 parts of micron boron nitride, 5 to 10 parts of nanocellulose, 1 to 3 parts of aluminum isopropoxide and 3 to 10 parts of NaHCO in parts by mass 3 , the weighed nanocellulose is prepared into a nanocellulose dispersion, and then the weighed micron boron nitride and aluminum isopropoxide are sequentially added to the nanocellulose dispersion, under the condition that the stirring speed is 100rpm-300rpm , stirred for 2h to 4h, then added the weighed NaHCO 3 , under the condition that the stirring speed is 100rpm-300rpm, continue stirring for 1h-3h, and finally dry to obtain the micron boron nitride / nanocellulose composite. Others are the same as in the first embodiment.

[0041] In this specific embodiment, micron boron nitride and nanocellulose are modified to fo...

specific Embodiment approach 3

[0043] Embodiment 3: This embodiment differs from Embodiment 1 or Embodiment 2 in that: the micron boron nitride is flake-shaped, with an average particle size of 1 μm to 5 μm; the average diameter of the nanocellulose is 10 nm ~50nm, with an average length of 200nm~300nm. Others are the same as in the first or second embodiment.

[0044] The average diameter of the nanocellulose described in this specific embodiment needs to meet the requirement of dispersion uniformity.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
particle sizeaaaaaaaaaa
diameteraaaaaaaaaa
lengthaaaaaaaaaa
Login to View More

Abstract

The invention relates to a polyimide glue solution and a preparation method, in particular to a polyimide glue solution with passivation stability control force and high insulation and thermal conductivity for a chip passivation layer and a preparation method. The problems that an existing polyimide coating serving as a passivation layer cannot have good heat conduction performance, adhesive performance, stable passivation and stable control force at the same time, and low damp-heat cyclic stress cannot be achieved are solved. The polyimide glue solution is prepared from a polyimide solution, a micron boron nitride / nano cellulose compound and an interface coupling agent; the preparation method comprises the following steps: 1, preparing a polyimide solution; and 2, mixing.

Description

technical field [0001] The invention relates to polyimide glue and a preparation method. Background technique [0002] With the continuous development of my country's economic development level and scientific and technological level, people's lives have become more and more convenient as the coverage of Internet information technology has become wider and wider. People's daily life has become inseparable from electronic devices. Every kind of equipment will use electronic integrated circuits, which are composed of electronic components, and have the characteristics of strong functionality and high sensitivity, and are widely used in various fields. With the development of science and technology, higher requirements are put forward for electronic circuits, and the demand for new electronic materials with better performance is increasing, such as higher signal transmission efficiency and excellent electrical and thermal conductivity. At present, the application of new materia...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): C09J179/08C09J11/08C09J11/04H01L23/29
CPCC09J179/08C09J11/08C09J11/04H01L23/293C08L2203/206C08L2201/08C08K2003/385C08L1/02C08K3/38
Inventor 于云武周聪波王成铭
Owner 上海贤思齐半导体材料有限公司